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     333  0 Kommentare Cascade Microtech Expands Power Device Characterization Solution to Meet Ultra High-Voltage/High-Current Requirements

    BEAVERTON, OR--(Marketwired - May 20, 2014) - Cascade Microtech, Inc. (NASDAQ: CSCD), a leading supplier of solutions that enable precision measurements of integrated circuits at the wafer level, today announced new additions to round out its power device test and measurement solutions from the engineering lab through production volume. The Ultra High-Power (UHP) probe, coupled with the expansion of thermal chuck capabilities, now supports testing at both high current and high voltage with one contact.

    Power semiconductors are becoming increasingly important in efficient power generation and distribution. Power semiconductor devices are manufactured using traditional Silicon and wide band gap materials such as Silicon Carbide (SiC) and Gallium Nitride (GaN). Power devices such as Insulated Gate Bipolar Transistors (IGBT) are increasingly becoming the device of choice in this market. With an easily driven Metal Oxide Semiconductor (MOS) gate and low conduction loss, IGBT devices are displacing Bipolar Junction Transistors (BJT) for high-voltage and high-current applications. The industry trend also points to replacing MOSFET devices with IGBTs except in very low current applications, and the IGBT market is expected to grow to $6 billion by 2018 (Yole Developpement, IGBT Markets and Applications Trends, 6/10/2013).

    Power Market Driving New Requirements for Test and Measurement
    Recent developments in semiconductor technology allow devices to operate at higher voltages and handle higher currents. To fully characterize these devices, manufacturers will need to test efficiently under extreme conditions. The industry is driving new test and measurement capabilities, such as the ability to switch between states and characterize the device in both high-current and high-voltage modes. Previous test and measurement limitations led to multiple touchdowns, resulting in pad damage and errors that reduced throughput. Cascade Microtech's new Ultra High-Power (UHP) probe is the first of its kind to easily alternate between high-current and high-voltage setups, answering these emerging needs. With the UHP probe, only a single touchdown is needed, decreasing test setup time, reducing risk of errors, minimizing device pad damage and extending probe life.

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    Cascade Microtech Expands Power Device Characterization Solution to Meet Ultra High-Voltage/High-Current Requirements BEAVERTON, OR--(Marketwired - May 20, 2014) - Cascade Microtech, Inc. (NASDAQ: CSCD), a leading supplier of solutions that enable precision measurements of integrated circuits at the wafer level, today announced new additions to round out its power …