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Kathy hat Dr. Neuhaus eine mail mit Fragen zum wafer level packaging Verfahren einer Japanischen Firma:

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

From Kathy:

I sent an email to Dr. Neuhaus and Dr. Wernle asking what they could tell me about the new wafer level packaging that was announced by a Japanese company recently and I have received a response from Dr. Neuhaus:

Subj: RE: New wafer level packaging technology
Date: 10/22/01 10:35:39 AM Eastern Daylight Time
From: herb@nanopierce.com (Dr. Herbert J. Neuhaus)
Reply-to: herb@nanopierce.com
To: KKnightmcc@aol.com
CC: michael@nanopierce.com (Michael E Wernle)

Hi Kathy:

There are literally thousands of variations of flip-chip packaging in
existence. Don`t let the alphabet soup confuse you. The site you sent refers
to a type of flip chip where the underfill is applied to the wafer. This
usually called (as it is here) wafer level packaging. Other than that it
pretty much standard flip chip.

Remember that we do not compete with flip chip but instead depend on the
broad acceptance of flip chip by the industry. We offer a type of flip chip
that is extremely simple and low cost. Ours is, therefore, particularly
attractive to low-cost, consumable electronic applications such as Smart
Labels and many, many others.

You are correct: the type of flip chip you ask about requires a lot more
processing steps. A Smart label application could never afford it.

The key our market advantage is to match up the unmet needs (technical,
cost, reliability, etc) of large, rapidly growing market segments with the
cost & performance of our technology. NanoPierce has no interest in
criticizing other packaging technologies. You never know who we may partner
with in the future.

Best regards,
Herb Neuhaus

-----Original Message-----
From: KKnightmcc@aol.com
Sent: Friday, October 19, 2001 11:57 AM
To: michael@nanopierce.com; herb@nanopierce.com
Subject: New wafer level packaging technology


Hi Herb and Dr. Wernle,

I was wondering if you could take a look at this new Japanese wafer level
processing and give me some type of comparison from your point of view. I
looked at it and is appears to have more steps in processing:

http://www.iep.co.jp/english/tech/index.html

Thank you for your anticipated response,

Kathy

>>>>>>>>

Hold NPCT and prosper

Jetsia
 
aus der Diskussion: NPCT Nanopierce Technologies WKN 916132 Thread V
Autor (Datum des Eintrages): jetsia dax  (24.10.01 16:01:29)
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