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Kathy Oct-10-01, 11:55 AM (EST) 90. "A new letter to shareholders just received from Paul Metzinger. . ." WaferPierce ™ the New Dimension In Connection Technology To our Present and Prospective Shareholders of NanoPierce Technologies, Inc., I thought many of you would appreciate obtaining a better understanding of our WaferPierce ™ application and the benefits to be obtained from practicing the art described in our recently filed Patent Application “Electroless Process for the Preparation of Particle Enhanced Electric Contact Surfaces”. This subject matter was also described in the paper “A New Electrical Surface Joining Technology For Flip Chip Application”, which was presented by Mr. Bin Zou at the IMAPS conference in Baltimore. Always keep in mind that the most important attribute of NCS ™ is: Simplicity is its strongest feature. With that in mind the WaferPierce ™ “electroless” process and application provides, among others, the following significant advantages over prior art, which we believe will provide NanoPierce Technologies, Inc., with a compelling and sustainable competitive position over other connection technologies. First, only a low bonding force is needed during and after the chip or chip module is bonded to a substrate or antenna structure, since the sharp, pointed, hard particles can easily penetrate the conductive contact surface. This low residual stress on the chip or chip module compared to the high stress incurred in conventional chip attachment methods, such as conductive adhesive bonding, allows thinner chips or chip modules to be used to make smaller, more flexible, mobile RFID devices, such as smart cards and smart inlay devices. Second, the cost of manufacturing smart cards and smart labels is significantly reduced by the elimination of manufacturing steps and the use of less expensive materials. Because high temperatures are not employed in connecting components – as in soldering or wire bonding – a simple, inexpensive substrate material can be employed, for example, polyvinyl chloride, polyethyleneterephthalat (PET/PETP”), glycol-modified PET (“PET-G”), acrylonitrile-butadiene-styrene copolymer (“ABS”), polystyrol (“PS”), polyproplyne (“PP”), cellulose or paper and blends, laminates or co-extruded combinations of these materials. These materials can also be printed easily. No special handling or curing steps are required. Third, if the chip bond pads are particle-enhanced, it is possible for manufacturers to design products so that the placement of the chip is not very critical. In contrast, when conductive adhesives are employed, the printing of the adhesive on the chip must be very precise, because chips are small. With WaferPierce ™, simpler, less expensive manufacturing equipment can be used and operated at higher speeds. In addition, manufacturing of the card or label is simplified in that non-conductive adhesives can be applied rather indiscriminately without concern for the viability of the electrical connection between the components being bonded. The advantage is more significant for small components and pitch distance attachments. When compared to isotropic conductive adhesive, (an adhesive that conducts electricity equally in all directions as opposed to an anisotropic adhesive which conducts electricity in only one direction), the printing or dispensing of non-conductive adhesive is much simpler, as there is no danger of causing shorts by spreading excess adhesive. This also greatly increases manufacturing line speed and reduces the costs of the necessary manufacturing equipment. Non-conductive adhesives are also less expensive. In addition, the electrical and thermal performance of smart cards and smart inlays is improved while maintaining reliability. Fourth, if the particle-enhanced contact is formed on the chip carrier substrate or antenna structure, the chip requires no treatment. It can be simply bonded to the chip carrier substrate or antenna structure by non-conductive adhesive. Fifth, if the particle-enhanced contact is formed on the chip, hundreds or thousands of chips in a wafer can be plated in one treatment. After dicing the chips can be readily used by simply bonding with non-conductive adhesive. Further, if an electroless plating process is used to make the particle-enhanced surface on a chip or wafer, no masking is required for plating because the electroless process is selective (meaning the chemical composition is attracted to and only deposited on the contact surfaces of the chip pads). Sixth, because the particle connections provide a very low resistance path between the chip and the antenna, and the non-conductive adhesives set rapidly, the electrical connection between components can be tested immediately. Thus, manufacturing defects can be detected promptly, avoiding excessive waste and manufacturing losses because of delayed detection inherent in present manufacturing processes. Seventh, the process for forming electrical connections using WaferPierce ™ enables the use of different, less expensive antennae and coil materials. Current processes are not compatible, for example, with various forms of coil technology, such as aluminum coils, which oxidize rapidly (i.e., in a matter of minutes) and form a hard oxide layer, which precludes electrical connection. These materials cannot be used with the slow forming bonds of currently employed adhesives. In contrast, WaferPierce ™ penetrates the aluminum oxide or other insulatory films to form an electrical connection. Other materials that can be used to form antenna patterns capable of connection with a particle-enhanced contact include, for example, copper, aluminum, gold, and other metals, conductive inks, conductive pastes, metal foils and graphite. Eighth, if the bond pads of chips are particle-enhanced, for example, by enhancing all the chips on a wafer before it is diced, the chips can be stored in inventory and used with any module or antenna, regardless of the composition of the contact surfaces opposing the chip. For example, in a smart inlay the chips could be used with any antenna sheet regardless of whether the antenna is formed of a conductive paste or ink, or whether the metal foil is aluminum, copper or any other metal. As the reader can quickly realize, NCS ™ has the ability to radically change the landscape of connection technologies currently used by the micro-electronics industry. In summation let me give credit to Mr. Bin Zou who largely authored the substance of this monograph by his description of the NCS/WaferPierce ™ process in the Patent Application. If there are any errors in this presentation they are attributable to me. I have always believed an informed shareholder is a loyal and supportive shareholder. Remember to always keep in mind what I said in my interview when describing NCS ™: “A simple and elegant solution for complex connection challenges.” This corporate slogan will become a recognized standard in the micro-electronics industry. Sincerely, NANOPIERCE TECHNOLOGIES, INC. Paul H. Metzinger President and CEO |
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| aus der Diskussion: | NPCT Nanopierce Technologies WKN 916132 Thread V |
| Autor (Datum des Eintrages): | ROAR (10.10.01 20:33:48) |
| Beitrag: | 104 von 329 (ID:4609487) |
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