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SUSS MicroTec Launches Coat and Develop Solution for Advanced Packaging Applications
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0 KommentareDGAP-News: SÜSS MicroTec AG / Key word(s): Product Launch
SUSS MicroTec Launches Coat and Develop Solution for Advanced Packaging
Applications
06.09.2016 / 14:00
The issuer is solely responsible for the content of this announcement.
SUSS MicroTec Launches Coat and Develop Solution for Advanced Packaging
Applications
06.09.2016 / 14:00
The issuer is solely responsible for the content of this announcement.
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SUSS MicroTec Launches Coat and Develop Solution for Advanced Packaging
Applications
Garching, September 6, 2016 - SUSS MicroTec, a leading supplier of
equipment and process solutions for the semiconductor and related markets,
today announced the launch of its new generation of the fully automated
ACS300 platform. The modular system of the ACS300 Gen3 is specifically
designed for high volume manufacturing of advanced packaging applications
such as wafer-level chip-scale packaging, fan-out wafer-level packaging,
copper pillar flip-chip and 3D packaging.
The tool addresses the needs of a highly competitive and cost-sensitive
market. Efficient module stacking allows for the smallest footprint for a
system with eight coaters and developers on the market, saving costly
cleanroom space. The three-level modular system delivers high yield and
throughput by fast and precise robots, intelligent scheduling algorithms
and a highly advanced monitoring system. The ACS300 Gen3 provides for
simultaneous 200 mm and 300 mm wafer processing without the need for a
mechanical changeover. In addition, the tool can be equipped to handle 330
mm and warped wafers with a warpage of up to 10mm. The ability to process
multiple wafer shapes and sizes as well as various coat and develop
materials makes the platform an efficient all-in-one solution. State-of-
the-art chemical-saving features address economic as well as ecological
concerns, working in line with even the most rigid sustainability
standards.
"The ACS300 Gen3 is our new flagship for the advanced packaging market.
Having worked in close collaboration with our customers, we have created a
platform that really excels. We are very excited to present some new
groundbreaking functions. The ACS300 Gen3 stands for high process
stability, repeatability and yield. For example, it has more sensors for
logging and control than any coating system SUSS MicroTec has ever
produced", says Gary Choquette, General Manager of the Coater/Developer
product line. "With this brand new generation of the ACS300, we supply our
customers with a high-quality, state-of-the-art tool at a very favorable
cost of ownership."
About SUSS MicroTec
SUSS MicroTec is a leading supplier of equipment and process solutions for
microstructuring in the semiconductor industry and related markets. In
close cooperation with research institutes and industry partners SUSS
MicroTec contributes to the advancement of next-generation technologies
such as 3D Integration and nanoimprint lithography as well as key processes
for MEMS and LED manufacturing. With a global infrastructure for
applications and service SUSS MicroTec supports more than 8.000 installed
systems worldwide. SUSS MicroTec is headquartered in Garching near Munich,
Germany. For more information, please visit www.suss.com
Contact:
SUSS MicroTec AG
Franka Schielke
Senior Manager Investor Relations
Schleissheimer Strasse 90
85748 Garching, Deutschland
franka.schielke@suss.com
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: franka.schielke@suss.com
---------------------------------------------------------------------------
06.09.2016 Dissemination of a Corporate News, transmitted by DGAP - a
service of EQS Group AG.
The issuer is solely responsible for the content of this announcement.
The DGAP Distribution Services include Regulatory Announcements,
Financial/Corporate News and Press Releases.
Archive at www.dgap.de
---------------------------------------------------------------------------
Language: English
Company: SÜSS MicroTec AG
Schleissheimer Strasse 90
85748 Garching
Germany
Phone: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
E-mail: ir@suss.com
Internet: www.suss.com
ISIN: DE000A1K0235
WKN: A1K023
Indices: TecDAX
Listed: Regulated Market in Frankfurt (Prime Standard); Regulated
Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover,
Munich, Stuttgart, Tradegate Exchange
End of News DGAP News Service
---------------------------------------------------------------------------
499269 06.09.2016
SUSS MicroTec Launches Coat and Develop Solution for Advanced Packaging
Applications
Garching, September 6, 2016 - SUSS MicroTec, a leading supplier of
equipment and process solutions for the semiconductor and related markets,
today announced the launch of its new generation of the fully automated
ACS300 platform. The modular system of the ACS300 Gen3 is specifically
designed for high volume manufacturing of advanced packaging applications
such as wafer-level chip-scale packaging, fan-out wafer-level packaging,
copper pillar flip-chip and 3D packaging.
The tool addresses the needs of a highly competitive and cost-sensitive
market. Efficient module stacking allows for the smallest footprint for a
system with eight coaters and developers on the market, saving costly
cleanroom space. The three-level modular system delivers high yield and
throughput by fast and precise robots, intelligent scheduling algorithms
and a highly advanced monitoring system. The ACS300 Gen3 provides for
simultaneous 200 mm and 300 mm wafer processing without the need for a
mechanical changeover. In addition, the tool can be equipped to handle 330
mm and warped wafers with a warpage of up to 10mm. The ability to process
multiple wafer shapes and sizes as well as various coat and develop
materials makes the platform an efficient all-in-one solution. State-of-
the-art chemical-saving features address economic as well as ecological
concerns, working in line with even the most rigid sustainability
standards.
"The ACS300 Gen3 is our new flagship for the advanced packaging market.
Having worked in close collaboration with our customers, we have created a
platform that really excels. We are very excited to present some new
groundbreaking functions. The ACS300 Gen3 stands for high process
stability, repeatability and yield. For example, it has more sensors for
logging and control than any coating system SUSS MicroTec has ever
produced", says Gary Choquette, General Manager of the Coater/Developer
product line. "With this brand new generation of the ACS300, we supply our
customers with a high-quality, state-of-the-art tool at a very favorable
cost of ownership."
About SUSS MicroTec
SUSS MicroTec is a leading supplier of equipment and process solutions for
microstructuring in the semiconductor industry and related markets. In
close cooperation with research institutes and industry partners SUSS
MicroTec contributes to the advancement of next-generation technologies
such as 3D Integration and nanoimprint lithography as well as key processes
for MEMS and LED manufacturing. With a global infrastructure for
applications and service SUSS MicroTec supports more than 8.000 installed
systems worldwide. SUSS MicroTec is headquartered in Garching near Munich,
Germany. For more information, please visit www.suss.com
Contact:
SUSS MicroTec AG
Franka Schielke
Senior Manager Investor Relations
Schleissheimer Strasse 90
85748 Garching, Deutschland
franka.schielke@suss.com
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: franka.schielke@suss.com
---------------------------------------------------------------------------
06.09.2016 Dissemination of a Corporate News, transmitted by DGAP - a
service of EQS Group AG.
The issuer is solely responsible for the content of this announcement.
The DGAP Distribution Services include Regulatory Announcements,
Financial/Corporate News and Press Releases.
Archive at www.dgap.de
---------------------------------------------------------------------------
Language: English
Company: SÜSS MicroTec AG
Schleissheimer Strasse 90
85748 Garching
Germany
Phone: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
E-mail: ir@suss.com
Internet: www.suss.com
ISIN: DE000A1K0235
WKN: A1K023
Indices: TecDAX
Listed: Regulated Market in Frankfurt (Prime Standard); Regulated
Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover,
Munich, Stuttgart, Tradegate Exchange
End of News DGAP News Service
---------------------------------------------------------------------------
499269 06.09.2016
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