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     818  0 Kommentare SUSS MicroTec announces new Mask Aligner series MA/BA Gen4

    DGAP-Media / 30.06.2016 / 10:00


    SUSS MicroTec announces new Mask Aligner series MA/BA Gen4

    Garching, June 30, 2016 - SUSS MicroTec, a leading supplier of equipment
    and process solutions for the semiconductor industry and related markets,
    announced the launch of the MA/BA Gen4 series today. The new generation of
    SUSS MicroTec's semi-automated Mask and Bond Aligners extends its
    capabilities by major improvements in alignment accuracy, ergonomic design
    and further reduced cost of ownership. With the launch of the fourth
    generation, SUSS MicroTec introduces a new platform system. The two
    platform types are configured differently and consist of the MA/BA Gen4 for
    standard processes and the MA/BA Gen4 Pro series for advanced high-end
    processes. By moving to this new platform concept, SUSS MicroTec further
    optimizes the Mask Aligner product portfolio to better align with customer
    requirements.

    Main application of SUSS MicroTec's MA/BA Gen4 series is full-field
    lithography in Academia, MEMS, 3D Integration and the Compound
    Semiconductor market. It furthermore handles processes like bond alignment,
    fusion bonding and SMILE imprint. In addition to standard wafer processing
    the MA/BA Gen4 series reliably processes delicate substrates, such as
    fragile, warped or uneven surfaced wafers.

    "Our new manual Mask Aligner series sets a high benchmark regarding cost
    efficiency, user friendliness and leading edge process results" said Dr.
    Per-Ove Hansson, CEO SUSS MicroTec. "With this new platform concept, we
    further align with different customer requirements - the MA/BA Gen4 for
    standard lithography processes or the leading edge MA/BA Gen4 Pro for
    small-series production and more demanding solutions, e.g. our Soft
    Conformal Imprint Lithography (SCIL) solution."

    About SUSS MicroTec
    SUSS MicroTec is a leading supplier of equipment and process solutions for
    microstructuring in the semiconductor industry and related markets. In
    close cooperation with research institutes and industry partners SUSS
    MicroTec contributes to the advancement of next-generation technologies
    such as 3D Integration and nanoimprint lithography as well as key processes
    for MEMS and LED manufacturing. With a global infrastructure for
    applications and service SUSS MicroTec supports more than 8.000 installed
    systems worldwide. SUSS MicroTec is headquartered in Garching near Munich,
    Germany. For more information, please visit www.suss.com




    Contact:
    SUSS MicroTec AG
    Franka Schielke
    Schleissheimer Strasse 90
    85748 Garching, Deutschland
    Tel.: +49 (0)89 32007-161
    Fax: +49 (0)89 32007-451
    Email: franka.schielke@suss.com


    End of Media Release

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    Issuer: SÜSS MicroTec AG
    Key word(s): Research/Technology

    30.06.2016 Dissemination of a Press Release, transmitted by DGAP - a service
    of EQS Group AG.
    The issuer is solely responsible for the content of this announcement.

    The DGAP Distribution Services include Regulatory Announcements,
    Financial/Corporate News and Press Releases.
    Archive at www.dgap.de

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    Language: English
    Company: SÜSS MicroTec AG
    Schleissheimer Strasse 90
    85748 Garching
    Germany
    Phone: +49 (0)89 32007-161
    Fax: +49 (0)89 32007-451
    E-mail: ir@suss.com
    Internet: www.suss.com
    ISIN: DE000A1K0235
    WKN: A1K023
    Indices: TecDAX
    Listed: Regulated Market in Frankfurt (Prime Standard); Regulated
    Unofficial Market in Berlin, Dusseldorf, Hamburg, Munich,
    Stuttgart


    End of News DGAP Media
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    475891 30.06.2016


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    SUSS MicroTec announces new Mask Aligner series MA/BA Gen4 DGAP-Media / 30.06.2016 / 10:00 SUSS MicroTec announces new Mask Aligner series MA/BA Gen4 Garching, June 30, 2016 - SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announced …

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