Electro Scientific Industries - Equipment-Bauer u.a. für LED - 500 Beiträge pro Seite

[R-BgO]

hierüber drauf gestossen:

http://www.electroiq.com/articles/ap/2011/08/led-packaging-e…


Bisher nur gering profitabel, aber solide Bilanz und potentiell grosser operativer Hebel; werde mir Mo mal ein paar gönnen

[R-BgO]

ESI Announces Second Quarter Fiscal 2012 Results

Revenues Increase to $82 million

PORTLAND, Ore.--(BUSINESS WIRE)-- Electro Scientific Industries, Inc. (NASDAQ:ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced results for its fiscal 2012 second quarter ended October 1, 2011. Financial measures are provided on both a GAAP and non-GAAP basis, which excludes the impact of purchase accounting, equity compensation and non-recurring items.

Revenue in the second quarter was $81.9 million, compared to $77.0 million in the first quarter of 2012 and $59.6 million in the second quarter of last fiscal year. On a GAAP basis, net income was $8.5 million or $0.29 per diluted share, compared to $5.9 million or $0.20 per diluted share in the prior quarter. On a non-GAAP basis, second quarter net income was $9.3 million or $0.32 per diluted share, compared to $7.9 million or $0.27 per diluted share in the first quarter of fiscal 2012 and $2.9 million or $0.10 per diluted share in the second quarter of fiscal 2011.

"We delivered another quarter of strong sales and earnings growth," stated Nick Konidaris, president and CEO of ESI. "Year over year, sales grew 37% and non-GAAP earnings per share more than tripled."

Orders for the second quarter were $40.6 million, compared to $98.9 million in the prior quarter and $70.2 million in the corresponding quarter last year. Konidaris continued, "Following near-record order levels in the first quarter, orders declined due to lumpiness in our micromachining business and deferred capacity additions in DRAM, LED and passive components due to concerns over the economic environment. Although visibility is limited, we expect customer activity to increase in the third quarter."

Gross margin at 44% was flat with last quarter and last year. Operating expenses decreased sequentially by $2.7 million primarily due to lower stock compensation. Non-GAAP operating expenses increased slightly, from $23.1 million to $23.4 million, but decreased as a percent of sales. Non-GAAP operating income was $13.1 million, or 16% of sales, up from $11.3 million or 15% of sales in the first quarter, and it represented the highest level in more than five years.

Balance Sheet and Cash Flow

At quarter end, cash and investments including restricted cash grew to $226 million. Cash flow from operations was $26.4 million during the second quarter, primarily a result of profitable operations and strong cash collections.

Third Quarter 2012 Outlook

Based on current business conditions, ESI expects revenues for the third quarter of fiscal 2012 to be in the $50 million range. Third quarter non-GAAP earnings per share are expected to be at breakeven or slightly below.

Konidaris concluded, "The uncertain economic and market environment has caused many of our customers to delay their near-term capacity additions. These pauses are typical in some of our markets, and could last several quarters. During this period demand will be primarily driven by our new product introductions as well as opportunities related to growth in smartphones and tablets. In the meantime, we plan to continue to invest aggressively in R&D in order to advance our position and support our customers."

The company will hold a conference call today at 5:00 p.m. ET. The session will include a review of the financial results, operational performance and business outlook, and also a question and answer period.

The conference call can be accessed by calling 800-688-0796 (domestic participants) or 617-614-4070 (international participants). The conference ID number is 43538874. A live audio webcast can be accessed at www.esi.com. Upon completion of the call, an audio replay will be accessible through November 5, 2011, at 888-286-8010 (domestic participants) or 617-801-6888 (international participants), passcode 76788016. The webcast will be available on ESI's website for one year.

[R-BgO]

ESI Initiates Quarterly Dividend

PORTLAND, Ore.--(BUSINESS WIRE)-- Electro Scientific Industries, Inc. (NASDAQ: ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced that its board of directors has authorized a quarterly cash dividend of $0.08 per share, payable on February 17, 2012 to shareholders of record on January 27, 2012.

"Our strong cash balance and our history of cash generation provide us the means to fund our growth strategy as well as return cash to shareholders," said Nick Konidaris, President and Chief Executive Officer of ESI. "This dividend demonstrates the company's confidence in our business and strategy, and our commitment to shareholder return."

Today the company also announced that its Board of Directors has approved the repurchase of up to $20 million of the company's outstanding shares of common stock, replacing the current repurchase authorization. The purchases will be made from time to time on the open market at prevailing market prices or in negotiated transactions off the market. The repurchase is expected to continue until completed unless earlier terminated by the Board of Directors. There were 28,810,405 shares outstanding as of November 4, 2011.

[R-BgO]

ESI Acquires French Laser Company EOLITE


PORTLAND, Ore.--(BUSINESS WIRE)-- Electro Scientific Industries, Inc.,

a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, announced that it has acquired EOLITE Systems, a designer and manufacturer of unique fiber lasers. EOLITE, based in Pessac, France, is a leading innovator in pulsed fiber laser technology.

The acquisition provides ESI direct access to differentiated, higher power fiber laser technology, which can be used in a broad set of microfabrication applications. EOLITE's differentiation is in the use of rod type photonic crystal fiber, which generates higher power and stores more energy than flexible fibers. The acquisition of EOLITE provides ESI the ability to customize lasers to specific applications for differentiated capability and lower cost.

Nick Konidaris, ESI's president and CEO, noted, "Leading edge laser capability is key for ESI to meet the challenges in state of the art materials processing. By combining the higher power amplification capabilities of EOLITE with the flexible pulse technology from our PyroPhotonics division we strengthen our ability to provide innovative solutions to our customers." ESI intends to continue to market both the PyroPhotonics and EOLITE laser products into the commercial market for solar, microelectronics, and industrial applications.

ESI paid approximately $10 million in cash for 100% of the shares of EOLITE Systems and expects the acquisition to be nominally dilutive in the near term before transaction and other acquisition-related costs.

[R-BgO]

PORTLAND, Ore.--(BUSINESS WIRE)--

Electro Scientific Industries, Inc. (NASDAQ:ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, announced the receipt of multiple-unit orders from leading Japanese and Korean electronic components manufacturers for ESI's model 3510 test system. The customers will utilize ESI's systems to expand production of the smallest geometry multi-layer ceramic capacitors (MLCCs) typically used in smart phone applications. Up to 500 MLCCs of size 0603 (.6mm x .3mm) and 0402 (.4mm x .2mm) can be integrated into a single smart phone. ESI's unparalleled small device handling and extremely high throughput enable the 3510 to meet the customers' demand for quality high-speed production testing.

ESI's model 3510 performs electrical testing of the industry's smallest MLCCs used primarily in smart consumer electronics. Its high speed design combined with reliable and repeatable sorting capability provide the industry's best cost of ownership to ESI customers. Precision-controlled dynamic contact force eliminates marking on the MLCC's metalized terminals so solderability to the circuit assembly is not compromised. The 3510's high throughput is enabled by patented rotary technology that allows multiple tests to be performed simultaneously. It can test and sort up to 840,000 MLCC chips per hour, which provides a level of productivity that leads the industry.

Vernon Cooke, ESI passive components product marketing manager, noted, "The adoption of our 3510 system strengthens ESI's position as the leading test equipment provider to the MLCC market. The 3510's exceptional high speed processing capabilities of devices smaller than half a millimeter long with reliable and repeatable sorting enable productivity levels for our customers much greater than existing MLCC testers for very small devices."

[R-BgO]

ESI Announces First Quarter Fiscal 2013 Results

Revenues Increased 30% Sequentially

PORTLAND, Ore.--(BUSINESS WIRE)-- Electro Scientific Industries, Inc. (NASDAQ:ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced results for its fiscal 2013 first quarter ended June 30, 2012. Financial measures are provided on both a GAAP and non-GAAP basis.

Revenue in the first quarter was $59.0 million, compared to $45.5 million in the fourth quarter of 2012 and $77.0 million in the first quarter of last fiscal year. On a GAAP basis, net loss was $0.9 million or $0.03 per share, compared to a loss of $7.7 million or $0.26 per share in the prior quarter. On a non-GAAP basis, first quarter net income was $1.9 million or $0.06 per diluted share, compared to a loss of $1.9 million or $0.06 per share in the fourth quarter of fiscal 2012 and income of $7.9 million or $0.27 per diluted share in the first quarter of fiscal 2012.

"Our first quarter results were solid despite continued challenges in some of our markets, as revenues grew 30% sequentially, operating margins improved, and strong orders drove backlog to its highest level in more than six years," stated Nick Konidaris, president and CEO of ESI. "Also, during the quarter we strengthened both our product portfolio and our laser supply chain with the acquisition of Eolite Systems."

Orders for the first quarter increased to $74.1 million, compared to $70.3 million in the prior quarter. Konidaris continued, "Strong demand for our advanced microfabrication products led to sequential orders growth. Also, orders for our component test products more than doubled, driven by demand for our new 3510 MLCC microchip tester."

GAAP gross margin was 40.1%, up from 37.0% last quarter. Non-GAAP gross margin was 41.0% compared to 42.6% in the prior quarter. Operating expenses decreased sequentially by $2.1 million primarily due to lower restructuring and other non-recurring charges. Non-GAAP operating expenses were flat sequentially. Non-GAAP operating income was $2.7 million compared to a loss of $2.1 million in the fourth quarter.

Balance Sheet and Cash Flow

At quarter end, cash and investments including restricted cash totaled $220 million. The company generated $11.4 million in operating cash during the quarter. Inventories increased by $2.4 million and receivables decreased by $4.6 million, yielding a DSO of 43 days. Cash outflows included $2.3 million paid as dividends, and $9.2 million for the acquisition of Eolite Systems.

Second Quarter 2013 Outlook

Based on recent order levels, ESI expects revenues for the second quarter of fiscal 2013 to be between $75 and $80 million. Non-GAAP earnings per share are expected to be $0.15 to $0.20.

Konidaris concluded, "Activity related to consumer electronics remains brisk. Although this business is lumpy given the timing of design wins, we are excited about the number of growth opportunities we see in this market. At the same time, the DRAM, LED, and MLCC markets continue in overcapacity and slow growth in the macroeconomic environment adds uncertainty around the timing of improvement in these markets. As a result, we expect business in the near term to continue to be driven by design wins, technology buys and timing of recovery in the market. With a rich product portfolio and continued progress on new product qualifications, we believe we are in good position to take advantage of the growth opportunities available to us."

[R-BgO]

PORTLAND, Ore.--(BUSINESS WIRE)-- Electro Scientific Industries, Inc. (NASDAQ:ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced results for its fiscal 2013 second quarter ended September 29, 2012. Financial measures are provided on both a GAAP and non-GAAP basis.

Revenue in the second quarter was $80.2 million, compared to $59.0 million in the first quarter of 2013 and $81.9 million in the second quarter of last fiscal year. On a GAAP basis, net income was $5.2 million or $0.17 per diluted share, compared to a loss of $0.9 million or $0.03 per share in the prior quarter and income of $8.5 million or $0.29 per diluted share in the second quarter of fiscal 2012. On a non-GAAP basis, second quarter net income was $7.0 million or $0.23 per diluted share, compared to income of $1.9 million or $0.06 per diluted share in the first quarter of fiscal 2013 and income of $9.3 million or $0.32 per diluted share in the second quarter of fiscal 2012.

"We delivered strong sequential growth in revenues and profitability, as we shipped most of the large microfabrication orders received in the June quarter," stated Nick Konidaris, president and CEO of ESI. "Our Singapore factory shipped a record number of units, enabling us to meet customer commitments and driving solid operating margins."

Net orders for the second quarter were $35.0 million, compared to $74.1 million in the prior quarter. Konidaris continued, "The order rate reflects the variability of our advanced microfabrication business, following the large design wins last quarter. However, overall microfabrication orders are up from last year for both the quarter and year to date."

GAAP gross margin was 41.8%, up from 40.1% last quarter. Non-GAAP gross margin was 42.8% compared to 41.0% in the prior quarter. GAAP operating expenses were essentially flat, while non-GAAP operating expenses increased by $2.2 million due to higher variable expenses, the addition of Eolite and continued investment in our growth initiatives. Non-GAAP operating income was $10.5 million, or 13.1% of sales, compared to $2.7 million, or 4.5% of sales, in the first quarter.

Balance Sheet and Cash Flow

At quarter end, cash and investments including restricted cash totaled $205 million. The company used approximately $11 million in operating cash during the quarter. Inventories increased by $9 million and receivables increased by $30 million, directly related to the timing of shipments in the quarter, yielding a DSO of 66 days.

Third Quarter 2013 Outlook

Based on recent order levels, ESI expects revenues for the third quarter of fiscal 2013 to be around $40 million. Non-GAAP loss per share is expected to be $0.00 to $0.05.

Konidaris concluded, "Although overall market conditions remain weak, we continue to see a full funnel of microfabrication opportunities, and we are optimistic about our growth initiatives in the longer term. Our team remains focused on disciplined execution, improving productivity and quality, and meeting customer commitments."

[R-BgO]

PORTLAND, Ore.--(BUSINESS WIRE)-- Electro Scientific Industries, Inc. (NASDAQ:ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced that the company has a reached a settlement agreement with All Ring Tech Co. Ltd. (All Ring) related to ESI's claim of infringement of one of its patents pertaining to electronic component tester technology. All Ring has agreed to pay ESI the sum of TWD 475 million (approx. USD 16.3 million) as settlement and to discontinue selling the infringing products. ESI estimates that the net financial impact of the settlement and related costs will be an increase of approximately $15.8 million to operating income and approximately $10 million to net income after income taxes, for its fiscal 2013 third quarter, which ends December 29, 2012.

"ESI has made significant investments over many years to develop innovations in passive component test technology for our customers," said Sean Phillips, General Manager, ESI Component Test and Inspection Division. "We are pleased that our efforts through the Taiwan court system have been rewarded by reaching a significant monetary award settlement with All Ring. This outcome is the result of ESI's commitment to vigorously defend itself against those choosing to infringe our Intellectual Property. Our customers depend on ESI for innovative test solutions to meet their challenges in the component test marketplace. Defending our IP enables us to continue investing in solutions for our customers."

[R-BgO]

December 3, 2012
ESI Declares Special Dividend
PORTLAND, Ore.--(BUSINESS WIRE)-- Electro Scientific Industries, Inc. (Nasdaq:ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced that its board of directors declared a special cash dividend of $2.00 per share. The dividend is payable December 27, 2012 to shareholders of record as of the close of business on December 13, 2012.

"We are pleased to be in a position to pay a special dividend to shareholders," said Nick Konidaris, president and CEO of ESI. "Today's announcement reflects our commitment to return excess cash to shareholders following our recent successful patent settlement. The board believes a special dividend paid at this time represents an opportunistic and tax-efficient way to return value to shareholders."

[R-BgO]

ESI Announces the DiamondBlaze(TM) Product Line for Strengthened Glass Singulation

PORTLAND, Ore.--(BUSINESS WIRE)-- Electro Scientific Industries, Inc. (NASDAQ:ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced the release of its new DiamondBlaze™ 5000 system for rapidly cutting chemically strengthened glass used in consumer electronics devices such as smartphones and tablets. The DiamondBlaze™ product line uses a novel micro-disruption™ process to quickly and cleanly cut large sheets of strengthened glass to size with low cost of ownership.

The DiamondBlaze™ 5000 facilitates the One Glass Solution and Fully Integrated Touch processes used in the manufacture of touch panels and displays for current and future consumer electronics products; these processes enable thinner, lighter and less expensive devices. With ESI's laser based micro-disruption™ process, production costs are substantially reduced through increased processing speed and part yield. In addition, the cleaner edges produced with the micro-disruption™ process reduce downstream processing, providing additional customer cost savings.

The DiamondBlaze™ 5000 benefits from decades of advanced systems design, engineered reliability and established worldwide customer support infrastructure. "Our advanced laser microfabrication systems have enabled customers to process a range of materials to exacting standards at high throughput for a number of years and are considered an industry standard for many of our customers. ESI's micro-disruption™ process is an enabling technology, allowing our customers to innovate and introduce at high volume novel displays based on strengthened glass processes, particularly for next-generation consumer electronics. We are very excited about this product and its enabling capability, and we are looking forward to providing this capability to our customers," said Dr. Michael Darwin, Vice President and General Manager of ESI's Interconnect and Microfabrication Division.

The DiamondBlaze™ 5000 is currently available for sale, supporting up to generation 3.5 glass. The DiamondBlaze™ 7000 will be available for sale later in 2013 and supports between generation 4 and 6 glass panels. Both systems support factory automation for ease of system integration into existing and future factory floors.

[R-BgO]

aufgestockt

[R-BgO]

PORTLAND, Ore.--(BUSINESS WIRE)-- Electro Scientific Industries, Inc. (NASDAQ: ESIO), a leading supplier of innovative laser-based manufacturing solutions for smart consumer electronics and other microtechnology industries, today announced it had signed a definitive agreement to acquire the Semiconductor Systems business of GSI Group, Inc. (NASDAQ: GSIG), a global leader and supplier of precision photonics, laser-based solutions and precision motion devices to the medical, industrial, scientific, and electronics markets. Based in Bedford, Massachusetts, the Semiconductor Systems business provides industry-leading products in laser marking and trimming of semiconductor wafers and hybrid circuits. The parties expect the transaction to close within thirty days.

The acquisition brings together two of the preeminent providers of laser manufacturing systems serving the semiconductor industry. With decades of experience, both ESI and Semiconductor Systems are technological leaders in laser-based wafer processing. The Semiconductor Systems' wafer marking products are positioned to capitalize on the industry-wide transition to 450 millimeter wafer diameters and are complementary to ESI's commitment to enabling 3D semiconductor packaging.

This acquisition will add approximately $20-30 million of annual revenue to ESI. It is expected to add $0.05 to $0.10 to non-GAAP earnings per share in the first year.

"The GSI Semiconductor Systems business is an excellent operational fit with ESI. The business brings a strong technical team, broadens our revenue base with our semi customers, and strengthens our Semiconductor Division," stated Nick Konidaris, CEO of ESI. "With complementary capabilities but almost no product overlap, this acquisition broadens our product portfolio and allows ESI to provide a more complete set of laser-based manufacturing solutions to our semiconductor customers."

"We are pleased to complete this transaction, which ultimately enables GSI to focus our growth investments on our OEM component businesses," said John Roush, CEO of GSI. "We believe this outcome is the best result for customers, employees and shareholders of both companies. The GSI team will work closely with our counterparts at ESI to ensure a smooth transition of ownership of the Semiconductor Systems business."

[R-BgO]

ESI Appoints Edward C. Grady as CEO to Replace Nicholas Konidaris

PORTLAND, Ore.--(BUSINESS WIRE)-- Electro Scientific Industries, Inc. (Nasdaq: ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced that Edward C. Grady, a member of the company's Board of Directors, has been appointed President and CEO of the company to succeed Nicholas Konidaris, effective immediately.

"We are fortunate to have been able to secure the services of Ed Grady as our new CEO," said Jon Tompkins, Chairman of the Board of ESI. "He has significant industry and leadership experience, having been the CEO of Brooks Automation and Executive Vice President at KLA-Tencor overseeing multiple divisions. Prior to KLA-Tencor he was President and CEO of Hoya Micromask. In addition, he knows the company well from his service as a director. We believe that in the near term Ed can drive the company to execute on its strategy."

"I look forward to taking the lead at ESI," said Ed Grady. "The company has outstanding talent and technology and has great opportunities for growth. This will be an exciting time for the company."

"We are grateful to Nick for his decade of outstanding leadership at ESI, in particular his oversight of the company's transition from being primarily a memory repair business to having a diversified platform that includes the new industry of laser microfabrication, which ESI has pioneered," continued Mr. Tompkins. "We wish Nick well in the future."

[R-BgO]

ESI Announces Preliminary Results for Fiscal 2014 Fourth Quarter

PORTLAND, Ore.--(BUSINESS WIRE)-- Electro Scientific Industries, Inc. (NASDAQ: ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today reported select preliminary results for its fiscal fourth quarter ended March 29.

Net revenues for the fourth quarter were approximately $37 million. Non-GAAP loss for the fourth quarter is now expected to be between $0.16 and $0.18 per share, which is a larger loss than the guidance range of a $0.09 to $0.14 loss per share that was provided in the company's February 4, 2014, press release. Contributing to the loss were higher expenses related to the first shipments of both gen 4.5 and gen 6 glass cutting systems to touch panel manufacturers, and the shipment of a development tool for a leading semiconductor manufacturer. The company further announced that it expects GAAP results to include a write-down of inventory related to discontinued products, and other non-cash impairment charges which are still being determined. These amounts are not included in the non-GAAP estimate above.

Orders for the quarter were approximately $32 million. Ed Grady, Chief Executive Officer of ESI, noted, "Sales and orders for the quarter came in below our expectations. Our markets were challenging, and anticipated demand for advanced microfabrication tools did not materialize. While we do not expect a meaningful increase in orders in the near term, we continue to see multiple potential opportunities for new applications." Grady continued, "These results make clear the need for ESI to broaden our target industry and application set within the laser material processing market. As we make these changes we expect our revenue opportunities to grow, which, in turn, should reduce the volatility of our results. We are focused on transforming ESI into the premier value leader in laser-based micromachining applications."

ESI will provide a full report on the financial results for its fiscal 2014 fourth quarter and year after the market closes on Tuesday, May 13, 2014. Following the release, Ed Grady, Chief Executive Officer of ESI, will host a conference call at 2:00 p.m. PT to discuss the company's results along with business highlights and outlook. Live call participants can dial 888-419-5570 (domestic) or 617-896-9871 (international) and use passcode 62427815. A webcast of the conference call will air simultaneously, with access available at investors.esi.com. An audio replay will be available on the web site or by calling 888-286-8010 (domestic) or 617-801-6888 (international) and using passcode 11097875. The phone replay will be available through May 23, 2014.

The company is not holding a conference call related to today's announcement and does not intend to provide preliminary results or updated guidance as a practice going forward.

[R-BgO]

ESI Announces DiamondBlaze(TM) 5000 & 7000 Shipments

PORTLAND, Ore.--(BUSINESS WIRE)-- Electro Scientific Industries, Inc. (NASDAQ:ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced shipments of its DiamondBlaze™ 5000 and 7000 Glass Singulation tools to leading Asia-based touch panel manufacturers.

ESI's DiamondBlaze™ product line cuts all strengthened glass products, including Corning® Gorilla Glass and Willow Glass, to enable thinner, lighter, and lower-cost touch screens for consumer devices while offering improved resistance to damage. ESI's considerable knowledge of laser systems and microfabrication technologies lowers overall cost for touch panel manufacturers while enabling future device designs.

The DiamondBlaze™ product line employs a laser-based micro-disruption™ process to rapidly singulate strengthened glass with high yield, industry-leading cutting speeds and minimal edge damage. ESI's proprietary process delivers optimal yields on Corning's® Gorilla NBT Glass products with thicknesses down to 0.4mm and central tension (CT) values ranging from 40 to 100. The DiamondBlaze™ has also been demonstrated to cut previous generations of chemically strengthened glass across a wide thickness range.

ESI's DiamondBlaze™ tools are positioned to meet consumer electronics manufacturers' demands for stronger, thinner materials with lower cost of ownership. "We are very pleased to announce these shipments of our DiamondBlaze™ 5000 and DiamondBlaze™ 7000 products, and we are excited by the growth opportunities they present. We believe the cost of ownership provided by this technology will allow our customers to save money by enabling cost-effective manufacturing of next-generation, more robust, touch panel modules," said Michael Darwin, VP and General Manager of ESI's Industrial Products Division.

The DiamondBlaze™ range of products covers Gen 4.5 up to Gen 6 manufacturing lines. All systems support factory automation for ease of system integration into existing and future factory floors.

[R-BgO]

ESI Announces Fourth Quarter Fiscal 2014 Results

PORTLAND, Ore.--(BUSINESS WIRE)-- Electro Scientific Industries, Inc. (NASDAQ:ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced results for its fiscal 2014 fourth quarter and year ended March 29, 2014. Financial measures are provided on both a GAAP and non-GAAP basis, which excludes the impact of purchase accounting, equity compensation, restructuring and asset impairments, and other items.

Revenue in the fourth quarter was $37.1 million, compared to $38.3 million in the third quarter of 2014 and $39.6 million in the fourth quarter of last fiscal year. On a GAAP basis, net loss was $27.6 million or $0.92 per share, compared to net loss of $4.6 million or $0.15 per share in the prior quarter. Fourth quarter results included charges for inventory write-offs, corporate restructuring and an impairment of an equity investment. On a non-GAAP basis, fourth quarter net loss was $5.0 million or $0.16 per share, compared to net loss of $3.1 million or $0.10 per share in the third quarter of fiscal 2014 and a net loss of $1.0 million or $0.03 per share in the fourth quarter of fiscal 2013. Orders for the fourth quarter were approximately $32 million, compared to $36 million in the prior quarter.

GAAP gross margin was 10.1%. Included in cost of sales was $12.8 million of charges related to the write-off of inventory for discontinued products. Non-GAAP gross margin was 46.2% compared to 44.6% in the prior quarter. Operating expenses were $25.5 million, and included $2.3 million of restructuring charges, asset write-offs, and acquisition and integration costs. On a non-GAAP basis operating expenses were $22.3 million, up from $20.6 million in the prior quarter due to installation costs related to the first shipments of DiamondBlazeTM glass cutting systems to touch panel manufacturers, and the shipment of a development tool to a leading semiconductor manufacturer. Non-GAAP operating loss was $5.1 million compared to a loss of $3.5 million in the third quarter.

Full Year Fiscal 2014 Results

Fiscal 2014 revenue was $181 million, down 16% compared to $217 million in fiscal 2013. On a GAAP basis, fiscal 2014 net loss was $38.3 million or $1.28 per share, compared to net loss of $54.7 million or $1.86 per share in the prior year. On a non-GAAP basis, net loss was $5.1 million or $0.17 per share, compared to net income of $6.4 million or $0.21 per diluted share in 2013.

Balance Sheet and Cash Flow

At quarter end, cash and investments were $111 million. The company used $15.2 million in operating cash during the quarter primarily due to working capital increases. For the fiscal year, use of operating cash was $19.1 million. Also, during the quarter the company spent $191 thousand to repurchase about 20,000 shares of ESI stock pursuant to its stock repurchase authorization, and paid $2.4 million for the quarterly dividend of $0.08 per share.

First Quarter 2015 Outlook

Based on recent order levels, ESI expects revenues for the first quarter of fiscal 2015 to be between $30 and $35 million. Non-GAAP loss per share is expected to be between $0.25 and $0.30.

"This was a challenging end to our fiscal year," stated Edward C. Grady, president and CEO of ESI. "As we look forward, we are changing our market approach, our go-to-market strategy, and our execution as part of our commitment to grow the company for the long term. Although these changes will take several quarters to develop, I am excited about the technology, innovative spirit, and market opportunities that we believe will enable us to return to profitable growth."

[R-BgO]

ESI Announces the Hire of James Latham as Chief Marketing Officer

PORTLAND, Ore.--(BUSINESS WIRE)-- Electro Scientific Industries, Inc. (NASDAQ: ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced that James Latham has been hired as the company's Chief Marketing Officer.

Mr. Latham is a 20-year marketing leader and digital marketing strategist with extensive experience in growth companies such as IBM, Lotus Development Corporation, McCann WorldGroup, and Atlas Telecom. Most recently he was Chief Marketing Officer for OpenText Corporation. James holds a Bachelor's Degree in Computer Science from State University of New York and a Master's Degree in International Marketing Management from Boston University.

"ESI's growth strategy centers on applying our technology to large, near-adjacent markets where we can demonstrate a cost of ownership advantage," stated Edward C. Grady, CEO of ESI. "James' experience and strategic marketing process understanding will help guide both our product development and our go-to-market strategy. I am excited to work with James as we transform ESI into a market-driven growth company."

[R-BgO]

setze mal auf Bodenbildung und habe aufgestockt; immerhin 4,4% Dividendenrendite

[R-BgO]

Antwort auf Beitrag Nr.: 47.271.464 von R-BgO am 07.07.14 14:40:30

...hat ja nicht so gut geklappt, locker noch mal 10% runter;

bin heute auf einen Wettbewerber gestoßen, der sich allerdings nicht nur auf Laser beschränkt

Thread: Orbotech to Acquire SPTS Technologies to Extend Leadership in Advanced Micro Manufacturing

[R-BgO]

ESI Announces New Highly Versatile Laser Micromachining Platform

New µFlexTM Series enables innovations in laser micromachining at exceptional price-performance


PORTLAND, Ore.--(BUSINESS WIRE)-- Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator of laser-based manufacturing solutions for the microtechnology industry, today announced the µFlexTM Series multi-axis precision laser micromachining platform, enabling new levels of price-performance in laser applications for consumer electronics, medical devices, automotive components, and many other industries. The company also announced the shipment of a volume order of this new mid-range platform, the first with ESI-developed and manufactured lasers.

The µFlexTM (Flex for flexible and modular) Series enables industrial designers to rapidly prototype new and exciting designs that differentiate their products from the competition. Process engineers can then use the µFlexTM to build high-volume manufacturing processes with reduced cost of ownership that address a wide variety of laser processes including advanced marking, cutting, drilling, and ablating. The µFlexTM Series, the first mid-range priced platform from ESI, handles all the newest materials from fabrics to metals to ceramics, glass (including strengthened glass) and sapphire. This unprecedented flexibility comes from a modular approach that allows the use of a wide range of laser technologies, including lasers that have been designed and built by ESI to deliver specific capabilities with highly competitive price/performance.

"From mobile devices to automobiles, industrial designers and process engineers are increasingly taking advantage of lasers to process materials with complex designs that weren't possible just a few years ago," said Edward C. Grady, president and CEO of ESI. "This is particularly true in fast-moving consumer electronics markets where new materials are being developed and deployed at incredible speeds. The µFlexTM Series is the first laser micromachining solution that can handle such diversity, giving our customers a competitive advantage while reducing total cost of ownership."

The Next Generation

The µFlexTM Series builds on ESI's track record and expertise to offer far more versatility in material selection and processing than possible previously. It can be easily configured to accommodate a wide variety of laser wavelengths, powers, and pulse widths, from nanosecond to femtosecond, to optimize processes for a broad spectrum of materials. An ESI-proprietary real-time control system synchronizes the timing of laser pulses with laser beam positioning and movement of the work surface.

Space is always at a premium on the manufacturing floor, and the µFlexTM Series was developed to minimize floor space and maximize performance. The total footprint of the µFlexTM Series is as small as 1.7 square meters. The platform can accept a wide range of industry-standard automation technologies for loading and unloading parts. This combination adds even more value to the cost of ownership equation.

[R-BgO]

ESI Introduces Next Generation UV Laser Drilling Tool for Semiconductor Substrate Fabrication

ESI's new CornerStone™ ICP Series 1 delivers the lowest cost of ownership micro via drilling capability with industry-leading small footprint

PORTLAND, Ore.--(BUSINESS WIRE)-- Electro Scientific Industries, Inc. (NASDAQ:ESIO), a leading supplier of innovative laser-based manufacturing solutions for the micro-machining industry, today introduced the CornerStone™ ICP Series 1 UV laser drilling system designed for use initially in Integrated Circuit Packaging (ICP) applications. Compared with typical laser drill tools, this new platform from ESI offers lower overall Cost of Ownership (CoO) and improved accuracy with a reduced footprint, enabling production of vias (Vertical Interconnect Access) for current and next-generation products.

Laser systems are widely employed for drilling vias in organic substrate material used for ICPs, and are typically used for vias less than 100 micrometers (μm) in diameter. The CornerStone™ ICP Series 1 system meets today's production demands and enables packaging manufacturers to meet design requirements for even smaller vias and higher accuracy required in the future.

"With this introduction, we are addressing existing design requirements while providing significantly lower cost of ownership in an industry-leading small footprint," said Dr. Michael Darwin, Vice President and General Manager, ESI. "We are excited about the CoO advantage we can offer our customers and look forward to providing a complete and cost-effective solution to the via drilling market."

Third Dynamics technology holds the key

In addition to the UV laser source, the CornerStone™ ICP Series 1 system incorporates ESI's patented Third Dynamics technology (announced in March of 2013) in a multi-beam format. This technology provides per-beam drill rates that significantly outperform the typical high volume manufacturing (HVM) laser drill systems in operation today. The resulting productivity leads the industry and in turn significantly lowers customers' cost of ownership.

As next-generation substrates push the requirements for line/space and signal routing, the target pad and via diameters will decrease. This will also require a corresponding improvement in via placement accuracy. In its standard configuration, the CornerStone™ ICP Series 1 offers industry-leading via placement accuracy, and can be extended for even smaller and denser via requirements in the future.

Another important factor in the Cost of Ownership equation is tool footprint. The CornerStone™ ICP Series 1 system has an overall footprint 25 percent smaller than typical laser drills in HVM production today. A considerably reduced footprint coupled with a significant productivity increase leads to substantial savings for fabricators as they build production lines for additional capacity.

Availability

Processing of customers samples using pre-production CornerStone™ ICP Series 1 systems is underway now at ESI development centers. System deliveries will begin in the first half of 2015.

[R-BgO]

ESI Announces Third Quarter Fiscal 2015 Results

PORTLAND, Ore.--(BUSINESS WIRE)-- Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator of laser-based manufacturing solutions for the microtechnology industry, today announced results for its fiscal 2015 third quarter ended December 27, 2014. Financial measures are provided on both a GAAP and non-GAAP basis, which excludes the impact of purchase accounting, equity compensation, and other items.

Revenue in the third quarter was $43.7 million, compared to $42.9 million in the second quarter of 2015 and $38.3 million in the third quarter of last fiscal year. GAAP net loss was $6.4 million or $0.21 per share. Non-GAAP third quarter net loss was $4.7 million or $0.15 per share.

"We capitalized on all our revenue opportunities to deliver both top and bottom line results that exceeded our expectations," stated Ed Grady, president and CEO of ESI. "In addition, we made good progress on our initiatives to introduce new products, expand into adjacent markets and increase our presence in China."

Bookings for the third quarter were $40.6 million, compared to $43.0 million in the prior quarter. Grady continued, "Demand was strong for our flex via drilling products, which saw their highest bookings in six quarters. Our Semiconductor business also had a good quarter, with bookings growth in our trim products and our first order for the model 9970 semiconductor thin film scribing tool. This was offset by seasonal weakness in our Components group and a sequential decline in Service bookings from a record level last quarter."

GAAP gross margin was 36.1%. Non-GAAP gross margin was 36.9% compared to 37.7% in the prior quarter. Operating expenses were $21.8 million, compared to $21.3 million in the prior quarter. On a non-GAAP basis operating expenses were approximately flat at $20.5 million. Non-GAAP operating loss was $4.4 million compared to $4.2 million in the second quarter.

Balance Sheet and Cash Flow

At quarter end, cash and investments were $80 million. The company used $13.4 million in cash from operations during the quarter and paid $2.4 million for the quarterly dividend of $0.08 per share. Inventories increased $3.7 million, trade receivables increased by $1.1 million, and current liabilities decreased by $8.7 million, impacted by reductions in deferred margin and retirement payouts.

Credit Facility

ESI also announced that it has agreed to a term sheet for a three year revolving line of credit for up to $30 million with Silicon Valley Bank. "We believe this facility and relationship with Silicon Valley Bank will give us more financial flexibility as we transition the company and execute our growth initiatives," stated Mr. Grady. It is expected that the facility will close within the next two weeks.

Fourth Quarter 2015 Outlook

Grady continued, "I'm pleased with the progress we have made toward each of our growth initiatives. Our China initiative advanced through the acquisition of Topwin Optoelectronics, which we announced last quarter and closed last week. We entered the mid-range segment of the laser systems market with the introduction of the new LumenesiTM micromachining platform. Earlier this month we expanded our addressable market by entering the adjacent IC package drilling market with the introduction of our new Cornerstone ICP series. Lastly, a second internally-developed laser was qualified and shipped inside an ESI system during the third quarter. These initiatives are ongoing and their impact on our top line results will not be immediate or linear. Further, seasonality, capacity absorption and continued softness in the Korean supply chain will impact demand in the near term. While there are other large opportunities in the pipeline, we believe it is too early to count on these in our current projections. As such, we expect revenues for the fourth quarter of fiscal 2015 to be between $32 million and $40 million. Non-GAAP loss per share is expected to be $0.22 to $0.32. Despite expected seasonal weakness in our fourth quarter, I am confident that we are taking the right steps to put the company on the path to growth and profitability."

[R-BgO]

das war zu befürchten:

ESI Board of Directors Suspends Dividend to Concentrate Resources on Growth

PORTLAND, Ore.--(BUSINESS WIRE)-- Electro Scientific Industries, Inc. (Nasdaq: ESIO), an innovator in laser-based manufacturing solutions for the microtechnology industry, today announced that its Board of Directors has suspended its quarterly dividend.

"We are in the middle of a major turnaround at ESI to return to long-term growth, profitability, and cash generation," stated Edward C. Grady, president and CEO of ESI. "Our revitalization effort involves leveraging our recent acquisition of Topwin, gaining high-volume adoption of new products, and expanding our sales channel. Our initiatives are on track, and we are seeing broader interest from our customers and additional opportunities to penetrate adjacent markets. These opportunities require us to deploy qualification units, ramp laser production, field demo equipment, and fund growth in receivables. While our balance sheet is solid our Board believes we should concentrate our financial strength on growing the company and maintaining adequate financial flexibility."

The company is not changing its guidance for the fourth quarter of fiscal 2015, and its financial goals for next fiscal year, beginning in April, remain unchanged.

The company will hold a conference call on Monday, February 23, 2015, at 11:00 a.m. ET to discuss the change in dividend policy and how it relates to its efforts to revitalize the company. The conference call can be accessed by calling 888-339-2688 (domestic participants) or 617-847-3007 (international participants). The conference ID number is 39521656. A live audio webcast can be accessed at www.esi.com.

[R-BgO]

habe meine deutschen Stücke noch mit kleinem Gewinn verkaufen können;

bin mal gespannt, was gleich in den USA passiert

[R-BgO]

ESI Consolidates Facilities to Streamline Operations

PORTLAND, Ore.--(BUSINESS WIRE)--

Electro Scientific Industries, Inc. (Nasdaq: ESIO), an innovator in laser-based manufacturing solutions for the microtechnology industry, today announced a corporate restructuring that will streamline its manufacturing and development operations. The restructuring will result in the closure of the assembly plant and development center located in Chelmsford, Massachusetts, and overall staff reductions of approximately 45 employees. Products currently developed and manufactured in the Chelmsford plant will be transferred to other corporate facilities.

The financial impact is expected to be an annualized pre-tax cost savings of approximately $4.5 million once fully implemented during the fiscal third quarter ending December 2015. The company expects pre-tax charges of approximately $5.5 million in severance and facility-related costs, of which $2.0 million is expected to be recorded in the fiscal fourth quarter ending March 2015.

"This action will enable us to further focus our efforts on growing our business while consolidating manufacturing facilities and lowering our fixed cost base," stated Edward C. Grady, president and CEO of ESI. "I would like to express my sincere appreciation to the affected employees for their valuable contributions to ESI. While these moves are difficult, they are a necessary step in our revitalization plan, to position us for future growth and profitability."

[R-BgO]

New modular JadeTM platform enables manufacturers to react quickly to market demands, deliver a wide variety of high-quality, innovative components

PORTLAND, Ore. & SHANGHAI--(BUSINESS WIRE)-- Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator of laser-based manufacturing solutions for the micromachining industry, today introduced JadeTM, the new low-cost, high-volume-production laser micromachining platform adaptable to a range of configurations for different applications including cutting, marking, drilling and engraving.

The new platform addresses challenges faced by manufacturers in the fast-changing consumer electronics segment where they cope with new materials, new technologies and evolving consumer expectations. Meanwhile, there is relentless pressure to reduce costs, meet quality requirements and achieve high-volume high-yield production. The JadeTM platform is the first laser micromachining platform capable of meeting all these diverse requirements, offering unprecedented levels of versatility and cost-efficient operation.

"Production requirements in consumer electronics are constantly changing with new materials and features that require a range of laser micromachining processes that can be delivered quickly and at an attractive cost of ownership," said Edward C. Grady, President and CEO of ESI. "We are directly addressing this challenge with the JadeTM platform. Designed by ESI's cooperative China-USA engineering operation, this low-cost platform is adaptable, reliable, and locally built and serviced by our support teams on the ground in China."

The JadeTM platform is designed to provide contract and consumer electronics manufacturers with a smarter manufacturing option through the use of extendable and configurable stages, lasers, and automation. The base platform can be configured with multiple laser and optics options as well as a range of add-on options including pre- and post-inspection, metrology and advanced alignment automation. All configurations use a common user interface to reduce training time.

This flexibility means that a JadeTM platform can address multiple marking, cutting, and drilling applications in a responsive and cost-effective manner, improving the useful lifespan of the tool and significantly lowering overall cost of ownership for our customers. The JadeTM platform continues ESI's commitment to reliability, responsive local support in China, and to meeting expectations for precision and high-volume yields

[R-BgO]

ESI Announces Large Semiconductor Manufacturer to Take Delivery of Latest Integrated Circuit Packaging Solution

CornerStone™ ICP will facilitate the customer's ongoing innovation in high-volume IC manufacturing and enable them to meet size, cost and performance goals

PORTLAND, Ore., Dec. 16, 2015 (GLOBE NEWSWIRE) -- Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator of laser-based manufacturing solutions for the micro-machining industry, today announced that the CornerStone™ ICP Series 2 UV laser drilling system has been purchased by a large semiconductor manufacturer for Integrated Circuit Packaging (ICP) applications. Compared to typical microvia drilling tools, the ESI CornerStone™ family offers lower overall cost of ownership (CoO) and improved accuracy with a reduced footprint, enabling production of vias for current and next-generation products at significantly lower cost. The CornerStone™ ICP Series 2 extends the CornerStone™ family to provide best-in-class via size and accuracy for the most demanding next-generation applications.

"With this adoption, the CornerStone™ system is positioned as the industry-leading tool for cost of ownership and capability," said Martin Orrick, Director of Product Development, ESI. "We are excited about the recognition of the value our customers receive, and look forward to extended deployment of this solution to our customers."

Laser systems are widely employed for drilling vias in organic substrate material used for ICPs, with via dimensions typically less than 100 microns in diameter. The CornerStone™ ICP Series 2 system is designed to enable semiconductor device fabricators to meet the most stringent requirements for the much smaller vias at higher accuracy.

Via Drilling Expertise

The CornerStone™ ICP Series 2 is part of ESI's extended family of laser-based via drilling tools, delivering industry-leading precision and accuracy, which encompasses a wide variety of materials and via dimensions—both through-hole and blind. ESI's technology delivers per-beam drill rates that significantly outperform other high volume manufacturing (HVM) laser drilling systems in operation today. The resulting productivity leads the industry and, in turn, significantly lowers a customer's cost of ownership.

As the semiconductor and associated packaging technology moves to the next-generation of substrates to support new products and industries, the requirements for size, shape, accuracy and precision have become increasingly demanding. The CornerStone™ ICP Series 2 delivers unmatched via placement accuracy sought by ICP manufacturers.

Another important factor in the cost of ownership equation is tool footprint. The CornerStone™ family of tools has an overall footprint that is 25 percent smaller than typical laser drills in HVM production today. This significantly reduced footprint coupled with a marked productivity increase leads to substantial savings for fabricators as they build production lines for additional capacity.

[R-BgO]

ESI Announces New Material Handling Solution for Flex PCB Processing

RollMaster™ Roll-to-Roll Material Handling System Helps Flex PCB Manufacturers Drive Higher Processing Throughput for a Wider Range of Materials

PORTLAND, Ore., Jan. 26, 2016 (GLOBE NEWSWIRE) -- Electro Scientific Industries (Nasdaq:ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced immediate availability of the RollMaster™ roll-to-roll material handling system for automating flex printed circuit manufacturing. Developed by Northfield Automation, an industry leader in roll-to-roll automation and thin material handling systems, the RollMaster™ handler helps FPC (flexible printed circuit) manufacturers address the combined challenges of HVM (high-volume manufacturing) and the unique handling requirements associated with thin and sensitive materials.

"We're excited to offer this new automation option to our flex circuit processing customers," said Patrick Riechel, ESI Flex Product Manager. "In order for flex processing customers to optimize their production throughput, it's necessary to have the right laser processing platform paired with the right production-oriented automation. Since RollMaster™ is designed specifically for use on the 5335 platform, our customers get that combination in a true turn-key HVM solution."

"Northfield is focused on helping FPC manufacturers maximize their throughput," stated Mark Wegner, President and CEO of Northfield Automation Systems. "Pairing RollMaster™ with ESI's 5335 systems gives FPC manufacturers a strong solution as they continue their drive for higher yields and higher production throughput."

The design of RollMaster™—which can be paired with all legacy FPC laser processing systems built by ESI since 2005—enables flex PCB manufacturers to process a wide range of materials while maintaining high throughput. Unlike systems utilizing single-purpose designs, which rely on gravity tension to position rolled flex material for processing, the patent-pending Dynamic Tensioning™ technology used in the RollMaster™ handlers continuously adjusts for the changes in bi-directional tension placed on flex material as the result of acceleration and deceleration of the material during processing. This makes RollMaster™ the right high-throughput solution for processors utilizing a variety of web widths and different materials, especially those prone to wrinkling or stretching.

RollMaster™ facilitates the processing of flex material at a higher level of quality at faster throughput speeds and minimizes operator intervention. This allows FPC manufacturers to optimize production and increase their uptime; enabling them to extend their processing services into a broader set of market opportunities involving the processing of new materials. Customers can purchase RollMaster™ packaged with their 5335 platform of choice, directly from ESI.

[R-BgO]

Antwort auf Beitrag Nr.: 51.582.387 von R-BgO am 26.01.16 15:53:13

ESI Expands Market-Leading Family of Laser Processing Platforms For PCB Fabricators

New RedStone™ and LodeStone™ flex processing systems supplement ESI's PCB laser manufacturing portfolio, delivering FPC solutions optimized for key applications and cost-of-ownership


PORTLAND, Ore., Aug. 01, 2016 (GLOBE NEWSWIRE)

-- Electro Scientific Industries, Inc. (Nasdaq:ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced general availability of two new PCB laser processing systems to address the evolving needs of fabricators in the flexible printed circuit (FPC) manufacturing segment.

The RedStone™ system not only provides FPC processors new to laser processing with a low cost-of-ownership entry point, but also enables established FPC processors to optimize production around specific through-hole drilling and routing applications.

The LodeStone™ system addresses the high-reliability routing requirements of processors focused on industries such as medical device manufacturing, where requirements demand laser processing with minimal residual carbonization and smaller heat-affected zones. It utilizes an ESI-developed femtosecond-class green laser—the first to be offered in the FPC manufacturing segment—and incorporates ESI's proprietary rod fiber technology.

These new products extend the breadth of ESI's market-leading portfolio of laser-based PCB manufacturing solutions. A portfolio which already included the industry's most popular line of flex processing systems, a CO2-laser-based processing system for affordable HDI PCB manufacturing, and a high-volume low cost-of-ownership solution for IC packaging.

Early market adoption of the RedStone and LodeStone systems has been promising, with initial-system orders placed with Asia-based customers—one of which is a top-five PCB manufacturer.

"ESI's leadership in this segment draws on our decades of accumulated expertise in laser/material interaction and our ongoing partnership with customers to help them optimize their production capabilities," stated Michael Darwin, General Manager of ESI's Component Processing Division. "The RedStone and LodeStone systems are just the latest additions to our portfolio of solutions designed to help PCB manufacturers address new challenges in production, keep pace with next-generation flexible circuit materials and designs, and offer their customers a wider range of value-added processing services."

RedStone and LodeStone systems are available through ESI directly and through ESI channel partners.

[R-BgO]

Sie kommen einfach nicht raus aus'm Loch:

10 MUSD Miese in Q2, bei nur noch unter 30 MUSD Umsatz;

bilanziell immer noch stark, aber ewig halten sie das nicht aus...

[bezzz]

hier der Link zu den Zahlen,

https://globenewswire.com/news-release/2016/11/01/885365/0/e…

das Bilanzielle hab ich gesucht, ist doch erheblich besser als bei LPKF

Balance Sheet and Cash Flow

At quarter end, cash and investments were $59.1 million, compared to $69.8 million last quarter. The company used $7.5 million of operating cash. Inventories increased by $2.4 million, due to the addition of Visicon inventory. Trade receivables decreased by $4.5 million, and accounts payable decreased by $5.4 million. In addition, the company paid approximately $2.0 million of cash for the acquisition of Visicon.

[R-BgO]

Antwort auf Beitrag Nr.: 53.607.588 von bezzz am 02.11.16 19:31:31

ESI Strengthens Cash Position and Announces Preliminary Third Quarter Orders

PORTLAND, Ore., Jan. 10, 2017 (GLOBE NEWSWIRE) --

Electro Scientific Industries, Inc. (Nasdaq:ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, announced that CEO Michael Burger will be presenting at the Needham Growth Conference in New York City, at 4:15 p.m. EST today.

In his presentation Mr. Burger will discuss his initial thoughts on ESI's strategy and direction, with more details to be provided at the time the company reports its earnings for the third quarter, scheduled for February 1. In conjunction with this presentation, the company is announcing that preliminary orders for its fiscal 2017 third quarter are expected to be $42-44 million. Cash and investments at the end of the quarter are expected to be $54-$55 million.

The company also announced that on January 9, 2017, it closed a $14 million ten-year term loan with First Technology Federal Credit Union in Beaverton, Oregon. The loan is secured by a mortgage on ESI's Portland, Oregon headquarters facility. The proceeds will be available to fund the company's growth strategy and are additive to the cash balance at the end of the third quarter.

"This transaction monetizes a significant corporate asset with low-cost, long-term debt," stated Michael Burger, CEO of ESI. "It strengthens our balance sheet and provides cash for investments in our transition and growth strategy. I look forward to meeting with investors at the conference today."

[R-BgO]

ESI Announces Corporate Restructuring

Actions aimed to improve execution and streamline the cost structure


PORTLAND, Ore., Feb. 10, 2017 (GLOBE NEWSWIRE) --

Electro Scientific Industries, Inc. (Nasdaq:ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced a corporate reorganization that is designed to better position ESI for the future. The objective is to simplify the structure, improve execution, and increase consistency of earnings.

The company announced that it is reorganizing its management team from a business unit to a functional structure, relocating sales, service and operations leadership positions to Asia, closing its facilities in Montreal, Canada, and Napa, California, downsizing its Sunnyvale, California facility, and making other select reductions across the company. The actions are expected to be largely completed by the end of June 2017.

The financial impact of the actions is expected to reduce the company's cost structure by $10 to $12 million on an annualized basis and lower its non-GAAP EBITDA breakeven point to approximately $35 million of quarterly revenue once the actions are fully implemented. The company expects pre-tax charges of $6.5 to $8.5 million, of which approximately $5 million is expected to be recorded in the fourth quarter of fiscal 2017.

"We are streamlining our organization and reengineering business processes to transform the way our company gets things done," stated Michael Burger, CEO of ESI. "Our top corporate priorities are to drive adoption of our new products, improve execution and deliver more consistent earnings over time. The new organizational structure should allow us to lower our breakeven revenue level while being more efficient and effective in addressing the long-term needs of our customers within our targeted markets."

As part of this restructuring the company has also created a success model, targeting an adjusted gross margin of 44% and adjusted EBITDA of 8% on an annual basis. The company expects to achieve these levels of performance over the next 8-10 quarters.

[R-BgO]

Antwort auf Beitrag Nr.: 54.290.378 von R-BgO am 10.02.17 13:15:39

WOW!

vervierfacht innerhalb eine Dreivierteljahrs...

[R-BgO]

Antwort auf Beitrag Nr.: 56.080.607 von R-BgO am 02.11.17 11:42:28

ein wilder Ritt!

leider erst vor kurzem zu $ 22,53 wieder rein...

so ein dämliches Timing muss man erstmal schaffen:

[bezzz]

Blickwinkel meinerseits,

-hinterher kann man immer labern : a posteriori es fácil saber --

sieht mir nach einem Abpraller nach unten aus

übergreifende Perspektive 20 Jahre

[R-BgO]

RUMMMMS!

unverhofft kommt oft:


ESI Announces Second Quarter Fiscal 2019 Results and Agreement to be Acquired by MKS Instruments, Inc.

PORTLAND, Ore., Oct. 30, 2018 (GLOBE NEWSWIRE) --

Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator of laser-based manufacturing solutions for the microtechnology industry, today announced the signing of a definitive agreement to be acquired by MKS Instruments, Inc. and financial results for its fiscal 2019 second quarter ended September 29, 2018. Financial measures are provided on both a GAAP and non-GAAP basis. Non-GAAP results exclude the impact of purchase accounting, equity compensation, restructuring, and other items shown in the non-GAAP reconciliation table below.


ESI Signs Definitive Agreement

ESI announces the signing of a definitive agreement for MKS Instruments, Inc. (NASDAQ:MKSI) to acquire ESI for $30.00 per share. The all-cash transaction is valued at approximately $1 billion. The transaction is subject to customary closing conditions, including the approval of ESI’s shareholders and antitrust approvals in the U.S. and certain other foreign jurisdictions, and is expected to close in the first quarter of calendar 2019. MKS intends to fund the transaction with cash on hand and a new, fully-committed debt financing. See the separate announcement from MKS Instruments for additional transaction details.

As a result, ESI is canceling today’s previously announced investor call.

In connection with this transaction, Stifel is acting as financial advisor and Wilson Sonsini Goodrich & Rosati P.C. is acting as legal advisor to ESI.

[bezzz]

bist Du von 22 bis 30 dabei geblieben?
Glücklicher!
nun aber schnell raus........ imho

unverhofft kommt oft --> shit happens

[R-BgO]

Antwort auf Beitrag Nr.: 59.093.876 von R-BgO am 30.10.18 13:49:51

ja, bin dabeigeblieben,

wenn ich was kann, dann stillsitzen...

ESI Shareholders Approve Merger Agreement with MKS Instruments, Inc.


PORTLAND, Ore., Jan. 10, 2019 (GLOBE NEWSWIRE) --

Electro Scientific Industries, Inc. (NASDAQ: ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, announced that at a Special Meeting of Shareholders held earlier today, ESI shareholders voted to approve the previously announced definitive merger agreement with MKS Instruments, Inc. (NASDAQ: MKSI).

Upon consummation of the transaction, ESI shareholders will receive $30.00 per share, in cash, for a total of approximately $1 billion. All necessary regulatory and shareholder approvals are now complete, and subject to the satisfaction of certain remaining customary closing conditions, the transaction is expected to close in early February 2019. Upon the closing of the transaction, trading of ESI’s shares on NASDAQ will cease.

[R-BgO]

Antwort auf Beitrag Nr.: 59.607.551 von R-BgO am 11.01.19 09:20:36

Ausbuchung kam heute

over-and-out