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Zeit für einen neuen Thread: HOHENBRUNN - MUNICH, GERMANY, Jul 31, 2001 (BUSINESS WIRE) -- NanoPierce Card Technologies GmbH, a subsidiary of NanoPierce Technologies, Inc. (OTCBB), today announced that initial samples of the new WaferPierce(TM) process have been successfully produced. Development of a test wafer in compliance with NanoPierce specifications commenced in April of this year, when the company began working with the Fraunhofer Institute for Silicon Technology (ISIT), a preeminent research and development facility for silicon and wafer technology located in Itzehoe, Germany. These wafers are now available in pre-production quantities. The chips on the wafer have contact pads that are compatible to the I-code chip produced by Philips Semiconductor, a widely used chip in radio frequency identification (RFID) applications. For the first time, NanoPierce has at its disposal wafer-based test material made to its own specifications. "This development represents a significant advantage for us and an important step forward for NanoPierce," stated Dr. Herbert J. Neuhaus, Executive Vice President of Technology of NanoPierce Technologies, Inc. "Previously we only had access to commercially available test material. The test wafers which are now available to us have chips whose size and properties closely approximate the components used in our highest priority applications, such as smart card chip modules and smart labels." During the past two weeks, the first contacts were applied to these wafers by means of the patent-pending WaferPierce(TM) technology developed by NanoPierce in the company`s laboratory in Colorado Springs, Colorado. "We are producing initial samples on a small scale in our in-house lab. However, our own cleanroom, including a wetbench specifically designed to accommodate the WaferPierce(TM) process, will be completed within the next nine weeks," said Dr. Neuhaus. "These new test wafers finally enable us to provide a select group of customers with sufficient test material," stated Dr. Michael E. Wernle, President & CEO of NanoPierce Card Technologies. "We are currently producing initial samples for a range of various applications. Due to this important breakthrough, we can now demonstrate WaferPierce(TM) to our customers in functional applications, and we can move on to the next level of the design-in process. This development confirms that the technical market introduction of WaferPierce(TM) is proceeding systematically according to both our development and our marketing plans." As a result of its favorable progress, NanoPierce will be participating in the key upcoming trade fairs for semiconductor technology worldwide. These include the IMAPS 2001 Exhibition and Conference (Baltimore, October 2001); the SemiCon Europe (Munich, May 2002); the SemiCon West (San Francisco and San Jose, July 2002); and the IMAPS 2002 Exhibition and Conference (Denver, October 2002). "I am particularly pleased that Dr. Neuhaus and Bin Zou have been invited to give a presentation at the IMAPS 2001 specifically focusing on our WaferPierce(TM) technology," commented Paul H. Metzinger, President & CEO of NanoPierce Technologies, Inc., Denver. "Dr. Wernle is already scheduled to make a presentation on the application of our technologies in the LED field. And now we have the opportunity to report on recent developments in the electroless process for WaferPierce(TM) to a selected audience of technical specialists. Without a doubt, this will significantly arouse the interest of the semiconductor industry in our company." NanoPierce Technologies, Inc., of Denver, Colorado, USA, is traded on the Nasdaq stock market (NPCT, Trade) as well as on the Frankfurt and Hamburg (NPCT, Trade). In addition to the 12 patents it owns, NanoPierce has numerous applications pending, others in preparation, and various other intellectual properties related to NanoPierce`s proprietary NCS (NanoPierce Connection System). This advanced system is designed to provide significant improvement over conventional electrical and mechanical interconnection methods for high-density circuit boards, components, sockets, connectors, semiconductor packaging and electronic systems. For more information on NanoPierce Technologies, Inc., please visit this web site: www.nanopierce.com. This announcement contains forward-looking statements about NanoPierce Technologies, Inc. that may involve risks and uncertainties. Important factors relating to the company`s operations could cause actual results to differ materially from those in forward- looking statements and are further detailed in filings with the Securities and Exchange Commission available at the SEC web site (http://www.sec.gov). All forward-looking statements are based on information available to NanoPierce Technologies, Inc. on the date hereof, and NanoPierce Technologies, Inc. assumes no obligation to update such statements. CONTACT: NanoPierce Technologies Inc., Denver Paul H. Metzinger, 303/592-1010 303/592-1054 (fax) paul@nanopierce.com or NanoPierce Card Technologies GmbH, Hohenbrunn Dr. Michael E. Wernle, + 49-8102-8961-0 + 49-8102-8961-11 (fax) munich@nanopierce.com or Stock Enterprises Inc., Henderson James R. Stock, 702/614-0003 URL: http://www.businesswire.com Today`s News On The Net - Business Wire`s full file on the Internet with Hyperlinks to your home page. Copyright (C) 2001 Business Wire. All rights reserved. Hold NPCT and prosper Jetsia |
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| aus der Diskussion: | NPCT Nanopierce Technologies WKN 916132 Thread V |
| Autor (Datum des Eintrages): | jetsia dax (31.07.01 10:32:53) |
| Beitrag: | 1 von 329 (ID:4088504) |
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