Taiwan Semiconductor (TSMC) - größter EMS-Player der Welt (Seite 19)
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ISIN: US8740391003 · WKN: 909800 · Symbol: TSFA
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Antwort auf Beitrag Nr.: 60.975.292 von R-BgO am 08.07.19 12:00:49
Antwort auf Beitrag Nr.: 60.955.333 von R-BgO am 04.07.19 15:42:36
Highlights of the day: Why did Nvidia switch to Samsung from TSMC?
DIGITIMES staff Thursday 4 July 2019
Nvidia has recently revealed that its next-generation GPU will be manufactured by Samsung on 7nm EUV process. The revelation should not have come as a big surprise, as Nvidia probably made the switch from TSMC to Samsung due to pricing and supply concerns. For TSMC, losing some of Nvidia's orders should not be a big problem, as long as orders from its biggest clients - Apple, Huawei and Qualcomm - remain stable. Meanwhile, Qualcomm is aggressively expanding its work force in Taiwan.
What is behind Nvidia switch from TSMC to Samsung?: Nvidia has decided to choose Samsung Electronics over TSMC for producing next-generation GPUs in 2020 on 7nm EUV (extreme ultraviolet) node despite Samsung's yield rates for the process remaining uncertain, sparking speculation about the reasons behind the switch.
Qualcomm, MediaTek competing over R&D talent in Taiwan: Qualcomm and MediaTek have both been expanding their R&D deployments in Taiwan and are recruiting local IC design talent keenly with higher-than-average salaries.
DIGITIMES staff Thursday 4 July 2019
Nvidia has recently revealed that its next-generation GPU will be manufactured by Samsung on 7nm EUV process. The revelation should not have come as a big surprise, as Nvidia probably made the switch from TSMC to Samsung due to pricing and supply concerns. For TSMC, losing some of Nvidia's orders should not be a big problem, as long as orders from its biggest clients - Apple, Huawei and Qualcomm - remain stable. Meanwhile, Qualcomm is aggressively expanding its work force in Taiwan.
What is behind Nvidia switch from TSMC to Samsung?: Nvidia has decided to choose Samsung Electronics over TSMC for producing next-generation GPUs in 2020 on 7nm EUV (extreme ultraviolet) node despite Samsung's yield rates for the process remaining uncertain, sparking speculation about the reasons behind the switch.
Qualcomm, MediaTek competing over R&D talent in Taiwan: Qualcomm and MediaTek have both been expanding their R&D deployments in Taiwan and are recruiting local IC design talent keenly with higher-than-average salaries.
Antwort auf Beitrag Nr.: 60.361.576 von R-BgO am 15.04.19 20:06:37TSMC, Samsung to compete for 5G modem orders
https://www.digitimes.com/news/a20190418PD204.html?mod=2
Monica Chen, Hsinchu; Jessie Shen, DIGITIMES Thursday 18 April 2019
TSMC and Samsung Foundry have both disclosed more updates on their EUV process technologies, and are gearing up for a pick-up in replacement demand for smartphones driven by 5G connectivity.
Obtaining key 5G smartphone modem chip orders also plays a part of both foundries' EUV process ambitions. TSMC has already obtained orders from HiSilicon and MediaTek for their 5G modems, and is believed to be competing with rival Samsung for Qualcomm's orders, according to industry observers.
EUV a battlefield technology
TSMC disclosed recently plans for 6nm EUV-based process technology, with risk production scheduled for the first quarter of 2020. The foundry is also expected to kick off commercial production of chips using 7nm EUV process technology later in the second quarter of 2019, the observers said.
TSMC reportedly has obtained orders for Qualcomm's next-generation Snapdragon 865 chips. But if Samsung improves its EUV process yield rates to satisfactory levels, Qualcomm may shift part of the orders to Samsung for cost reasons, the observers indicated.
Samsung has claimed the availability of its first process node with EUV lithography technology since October 2018, with mass production already kicking off. Samsung also unveiled recently that its 5nm FinFET process technology is complete in its development and is ready for customers' samples.
Qualcomm to supply 5G iPhone modems; Intel exits
Qualcomm is set to be a major 5G modem supplier for the first 5G iPhone, after reaching a six-year deal with Apple to end the lawsuits between the companies and supply 5G modems for the iPhone.
However, just after Qualcomm's announcement of its settlement with Apple, Intel revealed its decision to quit making modem chips for 5G smartphones. Intel said it will focus on 4G and 5G modems in PCs, IoT and other data-centric devices, and will also continue to invest in its 5G network infrastructure business.
Some industry sources said they were not surprised by Intel's exit, given Apple being the only target customer of its 5G smartphone modem business. The resources Intel would have had to pour into developing 5G modems for smartphones would be disproportionate to profits it might have gained from the business, the sources indicated. For Intel, 5G smartphone modems would not be the chip giant's main profit driver.
Intel was previously identified as being among the major 5G smartphone modem chip developers, which also include Samsung, HiSilicon and MediaTek in addition to Qualcomm.
Intel's discontinued 5G tie-up with China's state-owned Unisoc, previously know as Unigroup Spreadtrum & RDA, had already signaled the chip giant's intention to exit the 5G smartphone modem business. Unisoc previously planned to roll out a high-end 5G smartphone solution utilizing an Intel modem, but has introduced its own 5G modem instead.
Given Apple's efforts to diversify its supplier base, other 5G modem chip providers all have a chance to become a second-source supplier of 5G iPhone modems.
Samsung is also probably eyeing orders for 5G smartphone modems. However, it remains to be seen whether Apple will use Samsung's 5G modems if Samsung asks Apple to shift part of its A-series processor manufacturing orders to the South Korea-based supplier as a condition of the modem supply deal, according to industry sources.
https://www.digitimes.com/news/a20190418PD204.html?mod=2
Monica Chen, Hsinchu; Jessie Shen, DIGITIMES Thursday 18 April 2019
TSMC and Samsung Foundry have both disclosed more updates on their EUV process technologies, and are gearing up for a pick-up in replacement demand for smartphones driven by 5G connectivity.
Obtaining key 5G smartphone modem chip orders also plays a part of both foundries' EUV process ambitions. TSMC has already obtained orders from HiSilicon and MediaTek for their 5G modems, and is believed to be competing with rival Samsung for Qualcomm's orders, according to industry observers.
EUV a battlefield technology
TSMC disclosed recently plans for 6nm EUV-based process technology, with risk production scheduled for the first quarter of 2020. The foundry is also expected to kick off commercial production of chips using 7nm EUV process technology later in the second quarter of 2019, the observers said.
TSMC reportedly has obtained orders for Qualcomm's next-generation Snapdragon 865 chips. But if Samsung improves its EUV process yield rates to satisfactory levels, Qualcomm may shift part of the orders to Samsung for cost reasons, the observers indicated.
Samsung has claimed the availability of its first process node with EUV lithography technology since October 2018, with mass production already kicking off. Samsung also unveiled recently that its 5nm FinFET process technology is complete in its development and is ready for customers' samples.
Qualcomm to supply 5G iPhone modems; Intel exits
Qualcomm is set to be a major 5G modem supplier for the first 5G iPhone, after reaching a six-year deal with Apple to end the lawsuits between the companies and supply 5G modems for the iPhone.
However, just after Qualcomm's announcement of its settlement with Apple, Intel revealed its decision to quit making modem chips for 5G smartphones. Intel said it will focus on 4G and 5G modems in PCs, IoT and other data-centric devices, and will also continue to invest in its 5G network infrastructure business.
Some industry sources said they were not surprised by Intel's exit, given Apple being the only target customer of its 5G smartphone modem business. The resources Intel would have had to pour into developing 5G modems for smartphones would be disproportionate to profits it might have gained from the business, the sources indicated. For Intel, 5G smartphone modems would not be the chip giant's main profit driver.
Intel was previously identified as being among the major 5G smartphone modem chip developers, which also include Samsung, HiSilicon and MediaTek in addition to Qualcomm.
Intel's discontinued 5G tie-up with China's state-owned Unisoc, previously know as Unigroup Spreadtrum & RDA, had already signaled the chip giant's intention to exit the 5G smartphone modem business. Unisoc previously planned to roll out a high-end 5G smartphone solution utilizing an Intel modem, but has introduced its own 5G modem instead.
Given Apple's efforts to diversify its supplier base, other 5G modem chip providers all have a chance to become a second-source supplier of 5G iPhone modems.
Samsung is also probably eyeing orders for 5G smartphone modems. However, it remains to be seen whether Apple will use Samsung's 5G modems if Samsung asks Apple to shift part of its A-series processor manufacturing orders to the South Korea-based supplier as a condition of the modem supply deal, according to industry sources.
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Antwort auf Beitrag Nr.: 59.940.607 von R-BgO am 22.02.19 11:47:13
TSMC with EUV process gearing up for AI, 5G boom
Monica Chen, Hsinchu; Jessie Shen, DIGITIMES Friday 22 February 2019 Chipmakers are expected to showcase their new-generation chip solutions for AI and 5G applications at the upcoming Mobile World Congress (MWC) trade fair, with Taiwan Semiconductor Manufacturing Company (TSMC) being their major foundry partner thanks to the competitiveness of its EUV-based process technology, according to industry sources.
Huawei's HiSilicon, Qualcomm, Intel, MediaTek and Broadcom are all looking to line up their new products for handsets and mobile base stations, and other applications built on AI and 5G technologies at the 2019 MWC that kicks off on February 25.
Qualcomm is set to present its flagship Snapdragon 855 series mobile SoC that will power a number of new 5G smartphones slated for launch this year. Qualcomm will also showcase its Snapdragon X55 5G modem at the trade exhibition in Barcelona. Both chip solutions are reportedly manufactured using TSMC's 7nm FinFET process technology.
Huawei is expected to introduce its new Balong 5000 series smartphone equipped with 5G baseband developed by HiSilicon during the trade show next week, while MediaTek's lineup will include its Helio M70 and other 5G chip solutions, the sources said. HiSilicon and MediaTek both partner with TSMC to manufacture their advanced 7nm products, the sources said.
Meanwhile, 5G models presented by major smartphone vendors at the event will also highlight the currently available 7nm SoCs powering the devices, with TSMC being the major fabricator for those chip developers, the sources indicated.
In addition, TSMC has obtained 7nm chip orders for 5G related applications including HPC and IoT from AMD, Nvidia, Xilinx, NXP, OmniVision and TI, the sources added. TSMC is expected to secure the first 5nm chip orders from Apple for the 2020 iPhones, the sources continued.
TSMC expressed previously optimism about its performance in 2020 and 2021, when 5G and other emerging technologies mature. Despite its dim business and industry outlook this year, TSMC claimed it is making progress in the development of sub-7nm process technologies with plans to move a newer 5nm EUV process to volume production by 2020 well on track.
Antwort auf Beitrag Nr.: 59.922.923 von Werner13 am 20.02.19 16:59:46
Vielen Dank
für die Auskunft. Da lehne ich mich einfach zurück und mache gar nix.
Ich wurde auch von meiner Bank bezüglich der Sammelklage benachrichtigt.
Die Klage richtet sich aber nicht gegen TSMC sondern gegen die Citibank.
Die Citibank hat einige ADR herausgegeben, unter anderem auch TSMC.
Bei Dividendzahlungen der ADRs hat es die Bank wohl bei den Gebühren für den Währungsumtausch übertrieben.
Es gab einen Vergleich und die Citibank hat knapp 15 Mio. für den Schadensausgleich zur Verfügung gestellt.
Als Geschädigter könnte man sich jetzt theoretisch bei den US-Behörden melden und einen Teil der Summe für sich reklamieren.
Für TSMC spielt das aber praktisch keine Rolle da nur in den Jahren 2006, 2012 und 2013 minimal überhöhte Gebühren berechnet wurden.
2006 0,02%
2012 0,16%
2013 0,03%
(Vorläufige Daten aus der Veröffentlichung des Gerichts).
Die Klage richtet sich aber nicht gegen TSMC sondern gegen die Citibank.
Die Citibank hat einige ADR herausgegeben, unter anderem auch TSMC.
Bei Dividendzahlungen der ADRs hat es die Bank wohl bei den Gebühren für den Währungsumtausch übertrieben.
Es gab einen Vergleich und die Citibank hat knapp 15 Mio. für den Schadensausgleich zur Verfügung gestellt.
Als Geschädigter könnte man sich jetzt theoretisch bei den US-Behörden melden und einen Teil der Summe für sich reklamieren.
Für TSMC spielt das aber praktisch keine Rolle da nur in den Jahren 2006, 2012 und 2013 minimal überhöhte Gebühren berechnet wurden.
2006 0,02%
2012 0,16%
2013 0,03%
(Vorläufige Daten aus der Veröffentlichung des Gerichts).
Falls jemand mehr Infos zur Sammelklage in den USA hat, wäre ich dafür sehr dankbar. Die Website dazu, http://www.citibankadrsettlement.com, ist nicht so recht hilfreich. Und falls jemand Erfahrung hat - ist es überhaupt sinnvoll sich da anzuschließen, wenn man nicht Millionen Aktien hat?
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