DGAP-Adhoc

Metalcorp Group plans to issue a new bond for purposes of partly refinancing its existing bond 2013/2018

DGAP-Ad-hoc: Metalcorp Group B.V. / Key word(s): Issue of Debt Metalcorp Group plans to issue a new bond for purposes of partly refinancing its existing bond 2013/2018 23-May-2017 / 16:35 CET/CEST Disclosure of an inside information acc. to Article 17 MAR, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. Metalcorp Group plans to issue a new bond for purposes of partly refinancing its existing bond 2013/2018 Amsterdam, 23 May 2017 - The management of Metalcorp Group today decided in principle to place new bonds to institutional investors by way of an international private placement. The volume is expected to be at least EUR 70 million with an envisaged coupon at around 7.0% p.a. and a term of presumably five years. It is intended to use the proceeds from the bond partly for the repayment of the existing bond 2013/2018 and partly for general corporate financing purposes. Following the successful closing of this private placement, Metalcorp Group intends to make a voluntary exchange and tender offer for the existing bond 2013/2018. Metalcorp Group B.V., Amsterdam The Management For more information: Frank Ostermair/Linh Chung Better Orange IR & HV AG [phone] [e-mail] Ricardo Phielix (CFO) Metalcorp Group B.V. [phone] [e-mail] 23-May-2017 CET/CEST The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de

Language:	English
Company:	Metalcorp Group B.V.
	Crystal Tower, Orlyplein 10
	1043 DP Amsterdam
	Netherlands
ISIN:	DE000A1HLTD2
WKN:	A1HLTD
Listed:	Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange; Open Market (Basic Board) in Frankfurt

End of Announcement	DGAP News Service

576649  23-May-2017 CET/CEST