SUSS MicroTec Launches SB6/8 Gen2

A Next-Generation Semi-Automated Permanent Wafer Bonder

(DGAP-Media / 07.10.2014 / 08:00)

SUSS MicroTec Launches SB6/8 Gen2: A Next-Generation Semi-Automated
Permanent Wafer Bonder

Garching, October 7, 2014 - SUSS MicroTec, a leading supplier of equipment
and process solutions for the semiconductor and related markets, has
launched the SB6/8 Gen2 Wafer Bonder today. The semi-automated SB6/8 Gen2
is SUSS MicroTec's state of the art universal permanent wafer bonding
system that handles wafers up to 200 mm and supports various substrate
types and sizes.

The tool allows for fully manual processing in research and development
applications while at the same time providing the opportunity of an easy
switch to volume production. It supports low force for adhesive bonding as
well as high force for thermo compression or eutectic bonding and offers
various chamber pressure conditions from vacuum to over pressure.
Flexible tooling allows for adapting to different requirements in the
semiconductor industry. Major applications are in MEMS and LED packaging
and production as well as 3D stacking.

The second tool generation provides an advanced heater and force control
system as well as improved cooling rates. These new features lead to a more
precise control of the bonding processes.

About SUSS MicroTec
SUSS MicroTec is a leading supplier of equipment and process solutions for
microstructuring in the semiconductor industry and related markets. In
close cooperation with research institutes and industry partners SUSS
MicroTec contributes to the advancement of next-generation technologies
such as 3D Integration and nanoimprint lithography as well as key processes
for MEMS and LED manufacturing. With a global infrastructure for
applications and service SUSS MicroTec supports more than 8.000 installed
systems worldwide. SUSS MicroTec is headquartered in Garching near Munich,
Germany. For more information, please visit: www.suss.com




Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: [phone]
Fax: [phone]
Email: [e-mail]


End of Media Release

---------------------------------------------------------------------

Issuer: SÜSS MicroTec AG
Key word(s): Research/Technology

07.10.2014 Dissemination of a Press Release, transmitted by DGAP - a
service of EQS Group AG.
The issuer is solely responsible for the content of this announcement.

The DGAP Distribution Services include Regulatory Announcements,
Financial/Corporate News and Press Releases.
Media archive at www.dgap-medientreff.de and www.dgap.de

---------------------------------------------------------------------


Language: English
Company: SÜSS MicroTec AG
Schleissheimer Strasse 90
85748 Garching
Germany
Phone: [phone]
Fax: [phone]
E-mail: [e-mail]
Internet: www.suss.com
ISIN: DE000A1K0235
WKN: A1K023
Listed: Regulierter Markt in Frankfurt (Prime Standard);
Freiverkehr in Berlin, Düsseldorf, Hamburg, München,
Stuttgart


End of News DGAP-Media
---------------------------------------------------------------------
290328 07.10.2014