Publication of the Final Figures for the Fiscal Year 2013
(DGAP-Media / 28.03.2014 / 07:11)
PRESS RELEASE
Publication of the Final Figures for the Fiscal Year 2013
- Full year sales with EUR 134.5 million at upper end of guidance
- Full year EBIT better than expected: EUR minus 19.4 million
- Sales of EUR 40.5 million in Q4
- Order Intake of EUR 29.1 million in Q4
- Strong Free Cash Flow in Q4 reaches EUR 14.0 million
Garching, March 28, 2014 - SUSS MicroTec AG, a leading supplier of
equipment and process solutions for the semiconductor industry and related
markets, published its consolidated financial statements for the 2013
fiscal year today.
While the semiconductor industry posted record sales in 2013 the
semiconductor equipment market contracted a second consecutive year. The
challenging market environment is reflected in the business development and
the key financial indicators of SUSS MicroTec. Order entry decreased by
14.1 % year-on-year to EUR 135.0 million (previous year: EUR 157.2
million). Sales of EUR 134.5 million were achieved, falling short of the
previous year's level of EUR 163.8 million by 17.9 %. Thus order backlog
stood at EUR 85.7 million at December 31, 2013 (December 31, 2012: EUR 86.5
million).
The gross margin declined from 35.0 % to 16.2 % in 2013. The reasons are a
less favorable product mix between 200 mm and 300 mm tools in the
Lithography segment as well as the low margin contribution of SUSS MicroTec
Photonic Systems (Tamarack Scientific). In the Substrate Bonder segment
the Company has restructured the product line permanent bonding: In the
future the Company will cease selling permanent bond cluster systems, which
have been loss making over the last years.
The group's core division - Lithography - posted a 22 % decrease in sales
to EUR 88.3 million during the year under review (previous year: EUR 113.2
million). The Substrate Bonder division decreased its revenues from EUR
23.1 million to EUR 22.8 million, which is a decline of 1.3 %. The
Photomask Equipment division contributed sales of EUR 18.4 million
(previous year: EUR 22.9 million).
Earnings before interest and tax (EBIT) came in at EUR minus 19.4 million
(previous year: EUR 11.7 million), which translates into an EBIT-margin of
minus 14.4 %. The EBIT for 2013 includes a one off effect of EUR minus 13.2
million for the measures taken in the Substrate Bonder Division. The
adjusted EBIT amounts to EUR minus 6.2 million.
Earnings after taxes (EAT) for continuing operations amounted to EUR minus
16.0 million, compared to EUR 7.6 million in the previous year. Earnings
- Order Intake of EUR 29.1 million in Q4
- Strong Free Cash Flow in Q4 reaches EUR 14.0 million
Garching, March 28, 2014 - SUSS MicroTec AG, a leading supplier of
equipment and process solutions for the semiconductor industry and related
markets, published its consolidated financial statements for the 2013
fiscal year today.
While the semiconductor industry posted record sales in 2013 the
semiconductor equipment market contracted a second consecutive year. The
challenging market environment is reflected in the business development and
the key financial indicators of SUSS MicroTec. Order entry decreased by
14.1 % year-on-year to EUR 135.0 million (previous year: EUR 157.2
million). Sales of EUR 134.5 million were achieved, falling short of the
previous year's level of EUR 163.8 million by 17.9 %. Thus order backlog
stood at EUR 85.7 million at December 31, 2013 (December 31, 2012: EUR 86.5
million).
The gross margin declined from 35.0 % to 16.2 % in 2013. The reasons are a
less favorable product mix between 200 mm and 300 mm tools in the
Lithography segment as well as the low margin contribution of SUSS MicroTec
Photonic Systems (Tamarack Scientific). In the Substrate Bonder segment
the Company has restructured the product line permanent bonding: In the
future the Company will cease selling permanent bond cluster systems, which
have been loss making over the last years.
The group's core division - Lithography - posted a 22 % decrease in sales
to EUR 88.3 million during the year under review (previous year: EUR 113.2
million). The Substrate Bonder division decreased its revenues from EUR
23.1 million to EUR 22.8 million, which is a decline of 1.3 %. The
Photomask Equipment division contributed sales of EUR 18.4 million
(previous year: EUR 22.9 million).
Earnings before interest and tax (EBIT) came in at EUR minus 19.4 million
(previous year: EUR 11.7 million), which translates into an EBIT-margin of
minus 14.4 %. The EBIT for 2013 includes a one off effect of EUR minus 13.2
million for the measures taken in the Substrate Bonder Division. The
adjusted EBIT amounts to EUR minus 6.2 million.
Earnings after taxes (EAT) for continuing operations amounted to EUR minus
16.0 million, compared to EUR 7.6 million in the previous year. Earnings
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