ISONICS Partner von MOTOROLA ????? - 500 Beiträge pro Seite
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ISIN: US4648953093 · WKN: A0MK8J · Symbol: ISON
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Wichtige Frage!!
Ist IsonicsCorp. (WKN: 913067, ISON)nicht auch ein Partner von Motorola ???
Könnte vielleicht wichtig sein im Bezug auf Chipentwicklung.
"Si-28 SOI-Wafer"
Ist IsonicsCorp. (WKN: 913067, ISON)nicht auch ein Partner von Motorola ???
Könnte vielleicht wichtig sein im Bezug auf Chipentwicklung.
"Si-28 SOI-Wafer"
Das habe ich im Yahoo Board zu Deiner Frage gefunden!
Gruß Jackomo
06/26/2000
Press Release
Semicon Europa Generates Major R&D Programs for Isonics Corp
...The Innovations for High Performance Microelectronics, located in Frankfurt (Oder), Germany, under the direction of Prof. Dr. H. Jorg Osten, will evaluate the use of silicon 28 epitaxial wafers in silicon-germanium-carbon BiCMOS devices for wireless telecommunications applications. This SiGe:C technology is being developed in cooperation with Motorola (NYSE: MOT - news)for use in high performance RF circuits.
--- today:
Motorola says its technology combines silicon with gallium arsenide, which is much faster than silicon in enabling elements to travel at light speed. Gallium arsenide chips are often used in devices like DVD players and laser equipment.
---
10/26/2000
Press Release
Isonics and Epichem Start Development of Isotopically Pure Gallium
...announced today a Joint Development Program to commercialize isotopically pure gallium compounds for the semiconductor and optoelectronic industries.
Dr. Stephen Burden, Isonics` Vice President for Semiconductor Materials, explained, ``The compound semiconductor market for devices based on gallium was over $9 billion in 1999 and is being driven by explosive growth in wireless communications and optoelectronics. This jointly funded, two year program will demonstrate cost effective isotope separation techniques for gallium compounds and determine the benefits of higher thermal conductivity on GaAs, GaN, and GaP based devices such as semiconductor lasers, LED`s, and high frequency integrated circuits. These devices are following a technology roadmap similar to that for silicon, with devices using smaller design features, larger wafer sizes, and higher frequencies. We believe that improved thermal conductivity provided by isotopically pure gallium can be a cost effective way to increase the performance and reliability of these devices. Since the thermal conductivity of GaAs is about one-third that of silicon, it is very likely that improved thermal properties will have substantial positive impact.``
Gruß Jackomo
06/26/2000
Press Release
Semicon Europa Generates Major R&D Programs for Isonics Corp
...The Innovations for High Performance Microelectronics, located in Frankfurt (Oder), Germany, under the direction of Prof. Dr. H. Jorg Osten, will evaluate the use of silicon 28 epitaxial wafers in silicon-germanium-carbon BiCMOS devices for wireless telecommunications applications. This SiGe:C technology is being developed in cooperation with Motorola (NYSE: MOT - news)for use in high performance RF circuits.
--- today:
Motorola says its technology combines silicon with gallium arsenide, which is much faster than silicon in enabling elements to travel at light speed. Gallium arsenide chips are often used in devices like DVD players and laser equipment.
---
10/26/2000
Press Release
Isonics and Epichem Start Development of Isotopically Pure Gallium
...announced today a Joint Development Program to commercialize isotopically pure gallium compounds for the semiconductor and optoelectronic industries.
Dr. Stephen Burden, Isonics` Vice President for Semiconductor Materials, explained, ``The compound semiconductor market for devices based on gallium was over $9 billion in 1999 and is being driven by explosive growth in wireless communications and optoelectronics. This jointly funded, two year program will demonstrate cost effective isotope separation techniques for gallium compounds and determine the benefits of higher thermal conductivity on GaAs, GaN, and GaP based devices such as semiconductor lasers, LED`s, and high frequency integrated circuits. These devices are following a technology roadmap similar to that for silicon, with devices using smaller design features, larger wafer sizes, and higher frequencies. We believe that improved thermal conductivity provided by isotopically pure gallium can be a cost effective way to increase the performance and reliability of these devices. Since the thermal conductivity of GaAs is about one-third that of silicon, it is very likely that improved thermal properties will have substantial positive impact.``
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