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Dialog Semiconductor Plc.: Dialog Semiconductor's Latest Bluetooth(R) Low Energy SoC Offers Unparalleled Integration and Flexibility

DGAP-News: Dialog Semiconductor Plc. / Key word(s): Product Launch/Market
launch
Dialog Semiconductor Plc.: Dialog Semiconductor's Latest Bluetooth(R) Low
Energy SoC Offers Unparalleled Integration and Flexibility

21.09.2016 / 08:00
The issuer is solely responsible for the content of this announcement.

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SmartBond(TM) DA14681 delivers the highest performance, lowest power
consumption, smallest footprint and lowest system cost to simplify the
creation of IoT devices.

London, United Kingdom - September 21, 2016 - Dialog Semiconductor plc
(XETRA:DLG), a provider of highly integrated power management, AC/DC power
conversion, solid state lighting (SSL) and Bluetooth(R) low energy (LE)
technology, today announced the launch of SmartBond(TM) DA14681, the
world's most integrated single-chip solution that provides connectivity for
rechargeable devices, including wearables, smart home and other emerging
Internet of Things (IoT) devices.

As a SmartBond device, Dialog's DA14681 intelligently balances performance
and power efficiency, delivering high-power processing when it's needed up
to 96 MHz from its ARM(R) Cortex(TM) M0 processor and saving power when it
isn't, by consuming less than one µA when in standby. This makes it ideal
for managing multi-sensor arrays and enables always-on sensing.

The highly integrated solution supports the latest Bluetooth 4.2 standard,
and its integrated Power Management Unit (PMU) provides three independent
power rails to supply external system components, in addition to an on-chip
charger and fuel gauge, allowing DA14681 to recharge batteries over a USB
interface. Due to its unique architecture, it is able to power a complete
IoT system without the need for additional external power management
circuitry.

"The increasing demands of today's connected devices market calls for an
integrated solution that delivers the right balance of high power and
efficiency," said Sean McGrath, SVP and GM Connectivity, Automotive and
Industrial Business Group, Dialog Semiconductor. "SmartBond(TM) DA14681 is
our greatest leap yet in delivering an integrated SoC that meets not only
the needs of today's consumers but tomorrow's as well, with a design that
empowers developers to simply attach a battery or sensors to create a
complete IoT device. The DA14681 is already shipping in high volume at tier
one OEMs for applications including wearables and virtual reality (VR),"
added McGrath.

DA14681 is the second member of a device family that includes the popular