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First C4NP Bumped Wafers Available for Viewing Wafers bumped using the new C4NP process developed by IBM and SUSS will be put under the microscope at Semicon West MUNICH, Germany - SUSS MicroTec today announces that the first bumped wafers using the newly developed C4NP process (Controlled Collapse Chip Connection - New Process) will be available for viewing at the SUSS booth at Semicon West (North Hall, Booth 5735, San Francisco, Moscone Center, July 12-14, 2005). IBM, who invented and developed the C4NP technology at its TJ Watson Research Center, engaged SUSS in September 2004 to develop the necessary equipment for this revolutionary process. C4NP is a new method of manufacturing solder bumps in which solder-balls are prefabricated in a mold before transferring them onto an entire wafer in one step. "SUSS has met all the checkpoints to date in the Joint Development Agreement with IBM and the C4NP equipment is now available. This will allow access to fine-pitch lead-free solder bumps at a significantly lower cost," said Joe Lisowski, Director, Packaging Applications and Development Group for IBM. SUSS, who developed the various tools at different sites and integrates them at their Waterbury, VT facility, recently hosted a select group of companies for a "C4NP Equipment Preview" in Vermont. This was the first time that key technology leaders were able to take a direct look at the equipment and have their questions answered. "We have started to involve the wafer bumping and advanced packaging technology leaders to give them an opportunity to understand the benefits of C4NP as early as possible" comments Dr. Stefan Schneidewind, CEO of SUSS MicroTec. "Our industry needs a low-cost, fine-pitch and 100% lead free bumping solution - C4NP accomplishes just that". Meanwhile, SUSS has launched a special section on their website which explains the C4NP process in more detail. It can be accessed via www.suss.com/C4NP About IBM IBM is the world`s largest information technology company, with 80 years of leadership in helping businesses innovate. IBM is also a recognized innovator in the semiconductor industry having been first with advances like more power-efficient copper wiring in place of aluminum and faster SOI and silicon germanium transistors. These and other innovations have contributed to IBM`s standing as the number one U.S. patent holder for 11 consecutive years. More information about IBM semiconductors can be found at http://www.ibm.com/chips. For more information, please contact: Fiona Kemp, Corporate Communications Manager. Tel: +49 (0)89 32007 395, Email:f.kemp@suss.de |
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| aus der Diskussion: | Süss MicroTec |
| Autor (Datum des Eintrages): | immagutdrauf (17.07.05 22:23:46) |
| Beitrag: | 24 von 41 (ID:17258000) |
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