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PREPUBLICATION ABSTRACT IMAPS 2001 Baltimore, Maryland October 9 - 11, 2001 CONFERENCE INFORMATION Electrical and Thermal Performance of a New Process for High Density LED Array Assembly Michael E. Wernle, Michael Kober Advances in the development of white and blue LEDs (light emitting diodes) have now made LED semiconductor components available across the entire color spectrum. This development opens the door to new, previously unknown applications. Of particular significance are high-resolution displays and LED arrays, components that have up to 8000 LED dies on an extremely small area (~20 cm2). These components require innovative mounting technologies. Conventional methods, including conductive adhesive, are hard-pressed to fulfill new, more rigorous demands, such as a pitch of less than 100 mm. Moreover, achieving maximum light yield at minimum production cost is a decisive factor for new low-cost applications. This paper introduces a new technology for mounting LED dies on FR4 and ceramic substrates. Specifically, this process involves embedding miniscule particles of diamond dust by means of an electroplating plating process into a conductive nickel layer, thereby producing a very rough, conductive layer similar to sandpaper on the substrate. This process, also known as NCS (NanoPierce Connection System), has now been adapted to make it suitable for use with LED dies backed with an extremely thin layer of gold. In addition to modifying the roughness and particle density of the NCS surfaces, suitable adhesives were selected in order to ensure that benefits such as low transfer resistance and good thermal conductivity are maintained. Comparative tests with conventional production processes, such as those using conductive adhesive, indicate a marked improved in the electrical and thermal properties. Furthermore, the paper will demonstrate how this process can significantly contribute to increasing the density of LEDs per cm2 and hence maximize the light yield. IMAPS 2001 Baltimore, Maryland October 9 - 11, 2001 CONFERENCE INFORMATION Quelle: http://www.flipchips.com/abstracts/PPWernle.html gepostet von Kathy auf dem RB Board http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea… Hold NPCT and prosper Jetsia |
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| aus der Diskussion: | NPCT Nanopierce Technologies WKN 916132 Thread V |
| Autor (Datum des Eintrages): | jetsia dax (14.08.01 08:40:00) |
| Beitrag: | 19 von 329 (ID:4194646) |
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