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NPCT Nanopierce Technologies WKN 916132 Thread V - 500 Beiträge pro Seite



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HOHENBRUNN - MUNICH, GERMANY, Jul 31, 2001 (BUSINESS WIRE) -- NanoPierce Card Technologies GmbH, a subsidiary of NanoPierce Technologies, Inc. (OTCBB), today announced that initial samples of the new WaferPierce(TM) process have been successfully produced.

Development of a test wafer in compliance with NanoPierce specifications commenced in April of this year, when the company began working with the Fraunhofer Institute for Silicon Technology (ISIT), a preeminent research and development facility for silicon and wafer technology located in Itzehoe, Germany. These wafers are now available in pre-production quantities. The chips on the wafer have contact pads that are compatible to the I-code chip produced by Philips Semiconductor, a widely used chip in radio frequency identification (RFID) applications. For the first time, NanoPierce has at its disposal wafer-based test material made to its own specifications.

"This development represents a significant advantage for us and an important step forward for NanoPierce," stated Dr. Herbert J. Neuhaus, Executive Vice President of Technology of NanoPierce Technologies, Inc. "Previously we only had access to commercially available test material. The test wafers which are now available to us have chips whose size and properties closely approximate the components used in our highest priority applications, such as smart card chip modules and smart labels."

During the past two weeks, the first contacts were applied to these wafers by means of the patent-pending WaferPierce(TM) technology developed by NanoPierce in the company`s laboratory in Colorado Springs, Colorado.

"We are producing initial samples on a small scale in our in-house lab. However, our own cleanroom, including a wetbench specifically designed to accommodate the WaferPierce(TM) process, will be completed within the next nine weeks," said Dr. Neuhaus.

"These new test wafers finally enable us to provide a select group of customers with sufficient test material," stated Dr. Michael E. Wernle, President & CEO of NanoPierce Card Technologies. "We are currently producing initial samples for a range of various applications. Due to this important breakthrough, we can now demonstrate WaferPierce(TM) to our customers in functional applications, and we can move on to the next level of the design-in process. This development confirms that the technical market introduction of WaferPierce(TM) is proceeding systematically according to both our development and our marketing plans."

As a result of its favorable progress, NanoPierce will be participating in the key upcoming trade fairs for semiconductor technology worldwide. These include the IMAPS 2001 Exhibition and Conference (Baltimore, October 2001); the SemiCon Europe (Munich, May 2002); the SemiCon West (San Francisco and San Jose, July 2002); and the IMAPS 2002 Exhibition and Conference (Denver, October 2002).

"I am particularly pleased that Dr. Neuhaus and Bin Zou have been invited to give a presentation at the IMAPS 2001 specifically focusing on our WaferPierce(TM) technology," commented Paul H. Metzinger, President & CEO of NanoPierce Technologies, Inc., Denver. "Dr. Wernle is already scheduled to make a presentation on the application of our technologies in the LED field. And now we have the opportunity to report on recent developments in the electroless process for WaferPierce(TM) to a selected audience of technical specialists. Without a doubt, this will significantly arouse the interest of the semiconductor industry in our company."

NanoPierce Technologies, Inc., of Denver, Colorado, USA, is traded on the Nasdaq stock market (NPCT, Trade) as well as on the Frankfurt and Hamburg (NPCT, Trade). In addition to the 12 patents it owns, NanoPierce has numerous applications pending, others in preparation, and various other intellectual properties related to NanoPierce`s proprietary NCS (NanoPierce Connection System). This advanced system is designed to provide significant improvement over conventional electrical and mechanical interconnection methods for high-density circuit boards, components, sockets, connectors, semiconductor packaging and electronic systems.

For more information on NanoPierce Technologies, Inc., please visit this web site: www.nanopierce.com.

This announcement contains forward-looking statements about NanoPierce Technologies, Inc. that may involve risks and uncertainties. Important factors relating to the company`s operations could cause actual results to differ materially from those in forward- looking statements and are further detailed in filings with the Securities and Exchange Commission available at the SEC web site (http://www.sec.gov). All forward-looking statements are based on information available to NanoPierce Technologies, Inc. on the date hereof, and NanoPierce Technologies, Inc. assumes no obligation to update such statements. CONTACT: NanoPierce Technologies Inc., Denver Paul H. Metzinger, 303/592-1010 303/592-1054 (fax) paul@nanopierce.com or NanoPierce Card Technologies GmbH, Hohenbrunn Dr. Michael E. Wernle, + 49-8102-8961-0 + 49-8102-8961-11 (fax) munich@nanopierce.com or Stock Enterprises Inc., Henderson James R. Stock, 702/614-0003 URL: http://www.businesswire.com Today`s News On The Net - Business Wire`s full file on the Internet with Hyperlinks to your home page.

Copyright (C) 2001 Business Wire. All rights reserved.


Hold NPCT and prosper

Jetsia
Hi Jetsia,

ja ich hab mir NPCT schon angeschaut ist auch auf meiner Watchliste bin im Moment aber noch nicht investiert.

Das mit NSCT hast Du ja mitbekommen bin raus !

Ich wünsche Dir auch mehr Erfolg mit NPCT als mit NSCT.

Falls Du was suchst das kurzfristig ein paar Bucks bringen könnte dann schau Dir mal PRTL an.
Die dazugehörige NEWS !
http://biz.yahoo.com/iw/010730/01030008.html

Gruss
DAS_OMEN:D
@Das_Omen,

danke für den Tip, ich hab aber eh` kein Geld mehr (nach dem NSCT Debakel kein Wunder...).
Bei Nanopierce sieht`s ja so aus, als wenn wir hier einen Gewinner haben, mal sehen ...

Hold NPCT and prosper

Jetsia
Hat jemand schon die e-mail von Nanopierce zu der PR bekommen? (ich noch nicht)

Hold NPCT and prosper

Jetsia
So jetzt hab ich auch meine e-mail bekommen :)

Hier noch ein interessantes posting von Kathy auf dem RB Board:

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

Die Aktionäre spekulieren also noch, ob es günstiger ist NCS selbst auf die Wafer aufzutragen oder es die Chip-Fabriken selbst machen zu lassen. Ich denke, darüber wird man sich an zuständiger Stelle auch schon Gedanken gemacht haben ($$$$)

Hold NPCT and prosper

Jetsia
Hi Jetsia!

Wie war der Urlaub? ;)

Zu NPCT, kann man sich irgendwo in einen E-Mailverteiler von NPCT eintragen lassen? Ich wäre nämlich auch an den "Firmennews" aus erster Hand interessiert.

Viele Grüße,

Dirk.
Hi Dirk,

der Urlaub war schön, nur zu kurz ;)

Auf der Internet Seite von Nanopierce (www.nanopierce.com) gehst du zu investor relations, dann zu contact und unten auf der Seite kann man so ein Formular ausfüllen und ankreuzen, ob man Mail haben möchte. Die bekommt man dann immer von Sarah L.Ord.

Hold NPCT and prosper

Jetsia
So, Formular ausgefüllt. ;) Danke!
Ich war schon länger nicht mehr auf der NPCT Seite, allerdings gefällt mir diese sehr gut. Kannst Du Dich noch an die vor etwa einem Jahr erinnern? Die hat damals wohl irgend ein Student zusammengeschustert, zumindest sah die so aus. :D
Hast Du vor zum Tag der offenen Tür im September zu fahren? Ich würde gern hinfahren, allerdings ist es nicht gerade um die Ecke. ;)

Dirk.
Hi Dirk,

keine Ursache! Ich würde unheimlich gerne fahren, aber erstens ist es nicht gerade nah und zweitens bin ich für Anfang Oktober ausgezählt :) , da mach ich lieber keine Weltreise mehr ... ;)

Hold NPCT and prosper

Jetsia
Hier noch eine sehr interessante e-mail von Dr. Neuhaus an Kathy zum Waferpierce Verfahren.
Von Kathy`s Seite:


http://www.investortoinvestor.com/dcforum/cgi-bin/dcboard.cg…

So, mir reicht`s für heute...

Hold NPCT and prosper

Jetsia
Wer am Wochenende mal ein bisschen Zeit zum Lesen hat, der sollte sich mal Kathy`s Zusammenfassung zum Stand der Dinge durchlesen:

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

Hold NPCT and prosper

Jetsia
Neuigkeiten vom Gericht:
http://biz.yahoo.com/prnews/010806/lam088.html

Dies bedeutet, dass Nanopierce 12 Millionen (d.h. noch zusätzlich 4,5 Millionen Aktien zu den bereits gezahlten Aktien) für Harvest Court bereit halten muss, falls diese gewinnen sollten (keine grosse Überraschung).
Auf dem RB Board wurde diese Verfügung, die schon am 1.8. rausgekommen ist, nicht als negativ angesehen. Damit nicht vollendete Fakten vor einem Urteil geschaffen werden, bekommt HC keine Aktien und NPCT muss Aktien bereit halten. Etwas negativ ist, dass das Verfahren in New York stattfindet, was Nanopierce nicht so entgegenkommt (Entfernung...).
Der Prozeß wird sich aller Wahrscheinlichkeit noch mindestens 2 Jahre hinziehen.
Positiv: durch diese Verfügung ist die Höhe des 3. Reset-Datums festgesetzt. Selbst wenn HC gewinnen sollte, was ich nicht glaube, ist die Aktienanzahl auf 4,5 Mill. begrenzt. Wenn Paul HC nicht verklagt hätte, hätten diese den Preis wahrscheinlich so in den Boden gerammt, das von Nanopierce nichts mehr übrig geblieben wäre.
Die Entscheidung hatte wohl auch keinen Einfluß auf den Aktienpreis, da sie schon vor 5 Tagen rausgekommen ist.

Hold NPCT and prosper

Jetsia
Zwei Neuigkeiten heute:

NanoPierce Technologies, Inc. now with two presentations at the IMAPS 2001 Symposium in Baltimore 8 - 11 Oct.
IMAPS 2001 – 34th
International Symposium on Microelectronics

Baltimore Convention Center
Booth Number 1402

Presentation given by Dr. Michael E. Wernle:
"Electrical and Thermal Performance of a
New Process for High Density LED Array Assembly"
Presentation given by Dr. Herbert J. Neuhaus and Bin Zou
"A New Electrical Surface Joining Technology For Flip Chip Application“



Baltimore, Maryland - USA
www.imaps.org



Außerdem:
Neun Aktionäre von Nanopierce verklagen HC auf Schadenersatz (dreifache Schadenssumme) wegen der Aktienmanipulation.


Hold NPCT and prosper

Jetsia
Hat schon jemand die Semiconductor Business News von heute gelesen :) (entdeckt von Garpac im RB Board)


IBM, Infineon, Motorola, and TI in talks to license NanoPierce`s radical IC-packaging technology

By Mark LaPedus
Semiconductor Business News
(08/09/01 16:15 p.m. EST)
DENVER -- Little-known NanoPierce Technologies Inc. is quietly in discussions with several major chip makers to license what it claims is a revolutionary technology that could replace traditional chip-packaging methodologies.

NanoPierce is in negotiations to license its so-called NanoPierce Connection System (NCS), a technology that enables the ability to put microscopic contacts or electrical pads on semiconductors, LEDs, PCBs, connectors, and other products.

The company has initially focused on the LED market, but it now wants to pursue the semiconductor and chip-packaging segments. Its technology will propel and advance the miniaturization of electronic products, said Paul H. Metzinger, president and chief executive of Denver-based NanoPierce.

"We have the attention of every major semiconductor company," Metzinger said. "We`re in discussions with Infineon, Philips, Texas Instruments, IBM, and Motorola. We`re also talking to Boeing," he said in a phone interview.

He did not elaborate on the discussions with these companies, but noted that it will make some announcements by year`s end. The NanoPierce executive did say that the company is in the process of tuning its promising NCS technology for semiconductor, chip-packaging, and other applications.

The company claims NCS could revolutionize the chip-packaging market. "We can replace flip-chip or wire-bonding," Metzinger said.

One of the problems with traditional packaging and connection technologies is simple: space. In contrast, the NCS technology "requires no more space than the area underneath the component itself," according to NanoPierce. "This results in a decrease in space requirements of 90% as opposed to processes being used today," the company claims.

The NCS process is simple. The company deposits inexpensive, microscopic particles such as industrial diamond dust and metal onto a contact surface. This step is performed in a simplified electro-plating-type bath.

"The diamond dust can be applied in a range of grain sizes so that the optimal connection can be created for each particular application," according to the company. "In any case, NCS is a standardized process that can easily be integrated into any existing manufacturing process."

The technology has already been applied in one arena--LEDs. Last year, the company signed a deal with Elcos AG of Pfaffenhofen, Germany. Under the terms, Elcos developed a line of LEDs based on the NCS technology. Today, Elcos` LEDs can be found in SLR cameras as well as the cockpits of Airbus jets.

Now, it wants to go after the chip-packaging segments. In doing so, the company will puruse its technology in the form of licenses. It will also develop and manufacturer the technology for potential customers in a production plant in Colorado Springs, Colo.

Formed in 1996, the privately-held company has secured $19 million in venture capital funding.


Quelle:

http://www.siliconstrategies.com/story/OEG20010809S0041

Hold NPCT and prosper

Jetsia
Hier noch eine interessante email von Paul an Geoff

kurz zusammengefasst/übersetzt:

NCS ist noch nicht in den Elcos LEDs aber NCS erhöht die mögliche LED Anzahl pro Fläche um 100 % !

Außerdem wurde die Bundesklage gegen HC aus strategischen Gründen zugunsten einer Colorado Klage fallen gelassen.

UND: Die großen Chip Firmen schicken NPCT jetzt ihre Testwafer (ah....)

Original (RB post)Here is the text of my email to Paul:

================================================

Dear Mr. Metzinger,

I am a relatively recent shareholder, very excited about Nanopierce`s progress in the commercialization of NCS and in the battle with Harvest Court and their allies.

An article in yesterday`s edition of Semiconductor Business News refers to Nanopierce`s alliance with Elcos. It states, "Under the terms [of the deal signed last year], Elcos developed a line of LEDs based on the NCS technology. Today, Elcos` LEDs can be found in SLR cameras as well as the cockpits of Airbus jets."

As I read this statement, it seems to very strongly IMPLY that NCS technology is already being used in Elcos`s manufacturing of LEDs which are already being used in SLR cameras and Airbus jets, but it does not EXPLICITLY say so. A skeptical reading of this statement (as other posters on Raging Bull have already observed) could lead to the conclusion that it merely says that Elcos LEDs are used in those two applications, and that Elcos has developed a line of LEDs using NCS, but not that the LEDs which utilize NCS are as yet being used in these cameras and jets.

Given that this information has already appeared in print, would it be possible for you to clarify what exactly was meant by this statement?

On an unrelated matter, I`m sure you are aware that it has been reported that NPCT`s Colorado lawsuit against HC has been dismissed, apparently at the request of the company. There has been speculation that a new suit will be filed by the company (not referring to the one that has been filed by shareholders) in a different venue. I realize that it would be inappropriate for you to give information regarding this sensitive matter to an individual like myself before it has been publicly announced, and am not asking you to do so. However, I do wish to emphasize that this is a matter of great concern to me and, I believe, many other loyal but cautious and objective shareholders. I hope that information from the company will be forthcoming very soon. I would also note that, since the filing of this suit was considered by the company to be a material change sufficient to be cause for the filing of an SEC notice, it could very well be argued that dismissal of the case would likewise require formal notification in the same manner. I looke forward eagerly to clarification of this matter by means of the appropriate public channels.

In closing, please let me extend my heartiest congratulations on the company`s progress, as well as my thanks to yourself, Drs. Wernle and Neuhaus, and everyone at NPCT for the long hours of brilliant work which have brought the company to the brink of success.

Best regards,

Geoff Krone

=============================================

Paul`s Reply (complete text) follows (bold emphasis added by yours truly):

=============================================

Date: 10-Aug-01 10:46:00 MsgID: MC3-DC20-5C9E ToID: 75110,470
From: "Paul H. Metzinger" >INTERNET:paul@nanopierce.com
Subj: NanoPierce
Chrg: $0.00 Imp: Norm Sens: Std Receipt: No Parts: 1


Geoff,

Elcos has developed LED arrays used by Airbus and in SLR cameras. These LED arrays do not at the current time use NCS.

Elcos is developing new designs for LED arrays which will use NCS. Using NCS Elcos can increase the density of LEDs in an array by 100%. This will be a big market for NCS. We are also in conversation with the two largest LED joint ventures in the world.

The Harvest Court federal suit was dismissed, without prejudice, by the Company for strategic legal reasons. An identical Complaint was simultaneously filed in the Colorado Courts. No material change occurred and it is our opinion no 8K Reports is required. For many reasons venue in the State Courts is more favorable to our cause.

Thank you for your kind expressions of loyalty and support.

WaferPierce will change the connection technology for the entire micro-electronics world, in our opinion. Many global players, I believe, are beginning to share that opinion. They are now offering to provide test wafers without solicitation from NanoPierce.

We have very big dreams and great expectations.

Sincerely,

Paul H. Metzinger
President & CEO
NanoPierce Technologies, Inc.

Quelle:
http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…



Hold NPCT and prosper

Jetsia
Kathy hat auf ihrer Seite die Gerichtsunterlagen der Klage der NPCT Aktionäre aufgeführt (da kann man nachlesen, was HC & Co. so ales angestellt haben sollen):

http://www.investortoinvestor.com/dcforum/cgi-bin/dcboard.cg…

Hold NPCT and prosper

Jetsia
servus,
ich schaue mir immer wieder euer board hier an.
was meint ihr, lohnt sich jetzt der einstieg?
übrigends, ich bin über iobjects und kathy auf NPCT gestossen.
kathy scheint sich sehr um aussichtsreiche zukunftswerte, wie iobjects, zu kümmern.
TheCoolWickerl, für eine ganz objektive Meinung ist das hier vielleicht nicht der richtige Ort (LOL). Die Leute die schon investiert sind, sind natürlich davon überzeugt, dass es sich lohnt einzusteigen. Aber es kommt auf deine Risikobereitschaft an, denke ich. Wenn Du sicherer gehen willst, wartest Du auf die ersten Verträge, durch die Technologie als vollwertig anerkannt bzw. als tauglich bewiesen wird. Vorher ist alles natürlich Spekulation. Der Vorteil jetzt ist natürlich der niedrige Aktienkurs. Das Risiko: die Technologie funktioniert nicht wie gewünscht, ist nicht so kostngünstig, wie gedacht, ein Konkurrent erfindet was besseres etc., irgendwann geht NPCT ohne Verträge pleite ...

Das muß jeder für sich abschätzen, wenn`s klappt sind wir reich, wenn nicht pleite...

Hold NPCT and prosper

Jetsia
PREPUBLICATION ABSTRACT
IMAPS 2001 Baltimore, Maryland October 9 - 11, 2001
CONFERENCE INFORMATION


Electrical and Thermal Performance of a New Process for High Density LED Array Assembly


Michael E. Wernle, Michael Kober


Advances in the development of white and blue LEDs (light emitting diodes) have now made LED semiconductor components available across the entire color spectrum. This development opens the door to new, previously unknown applications. Of particular significance are high-resolution displays and LED arrays, components that have up to 8000 LED dies on an extremely small area (~20 cm2). These components require innovative mounting technologies. Conventional methods, including conductive adhesive, are hard-pressed to fulfill new, more rigorous demands, such as a pitch of less than 100 mm. Moreover, achieving maximum light yield at minimum production cost is a decisive factor for new low-cost applications. This paper introduces a new technology for mounting LED dies on FR4 and ceramic substrates. Specifically, this process involves embedding miniscule particles of diamond dust by means of an electroplating plating process into a conductive nickel layer, thereby producing a very rough, conductive layer similar to sandpaper on the substrate. This process, also known as NCS (NanoPierce Connection System), has now been adapted to make it suitable for use with LED dies backed with an extremely thin layer of gold. In addition to modifying the roughness and particle density of the NCS surfaces, suitable adhesives were selected in order to ensure that benefits such as low transfer resistance and good thermal conductivity are maintained. Comparative tests with conventional production processes, such as those using conductive adhesive, indicate a marked improved in the electrical and thermal properties. Furthermore, the paper will demonstrate how this process can significantly contribute to increasing the density of LEDs per cm2 and hence maximize the light yield.

IMAPS 2001 Baltimore, Maryland October 9 - 11, 2001
CONFERENCE INFORMATION
Quelle:
http://www.flipchips.com/abstracts/PPWernle.html
gepostet von Kathy auf dem RB Board
http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…


Hold NPCT and prosper

Jetsia
servus Jetsia,
danke für deine schnelle, alsauch ehrliche meinung.
ich werde den chart entscheiden lassen ob ich kaufe oder nicht.
im grunde bin ich von der techologie sehr angetan.
halte uns bitte weiterhin auf den laufenden.
hi jetsia - schön und Danke das du einen neuen thread eröffnet hast.
Gern geschehen GelbeSeiten/thecoolWickerl

Auf dem folgenden IMAPS Thread diskutieren technisch versierte Leute über NCS/NPCT:

http://www.imaps.org/ubb/Forum5/HTML/000006.html


Und hier ist noch ein Board auf dem (auf Deutsch) wesentlich lebhafter als hier über Nanopierce diskutiert wird:

http://nanotechinvesting.swiftsolution.com/getpage.asp?page=…

Hold NPCT and prosper

Jetsia
Braucht jemand einen neuen Motivationsschub? Hier ist ein neues Wallstreet-Interview:

http://www.wallstreetreporter.com/v2/asp/profile/default.asp…

Hold NPCT and prosper

Jetsia
Ich glaube, diesen Link hatte ich noch nicht geposted. Es ist ein Vortrag von Dr. Neuhaus zum Clean Room für das Board of Directors (da kann man dann auch die netten Waschmaschinen oder was das ist begutachten...):

http://www.investortoinvestor.com/nanopierce-b.html


Hold NPCT and prosper

Jetsia
eat_a_rock und finnegan haben dies auf dem RB Board ausgegraben:


In der gestrigen Ausgabe der Druckversion von EETimes ist folgender Artikel erschienen (wohl ein Abklatsch des Siliconstrategies Artikels):

http://www.cmpnet.com/post/docView?docid=EET20010820S0028&ku…

August 20, 2001, Issue: 1180
Section: SEMICONDUCTORS
--------------------------------------------------------------------------------
NanoPierce readies packaging alternative


Denver - NanoPierce Technologies Inc. is talking to several major chip makers about licensing its chip-packaging approach. The NanoPierce Connection System (NCS) puts microscopic contacts or electrical pads on semiconductors, LEDs, pc boards, connectors and other products. The company electroplates microscopic particles such as industrial diamond dust and metal onto a contact surface. The diamond dust can be applied in a range of grain sizes for optimal connection. Last year, Germany`s Elcos developed a line of LEDs based on the NCS technology.



Ein bißchen Publicity kann nicht schaden...

Hold NPCT and prosper

Jetsia
Die Tagesordnung für den Tag der offenen Tür ist auf derNanopierce Internetseite geändert worden (vielen Dank an Dieter und Finn, die die Unterschiede aufgespürt haben)

Alle Sprecher sind jetzt namentlich aufgeführt (auch von Fraunhofer Institut und der Universität Göppingen):

Weitere Änderungen:

- Dr. Bock vom Fraunhofer Institut wird über "Thinning, handling and assembly of ultra-thin chips" sprechen

- Das Thema für Schreiner hat sich geändert: Anstelle von "Are smart labels really that smart?" heißt es jetzt: smart labels in practice (in practice!)

- Ebenso hat sich das Thema von Simotech geändert: "ModulAS-RFID – a flexible solution for the cost-effective manufacturing of smart labels, contactless chip cards and multi-function cards"

- "Nanopierce in practice" ist nicht mehr auf der Tagesordnung sondern eine offene Diskussion mit Paul Metzinger, Dr. Wernle and Dr. Neuhaus.


Hold NPCT and prosper

Jetsia
Tausend Dank an Finnegan23, der gestern dieses Interview mit Dr. Wernle führte und auf dem RB Board gepostet hat:


Ok, interview with Dr. Wernle, 1/5 (introduction)

This is a transcript of an interview (by phone) with Dr. Michael Wernle, CEO Nanopierce GmbH I conducted today (08/27/01).

Dr. Wernle has sacrificed 2 hours of his time for it (so did I, but mine is cheaper *smile*)

It is divided into 5 parts:

1 (introduction),
2 (Open House, Dr. Wernle`s attitude towards the message boards, share price),
3 (technology),
4 (contracts, revenue, future prospects),
5 (conclusion and abstract).

I recorded it and am trying to mirror just the facts. But please keep in mind a few things:

- This interview was conducted in German (of course). I tried to translate it as accurate as possible but I am not a professional interpreter, just an average guy with his school English - so PLEASE do NOT try to read anything between the lines.
If you do so and find something, it will most probably be due to my poor translation and not to Dr. Wernle`s intentions! Look for the big picture instead.

- As I said, it was a 2 hours-conversation. So of course the talk went here and there and back again. . . I summarized a lot of it and I rearranged a lot of it. Things quoted here in my transcript are not necessarily in chronological order like they have been discussed in the original interview. This, btw, is journalism....

- I did not add anything. I left out a few things because they are not important IMO or because Dr. Wernle asked me to do so.

- Feel free to discuss this interview and to quote it (also in excerpts), but please do not ALTER anything. I wish to keep it FACTS.

Anything in Italic is a question or an remark from me.

Thanx
F.

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

Dr. Wernle, what do the RB members need to know about the Open House?

I want to ask you a favour: Anyone who has not sent an application form yet should do so. There are some posters who want to attend but we don`t know their real names so we can`t tell if they have applied yet. Anyone reading this: Just apply per email or fax. Of course no one needs to tell us the RB alias, we don`t want to know this, we just need to plan... seats, lunch, and so on.

How many applications have you received so far?

Up today, 76. And that`s about the maximum capacity. But everyone is invited, there is no limit and no deadline. We just ask everyone to send us a short notice - fax or email.

Who will be attending the Open House?

Mostly share holders and press people. And of course our partners like Elcos and Simotech.

Any customers?

I don`t think so. We will meet the customers before and after the OH. Some of them still want to keep things confidential and it`s simply impossible to talk two or three hours to customers during the OH for Paul, Herb and myself. This would be extremely disrespectful towards our guests.

"Nanopierce in practice" by Mr. Maier and Mr. Kober is no longer on the agenda. A self-evident conclusion would be: There are technical problems...?

Not at all! The reason why we included this in the speaker`s list was simple: We did not know exactly what our partners intend to speak about and we wanted to make sure our guests get an impression of the current state of our technology. This is no longer necessary now, as almost every speaker has included the practical aspects of NCS in his talk. For the doubters, if there are any, we will show active and fully functionable samples in our laboratory.

I was told you will have an interpreter at the OH?

Yes, many of our guests will come from abroad, mostly from the U.S., so there will be a simultaneous translation and of course a radio transmission for our English speaking guests.

Many companies are staging their OH at a hotel or congression center. You have told us you will reach your maximum with 100 guests or so. What prevented you from simply renting some space in one of the bigger hotels?

Well... there still are people who don`t believe we have facilities at all. We did not want them to think "ah, an hotel, guess, there is no lab to show, it`s just a fake". We will show everything we are able to without giving away our company secrets. But you are right: This will be the last time we can do so. There are only a few thousand share holders world wide now. Next year things will be different and there will be way too many share holders to show every one of them what we are doing.


Dr. Wernle, please tell us if you are aware of the discussions on the message boards and give me your personal opinion about them...

Of course we are following the message boards. For example, I am surprised by the high level of discussion on the Nanotechinvestor board (this is a German board, manfred is the boss there - F.).

We watch the other boards, too. Many things which are discussed there are just nonsense. We keep asking ourselves why no one just picks up the phone and gives us a call - most of the questions could be cleared up within one minute. It`s that easy: The US people have their contact persons, the Germans have their`s. I`d really wish people would talk less and call us more often.

But we are quite amazed at the fact how deep people are digging. I tell you something interesting: Most of the links posted on the Raging Bull board are in no way connected to our company. But from time to time it is very interesting for us, we learn from this of companies we have not thougt of yet, we get new ideas... Sometimes, at lunch, we talk about some link..... My "favorites list" is still growing, and the boards keep contributing to it. I am amazed at the time people are contributing to this company.

Sometimes we are getting really angry at what some people are posting. But there is no way for us to clarify things for two different reasons: First of all, this is a legal problem. A company`s CEO must not answer accusations on a message board. Second, it is a practical problem: If we answered, we would drown in the discussion following... I can only ask every interested person to call us...

The share price seems to be artificially depressed, at least that`s the impression I have.

I can`t tell you anything about that and I don`t want to. But I know you can play games with the shares of many companies because their business plan is not intact or they have no business at all if you watch close. What I do know is that this will not work with Nanopierce. The design-in phase takes it`s time because we are doing business in an area which makes it impossible to come up with results quickly. But believe me, we have our Business Plan and we are ticking off one item after the other. It may seem to take long, but we are very persistent and things are on schedule or even ahead of it.

It could be a tight race anyway... Are you running out of money?

No, not at all. We are having enough money, not only for this year, but for 2002 also. Any attempt to keep the share price depressed, won`t succeed. It would mean fighting the windmills. In the long run no one will be able to prevent our stock from running up. This is my true conviction.

There are a few people who keep sawing on the Nanopierce branch, for what reason ever. I know this. But we are sitting on the side near the trunk and they are sitting on the wrong side. Maybe they don`t know - I do.

But you won`t object when one says NPCT is still a risky investment?

There is no guarantee. If you want to buy something for your retirement arrangement, you should by Deutsche Telekom. (German Telekom shares are under heavy pressure at present because of very heavy institutional selling from Hutchison Whampoa and Sonera, F.) But the risk with NPCT is no more high. It has been high in 1999 and during the first half of 2000. Now things are looking extremely well. As an investor I would worry if Paul Metzinger, Herb Neuhaus and me would leave the company - but this won`t happen. Even if only one of us stayed with the company it would not be an unsurmountable problem. Many don`t see there is an outstanding team now, it is working very well. Did you know Paul, Herb and me don`t ever get on the same plane?

Like the President of the USA and his vice president?

Yes. We had an appointment, not too long ago in.... well, it doesn`t matter where, but Herb took a different plane. ? Yes, I am serious.


http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

part 2/5 (contracts, revenue)

There are many questions about revenue. Where will this company get revenue from at all?

We will live on volume. And the volume is just huge. 1.9 billions of smart cards will be produced this year. That`s a 300 million more than in 2000. We have no need to replace existing technologies - we can profit from growth alone. A certain market share will be more than enough to turn Nanopierce into a very profitable and very big company.

What is "a certain market share"?

Look at Dell. They are the #1 PC manufacturer. Their market share is 12.8 percent. I would not say they are a small company.

Will we live to see the day when NCS is a connection standard?

There will never be a "standard" in the packaging industry in my opinion. This sector is way too complex. There are fields we can`t cover. Automotive chips and airplane chips are examples. Connections must have a life cycle of 15 years or more there. We won`t aim at this. Not now, at least.

What are the markets you are aiming at?

Our big advantage is that our markets and our products already exist. We don`t have to invent business models and products, we don`t need to convince anyone that there is a demand for NCS. The semiconductor business is well established but it urgently needs some economization. It is a well known technology and everyone is seeking desperately for a possibility to manufacture things cheaper. This is where we come in.

There has been some confusion: How much is the worth of a single connection? And how much cheaper is NCS?

It depends. For a normal chip you can charge 0.8 up to 1 cent per single wire connection. Assume you can save 25% with NCS. With 4 to 8 connections this means 1 or 2 cents per chip. This would mean 1 million dollars per 100 million connections. 1 million dollars isn`t much. But for some applications 100 million chips isn`t much either. One single fab of a big chip manufacturer produces 15 billion chips per year.

But Nanopierce is just a packaging, not a manufacturing technology?

Most people are not aware of the fact the packaging accounts for 70% of the worth of a chip. Therefore the cost pressure is immense. If you can offer 25% or just 10% savings potential, this is HUGE.

Some day you need real customers. What can you tell us about the feedback from potential clients?

You must know that Marketing & Sales Dep. is in Munich so I am very well aware of the developments in this area. What I can say is: we are on track. But one must never forget we are not producing websites - we could easily come up with results within five weeks or so if we did... But this technology needs time. We are not able to impress investors with immediate results after a few weeks. This is difficult and I am very well aware of it, but it means an advantage, also: It means an important barrier to any competitor, because it is very difficult to make a company big under these circumstances. It is even very, very difficult to make a company survive if you need a certain time frame to develop your products under deteriorating market conditions. I have to add we never would have been able to achieve our growth, not even our survival without Paul (Metzinger).

Another advantage is the "exit barrier". Any customer who uses NCS won`t abolish it frivolously. I know a few production managers. They don`t change their production easily. Not in, not out.

Many people are just waiting for revenue, nothing else. When will we see significant revenues from Nanopierce?

It will grow step by step. No big manufacturer will reorganize his complete production just because he is convinced our product is great. We don`t recommend this by the way. He will start with converting one single line. If he is smart, he will not start with a new product but with a product he has been producing before and he knows very well. He will wait for complaints from his customers. If there are none he will convert more and more production lines. This is when our revenues will grow exponentially.

What are your targets? There has been some confusion: Smartcards, LEDs, Waferpierce?

At present we are aiming at small chips with few contacts because pricing pressure is highest here. This is where we start, we are doing our homework, we will earn big money. We have many ideas for many years, but this is where we start - we need some revenue first.

Let`s assume a manufacturer can save 1 cent per connection. What will NPCT receive?

We will always ask for our "fair share" but this depends. I can`t imagine anything as a price list. For example: There are manufacturers which have tried to manufacture a new product with existing technology but have failed. If NCS makes it possible, we would charge them a lot higher than .... let`s say Intel. I did not say we are in negotiations with Intel.

Another one: License or manufacturing? A crucial one, anyway: Where is the bigger revenue?

We will concentrate on licensing. We will make wafer deposition, but when volume becomes bigger I guess we will realize it at the manufacturer`s fab. There are crucial advantages: The manufacturer needs to invest almost NOTHING. You would be scared if you knew how cheap it is... revenue will decrease, but profits will rise, because we will be able to reduce costs significantly. It will be just a license and we will write a bill. Oh, yes, we will have to pay an accountant every three months to check the balance - but we can handle that...

Do you plan to hire more staff?

I don`t think so, not at present. We have reached a point where we are able to degenerate revenue growth and growth in staff. With our new wetbench in Colorado Springs we are able to produce 1000 wafers per month with one worker in one shift - this will be sufficient for now. And licensing doesn`t mean: You have one sales manager producing 1 million revenue, you need two managers for another million. It`s just one more bill...

This sounds perfect. But when will we see real revenues?

You have to understand it takes it`s time. It`s not like you sign a contract and receive any money soon. It takes at least 2 to 3 months in this sector: Assume you have signed a contract. The manufacturer still has to get rid of his "old" product. Then you have to implement the new technology. Then he will manufacture a new product. After this he will sell it. He will wait for complaints. After this he will pay you. This means you won`t see many sales in the balance sheets of Nanopierce for the 3rd and even the 4th quarter of 2001. We will have contracts, but you won`t see the numbers. But this will just be a matter of time. It may not come as soon as many are hoping for it, yes.

Just one single announcement of a contract could make everyone happy. Will we see anything like this soon?

We are still testing. Imagine a really big company testing - I just say, imagine. Imagine the test results are really great. They will never state this publicly because they will never tell their rivals they have found something new, cheaper, faster, more reliable. Nanopierce in turn will have to remain silent - we are not big enough to change the rules.

But you could announce: We have a big customer, he signed a contract?

Yes, we could. But all we could say is "Test results have been superb, the customer is happy, he signed a contract, but we won`t tell you the conditions and we won`t even tell you who the customer is". This would provoke all the same fear and doubt we already know. We may even sign a contract with a big company and the public will never get to know who he was- it will be just revenue in the quarterly.

This sounds strange: A publicly listed company never being able to tell who their customers are in public?

We know we have to make announcements. But at the same time we know have to remain silent - and this is difficult. One possibility we think of is the following: You must know there is a certain procedure in this business: interest. talks. cooperation. tests. evaluation of the technology. evaluation of marketing the technology. purchase orders. revenue. profit. A solution we have in mind is to tell share holders we have a cooperation agreement - this is an important milestone. We may not be able to tell anyone about further negotiations. But when our share holders have seen a "cooperation" turning into revenue 2 or 3 times in the quarterly reports we are hoping they will trust in the companies ability to do so. We know if we have supplied evidence for this one or two quarters things will become much more easier.

Well, this is not exactly what many of your share holders are waiting for...

I know that many will hate to hear the following, but I can bear with displeased investors much better than I can bear with displeased customers right now. It`s all about trust and confidence. If you let your customers down only once you`re done. There are many examples for this on the Nasdaq or the German Neuer Markt. You might think of the semicon world as big - it is a small village. And Nanopierce for sure does not want to be the inhabitant everyone is gossiping about.

Revenue would`nt be bad anyway...

Believe me, I could generate some revenue within the next quarterly... one IBM warehouseman WILL order something - this is how many companies generate their references, by the way. But if I have one belief it is one word: sustainability. I don`t want revenue fast and one time. I don`t want the share price to be high next year, even if this is hard to accept. I want the share price to be high over the next few years. We will be measured by our dividend some day and I know we will be able to pay a ridiculously high dividend. We have plenty of good ideas and we will be very big but we will need big revenues for some years. We have seen what happens to companies whose revenues slump - they never come back. I want to increase revenue step by step and I want to stay on top. If we succeed we won`t have a problem to realize more, much more lofty goals.

(part 4 to follow)


http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…



part 4/5 (technology) 3?4?5? what the h3ll do I know? *lol*

There are still concerns: Can you tell us wholeheartedly this technology is working?

Without any restriction: Yes. Our samples have been performing just perfect during our tests. We are now testing them in a really invidious manner at extremely high temperatures - and they still are keeping it up. They are doing even better than we ever expected.

This could still be a technology which is a perfect idea but no one needs or buys. Are you sure you passed this stage?

We have never been there. Otherwise Paul, Herb and me had never went aboard. I always have been sure about it: This is something special, it will work and it will be worth the risk.

Are you are sure you can SELL it?

Yes. 100%. More than ever. Many people haven`t understood what we really do. Electroless Waferpiercing has been a big step. Usually one must do the electroplating with electricity. This bears significant disadvantages. Now we are able to do it by a chemical procedure. I ain`t sure everybody knows what big advantage this means.

It`s all Waferpiercing now. Have you put the Smartcards and LEDs on hold now?

That`s a big misunderstanding and I am glad you are asking: Waferpierce is not all a competition to LED and Smartcard. The latter are applications of NCS. I admit we may have mentioned the applications too often but the sole purpose has been to tell people what you can use Waferpiercing for... There IS something else, by the way, but it is something completely different: Ultra thin printed circuits (we can substantiate reflowing) and NCS on thin metal parts, e.g. on test sockets. But our test results with Waferpiercing have been overwhelming and so we decided to go for it now.

I have learned NCS is cheaper and better than anything else in the market. This is too good to be true. Could you give us an example?

It`s not only about cheap. One example: If you have many very small devices on a circuit board, you currently have to solder them and then the board goes to the reflow oven. If one of the devices is flawy you have to throw away the board. And you can only test after 35 minutes. With NCS you can solder the components and test them immediately. If there is a flawy one you can still replace it while the adhesive is soft. This means: Less time, less scrap. This is convincing to say the least.

Lead-free must be a big opportunity for NPCT?

No, not as big as some people suppose. We`re not here for displacement of other technologies. And we won`t go after the automotive and airplanes market for now. One advantage is, we ARE lead-free and there won`t be any problems with NCS at a later date.

So, please tell us about your manufacturing process after all?

I sense many people haven`t understood yet we won`t go into manufacturing chips or anything else. We are refining products we are receiving from customers. Thence it is funny sometimes to read on a board "there is a new chip from Infineon, is NPCT involved in it?" We are in the packaging business, not in the chip business.

There may be one exception: Smartlabels. This is the only product I can think of we may manufacture. It is a very promising market and our reasons to produce them are as well historic as driven by know-how and connections.

(part 4/5 to follow.. 5? darned, got mixed up *smile*)

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…


4.5/5 *smile* (future prospects)

What concerns many investors: Will we get any proof soon? This month? This year?

There will be announcements this year, yes. Maybe not figures, but significant news. Anyone who is able to read them will see what is about to come - maybe some will shrug it off but this is not important to me. I like one comparison very much: Look at the sea. You can`t see nothing but a few small waves. Then suddenly they are getting closer the beach and they are becoming a crusher. No one knows where it came from. But everyone could have seen it. It was a huge amount of water. And it had been there all the time. Some see it, some don`t.

Is there one single day you are looking for? Will it build gradually?

Perhaps a new marketing manager will join and everybody will say "oh, well, he did it, finally", perhaps we may install an COO and it will be the trigger for an instant rise of the share price. Whatever it will be: In reality it will be the harvest of long and hard work. One just has to wait. But I know waiting is difficult for investors, yes.

This is quite sassy, but could you give us any prediction of a fair share price?

As I said, I am following the boards and I am pretty staggered what many people expect, no, not WHAT they expect but within which time frame. Much of this is unrealistic. But what I want to mark is: Many share holders are waiting desperately for $4 to make it to the Nasdaq. But $4 is not $8 and is not $15. $4 is an important interstation for us, but just an interstation. We will go far beyond. It just takes time, but I know this is hard to sustain.

One last question: Technology is evolving, faster and faster. Give me a reason NPCT will still be there in 2003?

That`s a simple one: The necessity of connecting electronic components has been existant for more than 100 years now. And it will be there 100 years from now. No matter how small, how sophisticated the components get - you will have to connect them. Connections are never going to be superfluous. And IF you need to connect something, Nanopierce is an excellent position..

This may sound ridiculous but you raised my hopes for early retirement.

This is what we are working for, believe it or not. This may sound ridiculous to YOU, but we have yet treasured a few items for our own museum. We are just looking for a show-case.



http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…


5/5 (abstract, conclusion)

I won`t provide an abstract in detail. I think the interview speaks for itself and I guess any discussion on the RB board will be the best abstract. I am quite aware of the fact it may add fuel to the fire for a few bashers but I did not want to leave anything out (I`m still hoping objectivity pays off).

I rarely added anything personal to the transcript, so I may add a few words here:

- Dr. Wernle did not sound excited, he did not sound optimistic, he did sound CONVINCED.

- I called Friday and asked for this interview and we talked 2 hours today (Monday). He did not try to convince me of anything, we just talked, he answered my questions and contributed a tremendous amount of sheer information. I have talked to many officials from tech-companies before but have rarely met someone being so ..... relaxed *smile* (beg pardon).

- The real world is out there in Colorado Springs and in Munich. Any attempt to bash this company only succeeds if one ONLY lives within the virtual reality of a message board (don`t get me wrong: I don`t want to live without it...).

- For me, Nanopierce is just a small company now... Smaller than one might imagine, but much more promising as we imagine. Maybe we won`t see $100/share for 5 years. But this company is for real and there are GREAT things to come. JMHBERO (© Geoff), but it takes a lot more than "IIIIIhhhhhhh.... CEO ..... racketeering" to convince me of the opposite.

- Want to relax? Call your CEO (well, JUST DO IT!!!)

- I won`t sell a single share until I see Paul Metzinger, Dr. Wernle and Herb Neuhaus in ONE cab heading for the airport *g*

- It seems we need some more patience. If you don`t have any patience left - well...

Best regards
Finnegan

>>>>>>>>>>>

KLASSE!!!!
Hold NPCT and prosper

Jetsia
Hallo Leute,

ich bin nicht in Nanopierce investiert, sondern habe nur ein Auge darauf, weil ein Freund von mir (der einige hält) im Urlaub weilt.

Sind die heutigen Umsätze in den USA normal?

Viele Grüße, Jacqueline
agabimu,

Das Volumen war überdurchschnittlich. In den letzten 20 Tagen wurden im Durchschnitt 145 000 Aktien täglich gehandelt, in den letzten 150 Tagen 194 000. Hier ist eine Seite mit einer technischen Analyse, die solche Daten aufzeigt, genauso wie Widerstände, Unterstützungslinien etc:

http://www.stockscores.com/index.asp?page=getreport&componen…

Hold NPCT and prosper

Jetsia
Herzlichen Dank für die Auskunft Jetsia und den Link.

Viel und baldigen Erfolg wünscht Euch Jacqueline
Hier sind zwei sehr interessante postings von finnegan/MIDASTCH vom RB Board:



Dr. Wernle interview addendum / correction

Today Dr. Wernle told me he thinks the transcript and translation of the interview was good but he made me aware of one error:

I may have given the impression Nanopierce would not "manufacture anything and just hand out licenses." Of course this isn`t accurate.

Nanopierce will refine wafers. Only with volume increasing for a single customer this will be done at the customer`s fab.

Quote Dr. Wernle from today:

"Even after this we will still keep refining wafers at Nanopierce. This is due to three reasons:

1) An in-house production will not make sense for our smaller customers. We will do it on behalf of them at Nanopierce.

2) We still will have to refine wafers, for example to make samples for our new clients.

3) Even the bigger customers want to have a "second source" of production in case their production fails. For example: a leaking galvanization bath can paralyze your production for weeks.

We could not take the complete production volume, at least not for a big customer, but a certain percentage of it. The only other possibility for a company to keep the manufacturing process going would be production at a competitor`s facility - and most companies certainly don`t like this possibility."

Unquote.

Separate from this error I felt Dr. Wernle was very happy with the interview - not because it was so optimistic but because it expressed what he said and what he meant to say. Well, so it`s confirmed now ,-)

(I`m happy with it too, even if I know there are many spelling and grammatical errors in it, but I ask everyone to gently ignore them - it was 5 a.m. and you know I am a Bavarian - I`m still not very good with GERMAN, let alone ENGLISH...)

Best regards
Finnegan

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

E-Mail from Paul
My good friend Dennis E-mailed Paul with a few questions
and Paul was kind enough to answer them for him.
Dennis has been very busy so I asked for his permission
to post his e-mail and he gave me the ok.

Paul,
Let me begin by saying I`m A LONG time holder of NPCT.
I would like to ask you a few questions if I could.

1. Where do you see the company in 3 months?

2. Do we still do software for Lipag,and if so have they
sold any machines with it?

3. Do you see Gemini selling in Oct.????

This is Paul`s response.

Dennis,
1.Dealing with multiple global players in the Wafer fab
industry and smart label manufacturers.

2. Yes, we are still working with Lipag.Equipment designed
by Simotec incorporating our NCS will first likely
go to smart label manufacturers.

3. Gemini will not sell.It continues to buy Nanopierce
betting wisely- on the future potential.

4. Thanks for the loyalty and support.The Open House will
be "momentous".

Sincerely,

Paul Metzinger

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…




Hold NPCT and prosper

Jetsia
Kathy hat auf ihrer Seite noch zwei kleine Artikel ausgegraben, in denen Nanopierce erwähnt wurde:

Nanotech Planet und Smart Card Portal:
http://www.investortoinvestor.com/dcforum/cgi-bin/dcboard.cg…

Außerdem weist sie nochmal darauf hin, dass der Test-Wafer nach dem Philips RFID Standard aus ultra-dünnen Chips für den Samrtlabel Bereich besteht (ist schon merkwürdig, wie das alles zusammenhängt, Lol)

Hold NPCT and prosper

Jetsia
Ende September findet in England eine Smart Label Konferenz statt. Auf dem RB Board wurde nun gefragt, warum Nanopierce nicht teilnimmt/ausstellt. Geoff hat daraufhin Dr. Wernle gemailt und folgende Antwort auf dem RB Board gepostet:


>>>>>>>>>>>>>>
Dr. Wernle replies re: Smart Label Conference

Sarah forwarded my inquiry to Dr. Wernle, who sent me the following reply last night. Not only does he confirm what Zties said about the reasons for not attending, but he also lays out the company`s overall strategy in terms of marketing to the industry for the next few years. It is astounding to me that such an extraordinarily busy man will find the time to address a shareholder inquiry in such detail. If this company has any faults, responsiveness to shareholders is sure as heck not one of them!

=============================================

Geoff,

Thanks for the information about this exhibition, this event and the organizer (idtech)are well known to us. I visit conferences like this since I started in the RFID business approx. ten years (1992) ago. There are approx. 30 major exhibitions and conferences worldwide related to
RFID, we cannot visit all of them.

Events like this are more important for users and system integrators of RFID systems. The comment on the RB that potential customers from NanoPierce are there is right, but the reason for them is to get information about the application side of this business.

These companies inform themselves about the manufacturing problems for smart labels (e.g. flip chip processes at conferences like IMAPS or Semicon. There, the whole semiconductor backend assembly industry is present. These events are much more important for NanoPierce because we can meet people out of the RFID label business AND all the other potential users of NCS and WaferPierce (=NCS on Wafer level) together. Here it is possible to use our sales & marketing power more effective.

Maybe the structure of the industry is interesting for you

1) RFID label semiconductor manufacturers: 5 mayor players, 3-4 the rest

2) Smart inlay (=chip with coil / antenna) manufacturers: approx. 10 with some volume

3) Smart label (Smart inlay between printed overlay and adhesive underlay sheet) approx. 40

4) Integrators (System, Readers, Software, Consulting, ...) : approx. 500

5) Users: >>>>

This event is really important for 3-5, NanoPierce is focused and has to be focused on 1-2. As a result, our technical sales activities at this time are well structured to meet these requests:

first year: face to face meetings
conferences for specialists
(publications)
second year: face to face meetings
conferences for specialists
publications
exhibition Imaps (Baltimore)
third year: face to face meetings
conferences for specialists and users
publications (in more simple periodicals as well)
exhibition Semicon Europe (Munich) and Semicon West (San Jose) and Imaps (Denver)
advertising in selected periodicals for the semiconductor industry

We have decided to follow a key account principle. We want to have, that if somebody is interested in NanoPierce, he has enough time to concentrate on our explanations and to understand NCS and WaferPierce. Large events are sometimes not helpful, the quality counts, not the number of people. And to be on the radar screen of large potentially
users we have done enough in the last time, the response speaks for itself.

And: Smart Labels are not the only application for WaferPierce, there are, from a volume point of view, stronger applications (DRAM Memory modules, Smart card chip modules 1.9 Billion in 2001, LED, ....). Smart
Label ist a market at the beginning and will be a nice playground for NanoPierce, but other markets are here, today.

This statement does not mean that nobody from NanoPierce will attend this event ...

Call or mail me if there any questions, it`s now 8:30 pm, I am sorry, I have to leave the office now for an outside meeting, so I can answer your questions earliest on Monday, I hope it`s ok.

best regards and a nice weekend, Michael E. Wernle


Quelle:
http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…
>>>>>>>>>>>>




Wer sich für "electroless plating" (das NCS wird mittels electroless plating aufgetragen) interessiert, kann mal diese postings auf dem RB Board lesen:

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…


Vom Zusammenhang zwischen den Nanopierce Testwafern und Smart Labels bzw. über die Zukunft des Smart Label Marktes handeln diese postings:

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…



Hold NPCT and prosper

Jetsia
Beinahe hätte ich den Link zur Konferenz vergessen, um die es ging (na ja, so wichtig scheint er ja eh nicht zu sein LOL)

http://www.idtechex.com/conference.html

Dr. Feraric von Simotec wird wohl auf der Konferenz sein.

Hold NPCT and prosper

Jetsia
frogdear vom RB Board hat Paul Metzinger in einer e-mail gefragt, ob der neue technologische Durchbruch bei der Chip-Herstellung von Motorola (in dem GalliumArsenid und Silicon verwendet werden)Auswirkungen für Nanopierce hat:

http://www.theregister.co.uk/content/3/21450.html

die Mail und die Antwort hat er auf dem RB Board gepostet:

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

>>>>>>>

E-mail from Nanopierce:

Concerning the question from yesterday about the implications for Nanopierce from the new technology announced by Motorola.

Quote:

Dear Martin,[frogdear]

The Motorola Announcement is great news for us. More and cheaper chips to be
used by the industry.

Just remember each chip must be CONNECTED to something. NanoPierce is a
CONNECTION TECHNOLOGY!

Go Motorola!

Sincerely,
Paul




>>>>>>


Hold NPCT and prosper

Jetsia
Hier ist eine Kurzbeschreibung des Vortrages von Bin Zou, Robert Bahn & Herb Neuhaus


>>>>>>>

IMAPS 2001 Extended Abstract

A New Electrical Surface Joining Technology
For Flip Chip Application

Bin Zou, Robert J. Bahn, and Herbert J. Neuhaus
NanoPierce Technologies, Inc.

NanoPierce Connection Systems (NCS) is an emerging technology for electrically and thermally conductive joining of metal surfaces. It involves embedding miniscule particles of diamond dust in a conductive nickel layer plated onto a metal surface such as an IC bond pad. The result is a very rough conductive surface, similar to sandpaper. The hard, sharp particles will penetrate the mating substrate contact surface, displacing oxide films and even adhesives to provide conductive paths between the contact surfaces and their corresponding substrate pads.

The plated contact surface can, for example, be easily joined to another conducting surface of any type by nonconductive adhesive, resulting in a connection that is mechanically robust, chemically inert, and inherently electrically conductive, with improved thermal conductivity.

This paper describes a novel manufacturing process to make NCS surfaces, which are readily available for flip-chip applications. The process consists of a modified two-step electroless metal plating process. The innovative method is able to deposit metal and non-conductive particles of any type, and with a wide range of density and sizes, on electrically isolated contact surfaces, and can be adjusted to provide broad surface area coverage in desirable single-layered particle deposition patterns.

http://www.flipchips.com/update09.html

>>>>>>
Und hier nochmal zum Vortrag von Dr. Wernle und Herrn Kober:


>>>>>>>>>
Electrical and Thermal Performance of a New Process for High Density LED Array Assembly


Michael E. Wernle, Michael Kober


Advances in the development of white and blue LEDs (light emitting diodes) have now made LED semiconductor components available across the entire color spectrum. This development opens the door to new, previously unknown applications. Of particular significance are high-resolution displays and LED arrays, components that have up to 8000 LED dies on an extremely small area (~20 cm2). These components require innovative mounting technologies. Conventional methods, including conductive adhesive, are hard-pressed to fulfill new, more rigorous demands, such as a pitch of less than 100 mm. Moreover, achieving maximum light yield at minimum production cost is a decisive factor for new low-cost applications. This paper introduces a new technology for mounting LED dies on FR4 and ceramic substrates. Specifically, this process involves embedding miniscule particles of diamond dust by means of an electroplating plating process into a conductive nickel layer, thereby producing a very rough, conductive layer similar to sandpaper on the substrate. This process, also known as NCS (NanoPierce Connection System), has now been adapted to make it suitable for use with LED dies backed with an extremely thin layer of gold. In addition to modifying the roughness and particle density of the NCS surfaces, suitable adhesives were selected in order to ensure that benefits such as low transfer resistance and good thermal conductivity are maintained. Comparative tests with conventional production processes, such as those using conductive adhesive, indicate a marked improved in the electrical and thermal properties. Furthermore, the paper will demonstrate how this process can significantly contribute to increasing the density of LEDs per cm2 and hence maximize the light yield.

http://www.flipchips.com/abstracts/PPWernle.html
>>>>>>>>>


Hold NPCT and prosper

Jetsia

Jetsia
Auf dem RB Board hatte jemand einen interessanten Artikel ausgegraben, in der Prof. Johnson (technischer Vize-Präsident von IMAPS) eine Technologie die sich noch im Entwicklungsstadium befindet als `ultimate holy grail` für flip chips bezeichnet. Natürlich haben wir gerätselt, ob damit NCS/Waferpierce gemeint sein könnte, was der Prof. aber verneinte. Dazu wiederum habe ich Dr. Wernle gemailt. Im folgenden der Mail-Austausch:


>>>>>>>>>
Sehr geehrter Herr Dr. Wernle,

ich bin seit mehr als eineinhalb Jahren Aktionärin von NPCT (mein username auf dem RB Board ist Jetsia Dax) und möchte Ihnen zunächst für Ihre exczellente Arbeit und Ihre Offenheit gegenüber den Aktionären danken.
Im folgenden möchte ich mich mit einer Frage bzgl. einer neuen Technologie an Sie wenden. Ich habe heute Prof. Johnson wegen einer Technologie gemailt, die er für den "ultimate holy grail" der flip chip Technologie hält:

>>>>>>>

"Dear Professor Johnson,

in the following article by Kathleen M. Peterson

http://ap.pennnet.com/Articles/Article_Display.cfm?Section=A…

You are being quoted:

"Johnson called wafer-applied underfills "the ultimate holy grail." Such underfills employ the same concept as no-flow underfill except they are applied at wafer level, forming a solid film. This technology, which is only in the development stage, will eliminate dispensing, may eliminate post reflow cure, and may be reworkable."

I have a question regarding this "wafer-applied underfill" technology if you do not mind answering. Are you perhaps referring to the Nanopierce Connection System or "Waferpierce" which is patented by Nanopierce
Technologies?"

>>>>>>>

Er antwortete wie folgt:

>>>>>>
"No, the technology is still based on solder balls and reflow technology. The difference is that the epoxy underfill material is pre-applied to the wafer. The die are then assembled to the PWB by standard pick & place
then reflowed like other SMT parts to create the final assembly."
>>>>>>

Wissen Sie, um welche Technologie es sich handelt?
Stellt diese eine "ernsthafte Bedrohung" für Nanopierce dar, oder ist Nanopierce im Vergleich immer noch "billiger, einfacher, besser"?

Für eine Antwort wäre ich Ihnen sehr dankbar, auch wenn ich mir denken kann, daß Sie im Moment sicherlich sehr beschäftigt sind.


Mit freundlichen Grüßen


>>>>>>>>


Sehr geehrte (Jetsia)!

Danke für Ihre email, ich war schon gespannt nach der Ankündigung auf dem RB.

1) DIE Lösung für Flip Chip (FC) gibt es nicht und wird es nie geben, die
Anforderungen der verschiedenen Applikationen sind zu unterschiedlich.
Egal ob es um unterschiedliche Prozesse oder deren Ausführung im Detail
geht. Nur spielt das keine Rolle, da der Markt groß genug ist, 1999 2,3
Mrd. Teile auf 7,2 Mrd. im Jahre 2004 mit einem durchschnittlichem
Wachstum von 25,9%, auch die jetzige Krise wird an diesem Trend nichts
großartig ändern.

2) Underfill ist ein "ewiges" Theme der FC Branche und es wird eine teils
schon erbitterte Diskussion darüber geführt, ob ein Underfill notwendig
ist oder nicht. Meine Antwort: es kommt darauf an - klingt schön
unverbindlich, ist aber einfach so.

3) Grundsätzlich: Underfill ist vor allem dort notwendig, wo ich folgende
Umstände antreffe: großes Die (Chip) z.B Prozessoren, Controller etc.,
großer Temperaturbereich (-40 bis +125 C, Basismaterial - Substrat
(Träger auf dem das Die montiert wird) mit einem stark unterschiedlichen
Temperaturkoeffizienten im Vergleich zum Die Material (z.B. Silizium).
Hier hat das Underfill die Funktion einer Ausgleichschicht zu übernehmen.
Man darf auch nicht vergessen, daß z.B. Lotbumps (Kontakte) eine Höhe von
ca. 30-80 um haben können, in speziellen Fällen auch mehr oder weniger,
d.h. der Chip ist mindestens diesen Abstand vom Substrat entfernt.

4) NCS auf Wafern - WaferPierce(TM) verwendet nur sehr geringe
Kontakthöhen für den elektrischen Kontakt, einige um, außerdem hat der
Kleber für die ja immer noch notwendige mechanische Befestigung auch
gleichzeitig die Funktion eines Underfill - zwei Fliegen mit einer
Klappe. Der Auftrag diese Klebers ist prozesstechnisch einfach, da durch
unsere NCS Kontakte keinerlei Genauigkeit gefordert wird. Die
Schichticken sind so dünn, daß die Aushärtung sehr rasch erfolgen kann.
Wir konzentrieren uns momentan auch auf kleinere Dies mit wenigen
Kontakten < 20, hier ist der Einstieg technisch einfacher, die Volumina
und der Kostensenkungsdruck der Industrie sind deutlich höher.

5) Die übliche Underfill Diskussion dreht sich vor allem um Dies mit
100mm2 und mehr sowie einigen hundert Kontakten, momentan wirklich nicht
unser bevorzugter Markt. Außerdem betrifft uns die beschriebene
Diskussion aus technischen Gründen nicht, unser mechanischer Kleber ist
ja eigentlich ein Underfill, auch wenn er nicht so kompliziert wie üblich
aufgetragen wird, sondern bereits vor dem Aufsetzen des Dies. Prof.
Johnson hat hier ein neues Verfahren, scheinbar vor allem für Lotbumps
bzw. Lot-FC geeignet. Scheint besser zu sein als die bisherigen Lösungen,
ist aber prinzipbedingt keine Alternative zu NCS. Eine weitere Lösung,
wie andere auch.

6) In diesem Zusammenhang noch zwei Anmerkungen zu anderen gerade
laufenden Diskussionen:

a) egal mit welch neuen Prozessen verschiedene Firmen für die
Chipfertigung (Frontend Processing) herauskommen, die Dies müssen
verpackt und elektrisch mit der Umgebung (Leiterplatte etc.) verbunden
werden (Backend Processing oder Assembly). Für NanoPierce ist es
letztlich egal, wie der Die (Halbleiter, Chip) funktioniert und
hergestellt wird, so lange elektrischer Strom involviert ist sind wir
dabei.

b) 15 Mrd. Chips aus einer Halbleiter-Fab war von mir als Beispiel für
die relevanten Größenordnungen gemeint, ok, aber daraus gleich 100% auf
NanoPierce zu schließen, so war das von mir nicht gemeint. Es wird IMMER
auch andere Verpackungstechnologien geben, und NanoPierce wird immer nur
einen ANTEIL am Markt haben, und trotzdem, der Kuchen ist groß genug.

Vielleicht läßt sich das in die Diskussion einbringen.

Mit freundlichen Grüßen, Michael E. Wernle

PS: es gibt ja nicht nur eine Fab ...

>>>>>>>>

Auch an dieser Stelle möchte ich Dr. Wernle für seine schnelle und ausführliche Antort danken :) . Es ist wirklich erstaunlich und sehr positiv, wie viel Zeit sich unser Management für die Beantwortung solcher Fragen nimmt. Dies hilft mir enorm, das Verständnis für mein Investment zu verbessern und stärkt mein Vertrauen in das Unternehmen und seine Führung.


Hold NPCT and prosper

Jetsia
Experten der Nanotechnologie treffen sich in Münster

Über den künftigen Einsatz der Nano- und Biotechnologie werden auf der zweiten NanoBioTech-Messe in Münster vom 24. bis 27. September etwa 500 Experten aus aller Welt beraten. Das kündigte der Mitveranstalter, das Center for Nanotechnology (CeNTech) GmbH Münster, am Mittwoch in Münster an. In fünf Foren wollen die Wissenschaftler über NBT und Informationstechnologie, Selbstorganisation oder den Einsatz der Nanotechnologie in der Medizin und der Pharmazeutik diskutieren. Zudem präsentierten etwa 45 Aussteller den Chemikern, Biologen und Ingenieuren den aktuellen Stand dieser noch jungen Wissenschaft.

Nanotechnologen arbeiten nach Darstellung des Messe-Koordinators Tim Waterboer unter anderem an der Behandlung von bisher unheilbaren Gehirntumoren. Dabei würden die winzigen Partikel in die Zellen gespritzt und zerstörten später die Krebszellen. Zu den Visionen dieser Technologie zähle etwa auch der Bau eines molekularen Motors, der lediglich einen Durchmesser von zwei Nanometern habe. (wst/c`t)
Ein Aktionärsbrief von Paul Metzinger via e-mail:

>>>>>>>


September 14, 2001


Dear NanoPierce Shareholders,

I know that you along with all other Americans and friends of America share the intense pain, deep sense of loss and outrage that I am experiencing because of the incomprehensible terrorist attack on America and against so many innocent persons. Their actions are unspeakably evil. We are all victims because of our shared humanity.

We must all be indivisible in our resolve to preserve and protect the freedom and liberty and the peace and security of this great nation. However awful the consequences may be, we will not be intimidated by the reprehensible, irrational violence of terrorists motivated by their misguided beliefs to murder innocent people and perpetrate their assault upon America.

I am overwhelmed by the numerous, gratifying expressions of sympathy and support that we are receiving from our foreign shareholders. We are honored to have them as friends and shareholders.

As most of you know I am going to the Open House in Munich this next week, flights permitting. The event masterfully organized by Dr. Michael E. Wernle and his team will be well attended and many important meetings before and after the event will occur. The next six months will be a very exciting time for NanoPierce Technologies, Inc., due to the significant production and marketing developments occurring with our Technology especially in its applications at the wafer level and for smart labels. We are stronger than at any time in our brief history and are becoming a recognized presence in the microelectronics industry.

For purposes of security Dr. Herbert J. Neuhaus will remain in the United States. During these perilous times we must undertake procedures to protect the Company and its shareholders.

Happily, I will be joined by, among others, the following loyal shareholders and friends, Stan Richards, Glenn Bagwell, Bert Roosen, Kathy Knight-McConnell, James Stock and Kent and Arnold Klook. I am certain Kent and Kathy will faithfully and competently report to you about the Open House.

We will continue to do everything in our power to merit your trust, loyalty and support. Let all of us remain united in our support of the innocent victims of the unforgettable events of September 11, 2001. That date will be forever memorialized in American history.

Sincerely,

NANOPIERCE TECHNOLOGIES, INC.
Paul H. Metzinger


>>>>>>>

Hold NPCT and prosper

Jetsia
Noch ein Aktionärsbrief:

>>>>>>

September 14, 2001

Dear NanoPierce Shareholders,

Management of the Company values the loyalty, support, enthusiasm and interest of our shareholders in their willingness to assist the Company in whatever way they can. We know it is highly motivated, well intentioned, performed in good faith and selflessly.

Now however I must make a very strong appeal for the cooperation of all of our stockholders on behalf of the Company.

We are currently engaged in extremely sensitive discussions with many major global players in the microelectronics industry. These discussions and future business relationships can and will be jeopardized if shareholders make direct contacts with any of these companies in what may be a well intentioned effort to find out what is going on. Recently executives of one company, at the highest levels, contacted us expressing extreme and troubling concern about calls received from inquisitive shareholders. These executives felt “compromised” being faced with answering questions about what they deemed to be inside material information, which obviously they could not disclose or even affirm or deny. These contacts must stop otherwise we may lose the opportunity to ever again deal with these companies. It destroys our reputation to be a trustworthy partner.

The value proposition for our technology ultimately comes down to reduced manufacturing costs. In other words, our customers will elect to use our technology over others to increase their profit margin. It is not hard to understand, then, that our customers will normally be reluctant to publicly disclose their use of our technology until they deem appropriate. They do not want to tell their customers that they have reduced their costs because then their customers will expect price reductions. Similarly, they do not want to announce to their competitors strategic competitive advantages.

If our goal is viability and revenue for NanoPierce, then we must be prepared to accept this market reality.

We ask that you trust the efforts and competency of management to exploit the huge potential of our technology. Please assist us by refraining from making these unauthorized investigative calls or other contacts such as trying to arrange an introduction of our technology with our potential partners.

We thank you for your cooperation. We trust you will understand.

Sincerely,

NANOPIERCE TECHNOLOGIES, INC.

Paul H. Metzinger
President & CEO

>>>>>>>

Na, das wär` ja toll, wenn Nanopierce durch seine übereifrigen eigenen Aktionäre auch noch Aufträge mit Großkunden verlöre...

Hold NPCT and prosper

Jetsia
>>> 12:10:19 PM Trade 0.6772 325000 OTC BB <<<
12:10:15 PM Ask 0.7 2500 OTC BB
12:09:36 PM Trade 0.675 3000 OTC BB
12:09:30 PM Ask 0.69 2500 OTC BB
12:09:26 PM Ask 0.68 2500 OTC BB
12:09:05 PM Trade 0.67 2500 OTC BB
12:09:01 PM Trade (at Ask) 0.675 2500 OTC BB
>>> 12:06:43 PM Trade 0.673 325000 OTC BB <<<
12:06:33 PM Trade 0.67 5000 OTC BB
>>> 12:06:10 PM Trade 0.6725 325000 OTC BB <<<

Day Volume 805,000 

?????

Da wird doch etliches verschoben....
Kann sich darauf jemand einen Reim machen?

grüße zfh
Zentralding,Zentralding,
Es war dein bestes Posting !
Entschuldigung,es muß das Wiesnbier gewesen sein !
@ libertydings

ich hab hier einen Sachverhalt zur Frage gestellt und wollte nicht dein dummes Gewäsch hören. Musst du ausgerechnet diesen Thread, der bis jetzt frei von solchen anspruchsvollen Postings war auch noch zuspammen?

Wenn du nur nur die 3 Trades addierst kommst du auf eine andere Zahl als die offizielle der gehandelten shares. Wenn du dazu was zu sagen hast, dann tu es.

Ansonsten lass doch diesen Thread in Ruhe. Und wenn du irgendwas gegen mich haben solltest, komme doch bitte über Boardmail.

Ohne Grüße
Eine der drei großen Blöcke war wohl eine Fehlbuchung, die später korrigiert wurde. Zu den zwei anderen großen Blöcken habe ich bis jetzt zwei Meinungen gelesen. Einmal könnte sich ein Maarket Maker, der bisher short war, und hoffte der Preis würde Montag fallen, bei einem Kollegen eingedeckt haben, weil der Preis stabil blieb. Zum anderen könnte seit längerer Zeit ein großer Block entweder zum Kauf oder zum Verkauf als "all or nothing" trade angestanden haben und gestern schließlich einen Käufer/Verkäufer gefunden haben. Ich kenne mich da aber nicht aus und das sind nur Meinungen...

Hold NPCT and prosper

Jetsia

P.S.: Manfred hat auf dem RB Board gesagt, daß er einer derjenigen war, die die Großen der Branche angemailt haben. Erstaunlicherweise hat jemand von Infineon bestätigt, das sie mit Nanopierce Gespräche führen und NCS testen, aber (noch?) keine Kunden sind. Nach der Bitte von Paul will Manfred jetzt keine Firma mehr anmailen, und ich hoffe, alle halten sich an Pauls Bitte. Es wäre doch wirklich zu blöd, wenn dadurch ein Deal platzen würde...

Hold NPCT and prosper

Jetsia
NANOPIERCE CARD TECHNOLOGIES GMBH ANNOUNCES THE OPENING OF NEW SALES REPRESENTATIVE OFFICES
IN TAIWAN



September 18, 2001, Hohenbrunn – Munich, Germany: NanoPierce Card Technologies GmbH, a subsidiary of NanoPierce Technologies, Inc. (OTC:BB:NPCT.OB), today announced the opening of Sales Representative Offices in Taipei, Taiwan in cooperation with HiYen Trading International Ltd., Taipei, R.O.C., dedicated to exploiting the electronics market in Taiwan.
With this expansion NanoPierce continues its strategy of focused sales of the Company’s proprietary electrical connection technology, called NanoPierce Connection System (‘NCS’)™. "The market in Taiwan offers many different opportunities for our proprietary NCS technology,” explained Dr. Michael E. Wernle, President and Chief Executive Officer of NanoPierce Card Technologies, GmbH, "especially NCS applied at the wafer level, called WaferPierce,™ which is used in applications such as Light Emitting Diodes (LED’s) and semiconductors, among many others. WaferPierce™ is generating ever-increasing interest and excitement among the Company’s potential customers.”
Over the past 15 years Taiwan has captured more and more of the Asian electronic market and today holds a leading position in the field of semiconductor manufacturing. The Asian market currently has a dollar volume of US$ 218 Billion (not including Japan), which is expected to grow to more than US$ 870 Billion by the year 2020, encompassing 29% of the entire worldwide electronics market. These figures are published by Prismark Partners LLC, of New York, New York in "The Electronic Industry Report 2000. ”
HiYen Trading will provide organizational support to NanoPierce during the establishment of the sales representative offices and will provide access to local customers and markets. With its long term experience as a supplier of equipment and technology in one of the largest and most challenging markets in the world, HiYen Trading offers NanoPierce extremely valuable access to the entire Taiwanese electronics industry.
"Nanopierce has a very promising and interesting technological solution,” explains Hermann Moos, President & CEO of HiYen Trading, "for a market which requires new, innovative solutions - especially in the low cost / high volume area. In highly competitive markets potential customers need new ideas to counteract increasing cost pressure, and we believe that Nanopierce has them.”
"The opening of our sales representative offices demonstrates the importance we place on introducing our NCS technology into this immense - and growing - market. We are pleased and fortunate to be affiliated with HiYen Trading, which provides a recognized reputation in the Asian markets for our company and its innovative technologies, ” said Paul H. Metzinger, President & Chief Executive Officer of NanoPierce Technologies, Inc., of Denver, Colorado.
HiYen Trading International Ltd., was founded in 1995 as a one-man operation focused on back-end assembly equipment. Today, with more than 20 employees, HiYen Trading is one of the most respected trading and technology suppliers in the Taiwanese semiconductor market. HiYen Trading distributes the equipment of well known companies such as Munich-based F&K Delvotec, a leading manufacturer of die- and wirebonders, which also will operate to increase the Company’s access to semiconductor manufacturers in Taiwan. Additional activities of HiYen Trading include work in areas such as power semiconductors, SAW Filters, acousto-optic, fiber-optic and complex MCM applications.

NANOPIERCE CARD TECHNOLOGIES GmbH is a 100% subsidiary of NanoPierce Technologies, Inc., of Denver, Colorado, USA, which is traded on the Nasdaq stock market (OTC:BB:NPCT) as well as in Frankfurt and Hamburg (OTC:NPI). In addition to the twelve patents it owns, NanoPierce has three patent applications pending, two patent applications in preparation, and various other intellectual properties related to NanoPierce´s proprietary NCS (NanoPierce Connection System). This advanced system is designed to provide significant improvement over conventional electrical and mechanical interconnection methods for high-density circuit boards, components, sockets, connectors, semiconductor packaging and electronic systems. To learn more about NanoPierce Technologies, Inc., log on to the company’s website at http://www.nanopierce.com.
This announcement contains forward-looking statements about NanoPierce Technologies, Inc., and its subsidiaries, that may involve risks and uncertainties. Important factors relating to the Company´s operations could cause actual results to differ materially from those in forward-looking statements and are further detailed in filings with the Securities and Exchange Commission (SEC) available at the SEC’s website (http://www.sec.gov). All forward-looking statements are based on information available to NanoPierce Technologies, Inc., on the date hereof, and NanoPierce Technologies, Inc., assumes no obligation to update such statements.


CONTACT:

NANOPIERCE TECHNOLOGIES, INC.
Paul. H. METZINGER President & CEO
370 17th Street #3640
Denver, CO 80202, USA
Phone: + 1-303-592-1010
Fax: + 1-303-592-1054
Email: paul@nanopierce.com


HIYEN TRADING INTERNATIONAL Ltd.
Hermann F. M. MOOS President & CEO
7F, No.127, Lane 235, Pao Chiao Rd.
Far East Century ABC Industrial Park
231 Hsin Tien City, Taipei County
TAIWAN, R.O.C
Phone: +886-(0)2-8919 1218-668
Fax: +886-(0)2-8919 1157
www.hiyen.com.tw
Email: info@hiyen.com.tw


NANOPIERCE CARD TECHNOLOGIES GmbH
Dr. Michael E. WERNLE President & CEO
Lise – Meitner – Strasse 1
D – 85662 Hohenbrunn (Munich)
GERMANY
Phone: + 49-8102-8961-0
Fax: + 49-8102-8961-11
Email: michael@nanopierce.com

INVESTOR RELATIONS – STOCK ENTERPRISES
James Stock
Phone: + 1-702-614-0003
Na, das sind doch gute Nachrichten. Wofür braucht man wohl ein Verkaufsrepräsentanten in Taiwan ($$$ :) )

P.S.: Ooops, klitzekleine Fehlinformation zur E-mail an Infineon. Die hatte nicht Manfred sondern Hackertom gesandt. Sorry...

Hold NPCT and prosper

Jetsia
September 20, 2001, Hohenbrunn – Munich, Germany: NanoPierce Technologies, Inc. (OTC BB : NPCT), today announced that it successfully demonstrated for the first time ever, at the Open House of Nanopierce Card Technologies GmbH in Munich, Germany, on September 20, 2001, before approximately 90 guests the use of a WaferPierce™ NCS wafer in the highspeed, advanced micro-assembly production system, marketed as ModulAS™, of its strategic partner Simotec® to manufacture chip module substrates for smart cards and other applications.

Combined with NCS WaferPierce™ chips, this innovative production system can also be used to manufacture inlays (antenna and chip assemblies) which are used in the manufacturing of smart labels for such applications as parcel delivery systems, inventory control, product authenticity, baggage identification controls, library control systems and, most importantly, security identification devices.

WaferPierce™ chips can also be used to manufacture "flip chip” connection devices with the ModulAS™ system.

Dr. Michael E. Wernle, Chief Executive Officer of NanoPierce Card Technologies GmbH, said: ”We are glad to show to our shareholders, prospective investors, customers and other interested parties how our process performs on an industry recognized high speed advanced micro-assembly production system. The intense focus of our efforts over the last six months has been fully justified. We are extremely pleased with the outcome.”

”Mr. Jakob Fischer, Chief Technology Officer of Simotec® and one of its founders stated: ”It`s a pleasure to see our MudulAS™ system working with NanoPierce`s impressive NCS technology. Now a flip chip connection process is available which supports the full speed capabilities and all the other benefits of our equipment.”

Paul H. Metzinger, President & CEO of Nanopierce Technologies, Inc., who was present at the Open House, said: "It was an impressive demonstration of the technologies of NanoPierce and Simotec®. I think everyone present sensed the future potential of the combined technologies in radically changing connection technologies for the micro-electronics industry. Our efforts are accelerating toward commercial production and should lead to increased attention on NCS, NanoPierce and Simotec® among global players of the micro-electronics industry.”

NANOPIERCE CARD TECHNOLOGIES GmbH is a 100% subsidiary of NanoPierce Technologies, Inc., of Denver, Colorado, USA, which is traded on the Nasdaq stock market (OTC:BB:NPCT) as well as in Frankfurt and Hamburg (OTC:NPI). In addition to the twelve patents it owns, NanoPierce has three patent applications pending, two patent applications in preparation, and various other intellectual properties related to NanoPierce´s proprietary NCS (NanoPierce Connection System). This advanced system is designed to provide significant improvement over conventional electrical and mechanical interconnection methods for high-density circuit boards, components, sockets, connectors, semiconductor packaging and electronic systems. To learn more about NanoPierce Technologies, Inc., log on to the company’s website at http://www.nanopierce.com.
This announcement contains forward-looking statements about NanoPierce Technologies, Inc., and its subsidiaries, that may involve risks and uncertainties. Important factors relating to the Company´s operations could cause actual results to differ materially from those in forward-looking statements and are further detailed in filings with the Securities and Exchange Commission (SEC) available at the SEC’s website (http://www.sec.gov). All forward-looking statements are based on information available to NanoPierce Technologies, Inc., on the date hereof, and NanoPierce Technologies, Inc., assumes no obligation to update such statements.

CONTACT:

NANOPIERCE TECHNOLOGIES, INC.
Paul. H. METZINGER President & CEO
370 17th Street #3640
Denver, CO 80202, USA
Phone: + 1-303-592-1010
Fax: + 1-303-592-1054
Email: paul@nanopierce.com


HIYEN TRADING INTERNATIONAL Ltd.
Hermann F. M. MOOS President & CEO
7F, No.127, Lane 235, Pao Chiao Rd.
Far East Century ABC Industrial Park
231 Hsin Tien City, Taipei County
TAIWAN, R.O.C
Phone: +886-(0)2-8919 1218-668
Fax: +886-(0)2-8919 1157
www.hiyen.com.tw
Email: info@hiyen.com.tw


NANOPIERCE CARD TECHNOLOGIES GmbH
Dr. Michael E. WERNLE President & CEO
Lise – Meitner – Strasse



Hold NPCT and prosper

Jetsia
ModulAS


http://www.simotec.com/german/content11.html

Das ModulAS-Basissystem wird nach dem Baukastenprinzip um die Komponenten ergänzt, die für die Realisierung Ihrer Montageapplikation erforderlich sind.

Kennzeichnend für ModulAS sind die hohe Qualität seiner Einzelkomponenten und die konsequente Umsetzung des modularen Grundgedankens. Nach dieser Formel kann sowohl präzise als auch sehr schnell montiert werden.


ModulAS - die Technik

Das Basisgestell wurde nach der Finite-Elemente-Methode (FEM) optimiert.

Die Portale sind quer stehend zum Substrattransport angeordnet. Daraus ergeben sich ein vergrößerter Verfahrbereich und eine optimale Platznutzung.

Die Antriebssysteme der Portale enthalten in der Hauptbewegungsrichtung Linearmotoren.

Das vektorbasierte Vision-System ermöglicht eine zuverlässige Erkennung von Position und Lage.

Die Steuersoftware läuft auf einem Echtzeitbetriebssystem.

Ein ModulAS-System kann in folgenden Komponenten variiert werden:

- Breite des Basisgestells (1,5 x 19" oder 2 x 19")
- Portaltechnik (1 oder 2)
- Materialpräsentation (Wafer, Feeder, Waffle Pack, Smif Box)
- Substrathandling (Kunstwafer, Indexer, JEDEC Tray, Streifen, Bänder, Folien usw.)
- Messsystem (Substrat- und Bauteilvermessung)



Applikationen auf der Basis von ModulAS

- ModulAS I Sorter
- ModulAS Fast Flip Chip
- Modulare In-Line-Reel-to-Reel-Montage


>>>>>>>

Hold NPCT and prosper

Jetsia
Ein erster "Appetithappen" Bericht vom OH von Finnegan auf dem RB Board:

Fine, here`s the appetizer:

Over 80 people were there. All was perfectly organized by Dr. Wernle and his team (and his wonderful wife) with Powerpoint presentations, a video, the simultaneous translation, the Simotech machine demonstrating how to print money, pardon, how to manufacture cards with NCS. They had a wonderful buffet and excellent catering there, but I guess that`s not what you are really interested in...

The round tour through the offices and the lab was extremely impressive, we were able to look at nanopierced wafers through an electron microscope. We saw smartcards (NCS) and how they are produced, LEDs (NCS) and Chips (NCS).

Most interesting was who attended and a lot of talk behind the scenes. Company officials did - for apparent reasons - not comment on both topics, but I made use of my eyes and ears and learned that:

- even though Dr. Wernle has talked to many potential customers and told them that the OH would not be a good spot to have in-depth talks, some appeared. What I saw is that a guy from Infineon was there (I am absolutely sure about this). I have heard from reliable sources more people from Infineon were there, but I have not seen them myself.

- Another person whose appearance made me quite happy was a guy from Activest (I am sure about this, too). Activest is among the top three investment funds in Germany, it is one of the best known and heavily advertised fund companies.

I will tell you in detail later, why we DO NOT need to be concerned about finding customers - there was one who stated publicly he will buy "any amount of waferpierced chips Nanopierce can produce now."

Sounds interesting? It is *grin*

Be back as soon as possible.

Best regards
Finnegan
http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…
>>>>>>>>>



Hold NPCT and prosper

Jetsia
Weiter geht`s mit finnegans Berichten:

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

From Dr. Wernle`s introduction:

He mentioned a few things we (on RB) already knew. So I keep this short and quote only the things which were new to me:

- The cleanroom will be put in operation within one or two weeks.

- He is very happy about the progress the company made and that it is time to reap the fruits of their work NOW (!). "We have a product now and we can start selling it. And we have a machine for NCS now."

- He is well aware of the fact investors are waiting for customers. "There was the technology, then a man with a vision, then the team, then we had to find the markets and building our network of partners. The Nanopierce house is almost complete, just the roof, the customers are not there yet. But we will put the roof on it and move in very soon, this is for sure."

- The market for NCS is growing every day. One new technology is the fingerprint identification system from Infineon (again *smile*). "They have already developed it. It has to be connected somehow, too."

- The "waferpiercing service" will be available to customers at the beginning of 2002 (Dr. Wernle prefers the term "waferpiercing service" rather than "production", but I think we all know what is meant).

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

Mr. Völler / Fraunhofer Institute.

Mr. Völler spoke about Flip Chip technology in general, so I won`t quote him that much, but he mentioned some interesting points:

"Flip Chip technology is not a choice, but a necessity for size and weight reasons. "

"Wirebonding will be a thing of the past very soon and our partner Nanopierce`s technology will contribute to that."

"The shorter the wires are the higher are the frequencies you can achieve. Todays chips with frequencies of a GHz and above would be impossible to manufacture without Flip Chip technology. A technology which eliminates todays disadvantages in FlipChipping is very much needed. NCS is such a technology."


Mr. Tiedmann (Schreiner Etiketten)

This was fascinating! The overall impression: This market yet has to be created but it will be HUGE. Desperately needed are technologies like NCS which can reduce the manufacturing costs. Today`s manufacturing costs for SmartLabels are somewhere around $0.80 to $1.00. While this is extremely high, they are already in use for high priced products like fashionable clothes etc. I will quote a few ideas of Schreiner Etiketten later in detail. I was amazed - I knew this thing will be big but I have not been aware in how many fields you can use SmartLabels.

Nanopierce will produce the inlays for the SmartLabels and Schreiner Etiketten will use them for their labels.

I talked to Mr. Tiedmann later and learned the following:

As always, manufacturing costs will decrease along with the increase of the number of Labels produced.

NOT a problem to find a market. Delta Airlines alone has use for 7.5 million baggage checkings per month. While a barcode label only costs $0.01 to $0.02 and a SmartLabel is much more expensive, they will use it because it reduces the time you need to check the baggage, the number of errors and will dramatically improve the security level.

Asked at which price Airlines will consider using SmartLabels, he said "15 cents is for sure a price which would make them potential customers." NCS technology can push the price way down below 15 cents (I asked twice, he confirmed twice).

The same is true for companies like FedEx and UPS. They are in need of 5 million labels PER DAY. So, Mr. Tiedmann said, "the only problem is there are not enough chips and machines in the whole world yet to produce all these labels" (well, I could live with that...)

>>>>>>

Dran bleiben, gleich kommt noch mehr

Hold NPCT and prosper

Jetsia
Und weiter:

Ok, Mr. Pajonk / Simotech:

Simotech is still a very young company, but, geez, these guys are SMART! This ModulAS-RFID seems to be (as far as I can tell... It’s been a while since I built my last SmartCard manufacturing machine *lol*) superior to all the competitor’s equipment. It can produce almost anything with a chip in or on it. Dr. Wernle later on told me he was extremely impressed when he saw for the first time how flexible this thing is. (As to the question on this board: yes, I think it will replace any older equipment / concepts).

Well, the bottom line is:

Mr. Pajonk publicly stated that NCS is an unbelievably simple process. "Nanopierce made a very circumstantial thing very simple."

Which is good for Nanopierce but not that good for Simotech. A LOT of equipment has been necessary for this card production before. For several reasons with NCS one needs just and only this ModulAS. This saves a lot of space and, as you may imagine, even more money...

Somebody later told me that this machine will cost about 750.000 German Marks ($340.000 approx.). Without NCS you have to buy equipment which would cost you 1.5 million Marks. Any questions? *smile* And this is just the equipment – as we know, NCS also makes production more simple and less expensive...

Company officials did not comment on it, but I learned that Simotech has already sold at least 4 of this machines, maybe more. 2 may have been bought by big companies (please, figure it out yourself... And DON’T call every CEO you may find in your area... This is a no-no! *grin*).

Nanopierce is not listed on Simotech’s website yet, but it is mentioned in the handout we received at the OH (and which appears to be the presentation they are giving to potential customers) as one of three possible connection systems.

Absolutely no one was willing to comment on my speculation that nobody has bought one of this 4 machines without at least the option for NCS now as the technology is known by the big players. EVERYBODY WAS JUST SMILING WHEN I ASKED... No, they did not smile. It was more like a fat grin.

Dr. Wernle told me that Nanopierce will not pay Simotech and Simotech will not pay Nanopierce. They consider it to be a win-win-situation. Simotech thinks every big player will want or need to have the possibility to use NCS within a few months and will have to buy a Simotech ModulAS. Dr. Wernle thinks of it like "giving away a Gilette razor and even a free sample blade. After this you just have to wait for your customers to return to buy more and more blades..."

There are many more (mostly technical) details, but I think I’ll keep that for later.


http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

>>>>>>>

Hold NPCT and prosper

Jetsia
Und noch mehr:

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

Mr. Sieg, President and CEO of Elcos.

I frankly admit I did not expect this to be the highlight of the day because we haven’t heard too much of the Elcos partnership recently. But then Mr. Sieg entered the stage. What followed left me mouth and eyes wide open:

This guy is Bavarian but could as well be from the US, he is straightforward to say the least.

He did nothing less than stating he is just waiting for Nanopierce to deliver. No "if" or "maybe" or "interesting concept".

I talked to him later and asked him and he said he has some new products he CAN NOT PRODUCE right now, "because I need Nanopierce for them. There is no other way I could produce them, they are too small for every technology that exists." And: "I am really waiting for Nanopierce to deliver. It’s not like the SmartLabel market which has still to develop. Believe it or not, I can modify my die-bonders within 30 minutes and start producing Nanopierce LEDs. I just have to use a different glue, that’s all we have to alter. Every LED manufacturer in the whole world can do the same."

More beef: "I am absolutely sure there will be a race for NCS once the first big manufacturer uses it. I have been in Asia recently and had only loose talks over NCS with a manufacturer. He had not heard of it before but after an hour or so he asked me if we can sign a CONTRACT (ha! The evil word *smile*). I had to tell him he has to call Nanopierce, not me..."

Mr. Sieg said: "There are billions and billions of LEDs every year, they are as small as 0.4 x 0.4 millimeters now or even smaller and we are still using conductive glue – and this is not the appropriate technology for todays LEDs. As long as we have to use conductive glue, we will have problems. If the glue causes just one closed circuit, we have to throw away 2000 Marks right now. NCS eliminates this problem and it is so simple, just glue, nanopiercing, that’s all." And: "There is no technology similar to this one. We really need this to increase packaging density any further."

"We at Elcos are ready for mass production. We can start it any moment. All we need are the chips from Nanopierce, and I need lots of them."

"This is nothing less than a revolution for LED mass production. NCS may save up to 25 or even 30% of the manufacturing costs. This is incredibly much money."

When I told Dr. Wernle that Mr. Sieg is really eagerly awaiting the NCS-chips, he just smiled and said: "I know. He will get them."

There is one problem with LEDs: You can’t use FlipChip (Mr. Sieg confirmed this). The reason is simple: You have to get the light out of the LED. If you flip it over, you will have an oven, but not a lamp *smile*. This problem is well known within the industry and yet unsolved. They would love to get rid of these darned wires, believe me...

So, guess what? From a reliable source I know a small company which has found the solution for this problem and even already filed a patent on it: LEDs with Flip Chips!!!

I won’t be more specific here or give any technical details because I have been told that NPCT already is on the radar screen of the competitors and I for sure do NOT want to be the one to tell them how to do it.



Hold NPCT and prosper

Jetsia
Vielen vielen Dank erst einmal an finnegan. Morgen gibt`s noch mehr (wer`s nicht abwarten kann muß auf dem RB Board weiterlesen). Falls jemand Schwierigkeiten mit der Sprache hat einfach nachfragen :)

Schöne Träume wünsch ich :) $$$ :)

Hold NPCT and prosper

Jetsia
Just a few more prompts (a bit scrambled, sorry, as it comes out of my block):

- Waferpiercing rollout is scheduled for January 2002 but I got the impression it could be a few days earlier, the company appears to be conservative with the date (JMHO). It will not be next week or next months, for some tests have to be completed. What takes so long is this darned temperature cycle test (which is a simulation of "aging" of the connections). You can do absolutely nothing to accelerate this, just have to raise the temperature and lower it again and have to check the connections every 100 hours. After this they will start with a test where a haze of saltwater is sprayed upon the wafer (don’t know the appropriate English word for "Salznebelsprühtest").

- This is just from hearsay but I learned the test results so far are overwhelming.

- Right now there are two wetbenches in Col. (the big one and a very small one). Nanopierce will buy a third bench any time soon. Dr. Wernle told us the reason for this is that they want to separate R&D from the production process. You have to make save that you are using exact the same chemical composition and the same time frame for the waferpiercing process, you have to be very accurate because it is a very short time (because you need very little nickel for the connections – traditional wafers need hours, Nanopierce just minutes). You can`t ensure this while some other staff member is trying out something new.

- Paul Metzinger stated again there will be no equity financing while the stock price is so low. Paul Metzinger and Dr. Wernle answered a question if there will be a buyout: They are ruling out this before the stock price is at a level which would make all of us feel very comfortable.

- Dr. Wernle sees no competition from other companies now. They are following all the important publications very closely but are very confident they are superior to any existing technology.

- No money is needed now, no money will be needed in 2002. They have secured now that they have access to financing if they want or need it. There are enough people in the background now who will be ready to provide liquidity, that is the reason why Stan Richards and a few others attended the OH.

- The PR campaign in Germany will start any day soon. It consists of Radio broadcasting and TV broadcasting along with other activities. This should increase the volume in Frankfurt quite significantly over the next few months. I did not succeed in learning which TV channel will be broadcasting the NPCT story, but I heard it will be a respected one. There are some activities which are planned for the US markets, too.

- One of the next goals will be to eliminate glue from the Waferpiercing process.

- They are considering "financing segments" for the different products (Waferpiercing, SmartLabels, LEDs) to make sure they have sufficient liquidity for every product. When asked, company officials clearly ruled out that the reason for this decision was that there might be a break-up of the company into several divisions.

- The big players are sending many, many test wafers (no one asked them to do so).

- Paul Metzinger told us "We are exchanging technical data with big players now and this is highly sensitive and it is unusual that a big company sends you its data after they have tested. It shows how close we are. There is only one critical step left now: Pricing information, the most guarded information in the semiconductor business, this is the next and last step to follow."

- Expect no big revenues in the 10k. It will be out next week. We will see "something" before year’s end, but nothing close to a million. Next year we will lift off (this was not new but they reassured us).

Two smilies from Dr. Wernle at last:

"Most of the new technologies have been invented by small companies, not by the big players, they just adopted them. Well, there are exceptions: The C4 FlipChip process is that complicated – it has to be directly from IBM."

"Our patents are safe. Our first patent says "any hard particles on any surface with any metal coating". To be honest, the first time I read this I could not believe you can successfully file a patent on anything as ambiguous as this. But it’s true."

There are gadzillions more details, but this is the summary I can think of. Maybe Hackertom or voitsi can comment if they agree with the picture I gave.

Best regards
Finnegan


>>>>>>>>

Hold NPCT and prosper

Jetsia
Und hier ein erster Eindruck von Voitsi:

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

Back now from OH.
Oh finn, what a great job you do for us. It was a pleasure to meet you, Kent, Arnold, Kathy, Hackertom to name only a few.

For me this is not only an investment it`s a family-like institution. The persons who are involved in this company makes me so sure about that it will succeed. Nano works at the basics in the microelectronic industry, nearly every application is thinkable.

The highlight for me personally was Mr. Sieg from Elcos, a man with visions. He is waiting for delivering!!! to transfer his ideas to reality. (Traffic Lights, illuminated walls, front- and taillights of cars and much more).

So much to say but my english is to poor to express my feelings.

Yes I am also a stockpromotorrr.

>>>>>>>>

Hold NPCT and prosper

Jetsia
nochmal voitsi:

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

Met the Business Development Manager from Strand Interconnect(www.strandinter.se) who is interested.

Also a person from Card Solutions International from Switzerland. (I think I should not mention their names?)

After the question from Mr. Sieg when Nano is ready to deliver and Dr. Wernles answer he smiled and said: That`s all I want to know! You can bet we will hear very exciting news, maybe not tomorrow, but soon enough to make us happy!

Go to bed with a lucky feeling. Good night all longs!

>>>>>

Hold NPCT and prosper

Jetsia
finnegan:


http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

Attendees...

cuyana, your question is a bit difficult to answer for several reasons. First of all, I have not even seen the top of the iceberg - I am a small individual investor (too small, I am very unhappy with the fact I could not afford to buy more than my measly few thousand shares yet), so I did not expect Paul Metzinger storming out of his office and telling me all the things he discussed with everybody *smile*.

My guess (!) is that individual shareholders have been an absolute minority at the OH. I would guess (really speculating now!) 20% individual shareholders, 40% investors, potential investors or analysts, 40% friends of the company (with a lot of money as well as a lot of shares). That was my impression.

You know Paul Metzinger has been in Munich since Monday and will stay there til Saturday. He is tied up in meetings every day. I know some of the people he is talking to, I don`t know most of them. There is no need to mention any names, I don`t think it is really important and I am quite sure it would not be a smart thing to do.

I know this sounds a bit spongy, but my bottom line is: there is enough money. We are on the radar screens of very trusted German and international funds. Our (well, Nanopierce`s - this darned cult thing *grin*) potential customers are MANY.

Another thing I may add is that I got the impression that the companies officials have learned their lessons from the HC financing. But who am I to talk about that; and hindsight is always 20/20...

Other people`s reactions? Well, there haven`t been many. This may sound strange, but imagine: Kent Kloock or Kathy Knight-McConnell should not have been very surprised about everything they saw. The guys from the investment funds had their talks with Paul Metzinger and Dr. Wernle before so they knew what was coming. The companies loyal friends and investors are close friends of Paul Metzinger, so I did not really expect them to yell out in surprise. The potential customers (voitsi named some of them) have good reason to keep silent for now...

So, no, there was no stampede. The impression I got was: Everybody felt very comfortable with the fact she/he was there and has found a very promising company in a still very early stage. I did not hear a single disappointed voice. Paul Metzinger and Dr. Wernle on the other hand were very busy with just talking to other attendees after the official part of the OH ended. Talks will continue.

Best regards
Finnegan

P.S: frogdear, a Heinecken works fine now .-) We WILL share a glass or three soon, I am sure!

P.P.S: Hey, guys (oops, and girls)... don`t you ever again think this board is our sandbox where we can play unwatched. Paul Metzinger was very eager to be sure Arnie Kloock takes pictures of every Raging Bull member. Please, do not assume he has in his mind anything negative, it was just his wife who said "Please, don`t come back without pictures of these people. I really NEED to know what they look like." The company is very well aware of this board, watches it and has it`s own thoughts about the people here and the things they are posting. Maybe you want to keep this in mind the next time you post (not that I want to cause a writing blockade in anybody *lol*).

As I said: This company is very special.

P.P.S: (I am getting lenghty, I know, sorry!) Every attendee at the OH received a gift: A Nanopierce wristwatch. I really love the motto on the clockface (not to be mixed up with the Kloock face)....... "Connections just can`t be too close for us".

And, one final word: A very heartfelt "thank you" again for all your appreciations. It makes me feel really embarrassed - it is not THAT much work. I have been there anyway and just summarized a few things. It was fun.

What I REALLY want you to know is the following: Today I learned that the US media is not reporting much about our (the Germans / the Europeans) sympathy after the terrorist attack. I want to assure you there is a lot of compassion over here, candles, flowers and letters are still piling up in front of the U.S. embassies. We definitely are not back to business as usual yet.

>>>>>>

Hold NPCT and prosper

Jetsia
Hi Jetsia!

Danke für die Eindrücke.
Sag mal, bist Du aus dem Bett gefallen oder konntest Du vor Aufregung nicht schlafen. ;);)

Gruß, Dirk.
Hi Dirk, tja das waren schon tolle Schilderungen von finnegan und voitsi. Da wäre ich zu gerne dabei gewesen. Schade, das das Börsenumfeld im Moment so düster ist. Aber längerfristig wird das auch keinen Einfluß auf den Erfolg haben...

PS.:Unser Sohn hat mich "aus dem Bett gefallen" ;) lol...

Hold NPCT and prosper

Jetsia
Semiconductor Business News:

NanoPierce demonstrates radical IC-packaging technology for smart cards

Devner company says technique enables microscopic contacts on chips and other devices
Semiconductor Business News
(09/20/01 20:17 p.m. EST)

DENVER -- NanoPierce Technologies Inc. here claimed it has demonstrated the production of its radical chip-packaging technology for smart cards and other products.

NanoPierce demonstrated the development of its so-called WaferPierce wafer technology, by using specialized chip-equipment from Germany`s Simotec GmbH. in the Munich area. NanoPierce`s technology enables the ability to put microscopic contacts or electrical pads on semiconductors and other devices.

Simotec`s chip-equipment--called ModulAS--is a modular tool that performs the same functions as a wire bonder. The tool can be used to put NanoPierce`s tiny "flip-chip" connections in a device.

In a demonstration on Thursday in Munich, the technology was applied to low-cost smart cards, according to the companies.

The new technologies will "radically change connection technologies for the micro-electronics industry," said Paul H. Metzinger, president and CEO of Denver-based NanoPierce. "Our efforts are accelerating toward commercial production" of the technology.

Little-known NanoPierce is also in discussions with several major chip makers to license what it claims is a revolutionary technology that could replace traditional chip-packaging methodologies.

NanoPierce is in negotiations to license its NanoPierce Connection System (NCS), a technology that enables the ability to put microscopic contacts on ICs, LEDs, PCBs, connectors, and other products (see Aug. 9 story ).

http://www.siliconstrategies.com/story/OEG20010920S0079

Hold NPCT and prosper :)

Jetsia
Finnegan hat die ersten Mitteilungen von Kathy und Kent gepostet:
>>>>>

Message from Kathy Knight-McConnell:

"Hi Everybody,

I have tried to get on the internet and have had no luck with it. I am working on a report which will cover the demonstrations in more detail than what you have heard.

It will take some time, but I hope to get it on the forum on Sunday evening or Monday the latest, depending on what happens with my flight back to Newark.

There was some very good information disclosed by the Nanopierce partners and I`m sure we all appreciate what they had to share with the audience.

I sat next to a man from a backend semiconductor assembly company in Switzerland (name withheld) who was champing at the bit to get Nanopierce to give him a sample of NCS on a PCB which he carried all of the way to Germany.

I know there were others there to view the technology but who do not wish to be identified and their wishes must be respected.

We will try to get the photos processed but it could be a couple of weeks before they can be placed on i2i.

More later
Kathy"
>>>>>>


Hold NPCT and prosper

Jetsia
Kents erster Eindruck übermittelt von Finnegan auf dem RB Board:
>>>>>

From Kent Kloock:

"Finnegan printed the summary of his posts done by snuffer.

I enjoyed reading it and concur with the observations within his report.

I would like to add a couple of observations.

- I am very impressed with the technical staff of NPCT GmbH and especially Dr. Wernle. It became clearer for me than ever before the care and attention that Dr. Wernle and staff are giving to all the details of the NCS process and testing. Their precision will and is ensuring that NCS will not only work the first time and all times but will be favorably considered with less resistance by the customers they are working with.

- Many of us that invested early in 1996 onwards were expecting immediate adoption of the technology. In hindsight, this was naive. This is the time that Nanopierce will strut its stuff. The robust business plan and robust testing that all divisions are following are beginning to bear fruit. As Paul has indicated, the 4th Qtr. will reveal much and 2002 will be incredible.

- When one considers, on a technical side, that NCS in a smart card reduces the electrical resistance from one Ohm without NCS down to .19 milliOhms with NCS, NCS is obvious to me of its importance.

- I enjoyed meeting a great group of investors from Germany and surrounding countries. Hackertom, gdx, voitsi and Finnegan are familiar to us all. There were those present that read much and do not post.

- My gratitude to Finnegan cannot be measured. He is posting for me He has been invaluable in arrange our accomodations and has been an excellent host. (I really hate him for letting me write that... - F.)

- Before I forget this, we saw the wafers that Nanopierce is testing NCS. What gave me the greatest sense of pride as a long term supporter of NPCT was the word "Nanopierce" and the logo clearly marked on each and every chip on the wafer, all 30,000 of them.

- The potential insertion and use of NCS in smart tags, LEDs, and WaferPierce is staggering. All three are being persued agressively.

- I sense that the world will wake up and find Nanopierce suddenly and impressively. From that point on, I sense that Nanopierce will continue to grow, evolve new technology, and expand beyond the US, Germany, and Taiwan.

- My thanks to Paul, Dr. Wernle and Bernhardt Meier for an excellent Open House. We missed Dr. Neuhaus though understand the need for him to stay in the states.

Regards,
Kent Kloock"

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

>>>>>>>


Hold NPCT and prosper

Jetsia
Finnegans Antwort auf doc`s Fragen
1) Welche Risiken er noch sieht
2) Ob mehr Personal eingestellt werden soll
3) Ob momentan neues Kapital benötigt wird
4) Was zur Vertretung in Asien gesagt wurde


>>>>>>
Finally, doc:

I sense that Hackertom has answered your questions very appropriate. I`ll throw in my two (€) cents to confirm it, anyway:

1) testing still can fail. Reflux from customers because of flaws would be bad (don`t think this will happen: after all that is why they are testing that intense). Further Dilution (I think the company is very well aware of the fact this would be ugly and they are not going to do this). I have tried hard, but I can`t imagine more risks now. The question is, when the majority of the investors will become aware of NPCT, but I don`t consider this to be a risk, more like a question of time.

2) Yes. Hackertom is right, Paul Metzinger told us they will do the LED sector ONLY with licensing. "There is absolutely no other way we could handle this huge market." With the additional wetbench in Col. (which will allow NPCT to have one wetbench just for commercial Waferpiercing) they will be able to produce sufficient wafers for the predictable future. They hire people when they need them. I have heard it is not a problem anymore to hire good staff for NPCT. Just because staff means expenses they will only hire additional staff when they really need it.

3) No capital needed now. Cleanroom is there and can (and will) produce lots of chips. Licensing will not cost money.

4) I`ll be honest: I did not ask. The actual situation was that amazing and I had to ask so many questions about it that it simply did not come to my mind. Sorry!

Best regards
Finnegan

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

>>>>>

Hold NPCT and prosper

Jetsia
dobies0 hat den folgenden Artikel von Dr. Wernle für die IMAPS Konferenz (pdf Format!) gefunden

Er hat den schönen Titel :) :

"Manufacturing of Low Cost Smart Labels ..."


http://www.nanopierce.com/daten/technology/images_tec/pdfs/I…



Hold NPCT and prosper

Jetsia
Monday September 24, 11:29 am Eastern Time
Press Release
SOURCE: NanoPierce Technologies, Inc.
NanoPierce Technologies, Inc. Expands WaferPierce Production Staff
DENVER--(BUSINESS WIRE)--Sept. 24, 2001--NanoPierce Technologies, Inc. (OTCBB:NPCT - news) today announced the addition of key operational personnel to the Technology Group Facility in Colorado Springs as the WaferPierce production facility nears completion. Facility construction will be completed in October 2001, while operational status is targeted for January 2002.

Stanley R. Grubbs has been appointed Director of Operations with full responsibility for North American production. He reports directly to Dr. Herbert J. Neuhaus, Executive Vice President of Technology and Marketing. Before joining NanoPierce, Mr. Grubbs was employed at the Department of Defense for 22 years. As the sole civilian Deputy Operations Officer at the Department of Defense, he was responsible for the inspection and repair of the M1 Abrams Combat Tank. Mr. Grubbs was classified as a Logistical Management Specialist and received 10 Sustained Superior Performance awards, 4 Special Act Awards, and the prestigious Civilian Medal For Special Service. During the Gulf War, he served with the US Marine Corps and received the Civilian Combat Medal.

Mr. Grubbs said, ``I am looking forward to the challenge that lies ahead. The technical team is right on track. It is my intention to deliver a world-class operation for the production of WaferPierce. I am confident my background and experience will enable me to do just that.``

Lee W. Gaherty has joined NanoPierce as a Process Engineer Technician. Mr. Gaherty has over 20 years experience in semiconductor fabrication production. He has worked with a variety of firms in the Colorado Springs area including LSI Logic Corporation, Ford Microelectronics, Rockwell Semiconductor Systems, United Technologies Microelectronics Center, and Mostek Corporation. Mr. Gaherty is a recognized expert in photolithography and statistical process control (SPC).

Mr. Gaherty said, ``I am thrilled to be part of the NanoPierce team. My experience in semiconductor production is a good match to the needs of NanoPierce, and I believe that my skills can quickly contribute to taking NanoPierce to the next level.``

``We are very fortunate to have successfully recruited these two gentlemen,`` stated Dr. Herbert J. Neuhaus, Executive Vice President of Technology and Marketing. ``NanoPierce is at a defining moment: our focus will now be to complete the transition from a technology development and marketing company to a profitable, commercial production enterprise. As Director of Operations, Stanley will be accountable for the entire infrastructure needed to sustain operations. It`s a huge responsibility.``

Dr. Neuhaus further said, ``Lee brings to the team invaluable real-world manufacturing experience. Because I believe it is vital to keep R&D and Operations distinct, he will perform a pivotal role as we ramp-up production. Lee will be a conduit between the technology group and the production group with one foot firmly planted in each world. We have built an amazing team here in Colorado Springs.``

NanoPierce Technologies, Inc. of Denver, Colorado, USA, is traded on the Nasdaq stock market (OTCBB:NPCT - news) as well as on the Frankfurt and Hamburg (OTC:NPI - news). In addition to the 12 patents it owns, NanoPierce has numerous applications pending, others in preparation, and various other intellectual properties related to NanoPierce`s proprietary NCS (NanoPierce Connection System). This advanced system is designed to provide significant improvement over conventional electrical and mechanical interconnection methods for high-density circuit boards, components, sockets, connectors, semiconductor packaging and electronic systems.

For more information on NanoPierce Technologies, Inc. please visit this web site: http://www.nanopierce.com

This announcement contains forward-looking statements about NanoPierce Technologies, Inc. that may involve risks and uncertainties. Important factors relating to the company`s operations could cause actual results to differ materially from those in forward- looking statements and are further detailed in filings with the Securities and Exchange Commission available at the SEC website (http://www.sec.gov). All forward-looking statements are based on information available to NanoPierce Technologies, Inc. on the date hereof, and NanoPierce Technologies, Inc. assumes no obligation to update such statements.


--------------------------------------------------------------------------------
Contact:

NanoPierce Technologies, Inc.
Paul H. Metzinger, 303/592-1010
303/592-1054 (fax)
paul@nanopierce.com (e-mail)
or
NanoPierce Card Technologies GmbH
Dr. Michael E. Wernle, +49-8102-8961-0
+49-8102-8961-11 (fax)
michael@nanopierce.com (e-mail)
or
Stock Enterprises (investor relations)
James Stock, 702/614-0003
Der erste Teil des Berichts von Kathy zum Open House findet sich auf ihrer Webseite:

http://www.investortoinvestor.com/dcforum/cgi-bin/dcboard.cg…

Hold NPCT and prosper

Jetsia
Spekulation vom RB Board:

>>>>>>>>
Novacard: !!! INTERESTING !!!

Whats about Novacard ? They have gone together with Biometrics (BAI) to make the superthin fingerprint smartcard that will be made using NCS. BAI directly admits to use NCS at their website. They are european leader of smartcards and other types of cards. They can manufacture more than 40 mio cards pr. year. Novacard says 3. aug.*:

"Doug Kozlay, President and CTO of BAI commented: “Bernd is probably the best developer in the world today of innovative advanced manufacturing technologies -- way beyond standard smart cards. We make a great team. BAI knows how to build secure, compact fingerprint ID modules and Novacard is a premier international card manufacturer. In just a few months we expect to meet ISO 7816 thinness requirements with a cost effective solution”.

Company information:

NOVACARD GmbH is a leading European card manufacturer with annual production capacity exceeding 40 million cards. Products include high quality laminated plastic cards, magnetic stripe cards, memory cards, smart cards, contactless cards and cards with combined technology (contactless and contact based). The company invests heavily in R&D and automated equipment. Novacard is headquartered in Oldenburg, Germany and has a number of production facilities and sales offices around the world.
More information is available at www.novacard.de.


Now thats really interesting. 40 mio cards a year with NCS....

- How far is it anyway from Münich to Oldenburg ?


kind regards frogdear

* from the news:
http://www.fingerprint.se/news.asp?news_ID=209

>>>>>

Novacard/BAI/Fingerprint/Infineon/-NCS LINK?
From the Novacard site:

http://www.novacard.de/

INFINEON`S BIOMETRIC SENSOR FINGERTIP



DEBUTS ON A CHIPCARD
FOR ZORG EN ZEKERHEID

As a health insurance provider in the Netherlands, Zorg en Zekerheid is tasked with managing a massive amount of participants information. Like many European health insurance providers, Zorg en Zekerheid already manages medical information by issuing health insurance cards to its patients, In an effort to take this system to a new level, Zorn en Zekerheid has started a pilot program that will both store relevant patient information and allow for biometric verification of user`s identity on the same card. This is being implemented initially in a pilot program with a patient card that contains both Infineon chip card ICs and an Infineon FingerTIP biometric sensor chip, a first for the European health care industry.
The pilot program is designed to allow a pool of approximately 800 to lOOO patients with Parkinson`s disease to track all information about their medical history, with all relevant details about the course of their illness and any medications prescribed for treatment. These special cards also come with a portable card reader that allows the patient to provide access for medical professionals to all data registered on the card. To meet the special needs of Parkinson`s disease patients, this card/card reader combination also functions as a medication reminder system via audio signals and a visual display that provides information on type - and quantity of medicine required for each patient.
Once the pilot project is concluded, the system will be implemented on a widerspread basis for Zorg en Zekerheid. This will allow patients to securely manage their medical treatment in an efficient manner that benefits both patients and health care provider.

>>>>>>>

Wer weiß, vielleicht braut sich ja in der Richtung was zusammen...

Hold NPCT and prosper


Jetsia
Toller Bericht von Kathy zum OH auf ihrer Seite:

http://www.investortoinvestor.com/dcforum/cgi-bin/dcboard.cg…


>>>>>
Nanopierce Card Technologies GmbH Open House Presentation September 20, 2001 - Part 1
Dr. Michael Wernle, President and CEO of Nanopierce Card Technologies GmbH opened the day’s presentations by introducing Paul Metzinger, President and CEO of Nanopierce Technologies, Inc., parent company to Nanopierce Card Technologies, GmbH.

Paul started his comments by expressing his gratitude to the people of Germany, as well as the people in the rest of the world, for the support shown to America after the World Trade Center tragedy. (Note that it was revealed to a few of us outside of the Open House, that Paul Metzinger, Stan Richards, Herb Neuhaus and a few others I will not name here were scheduled to have an appointment in the World Trade Center on the day of the attacks, but did not go because one person they were meeting with was delayed by a day. We were all very shocked and relieved to hear that, so you can understand that Paul was particularly moved by the tragedy.)

He then gave a brief breakdown on the company, inlcuding extending thanks to the investment bankers who have been working so diligently to help the parent company achieve adequate financing to fulfill the business goals of the entire company. He made a further comment away from his presentation that the company has no financial worries, that certain parties were arranging all of the financing necessary as needed and that they would be financing each segment of Nanopierce business individually as the need arose. This would allow for companies who are interested in particular segments to invest only in those segments that they are interested in, so that each segment could eventually be a stand alone company under the Nanopierce umbrella.

He said that the financing future of Nanopierce is assured because of the efforts of the investment bankers working with Nanopierce and that the company has a lot of financial strength with continuing availability of funding going forward.

Paul made a point of stating that Nanopierce is honored to have a fine subsidiary in Germany and gave full credit to Dr. Wernle for assembling a very talented team, which he said would be a very large part of the success of Nanopierce and its NCS technology.

He said that he has always been convinced that with the proper guidance, talent and financing, NCS could radically change the entire electronic connections industry and that he also believes that Nanopierce is starting to demonstrate that to the entire electronics world. He said that a very important part of that demonstration was going to occurr at the Open House.

Paul said that everyone at Nanopierce were fully ready, willing and able to answer any and all questions on any aspect of Nanopierce’s business on any level, opening the door to discussion during the various breaks between presentations.

Paul then turned the microphone over to Dr. Wernle who spoke about the technology of Nanopierce in a more technical indepth presentation. He also spoke about the strong demand for new technologies in the electronic market and that Nanopierce intends to use the company’s intellectual property to build up the company.

He spoke briefly about the structure of Nanopierce and the recent accomplishments including the applications and uses for Nanopierce Connection System (NCS).

Activities related to Colorado Springs and Munich including the company’s outlook over the next few months using slides to demonstrate:

The Basic Facts

* NanoPierce Technologies owns a revolutionary, enabling, and patented technology used to connect electrical components

* Microscopic hard particles (diamond) coated with metal work like “conductive sandpaper”

* Every electrical device requires connections

* Today’s electronics industry needs completely new connection approaches to meet lower target costs.

Today’s Structure of NanoPierce (with photos of facilities and bar chart)

* Denver (4)

✓ Headquarters
✓ Financing and Accounting
✓ Investor Relations

* Colorado Springs (9)

✓ Basic Process Development for NCS/WaferPierce
✓ WaferPierce Service (Manufacturing)
✓ Intellectual Property Management
✓ Sales & Marketing - US

* Munich (9)

✓Application Development : Flip Chip, LED,. . . . .
✓Sales & Marketing - Europe and Asia /Pacific
✓ Business Development

NCS - An Update


NCS uses small hard (diamond) particles applied to the surface coated with any metal, nickel for example, which transforms into a force concentrator whereby you apply pressure and have a concentration of forces at the tip. This is not sufficient in itself for bonding or contacting, so for that reason it requires several particles arriving at the surface that look like sandpaper. After these particles have been applied to a surface, there is bonding in several places for electrical connection.

This process can be used for a variety of surfaces such as PCBs (printed circuit boards), in the assembly of passive elements on a PCB to replace welding and soldering technologies, particularly now that companies are trying to avoid the use of lead in manufacturing.

Another opportunity is application in terms of improving conductivity in electrical appliances and component tests.

A third application, and the one NanoPierce believes to be the most promising, is direct application to semiconductor wafers, or WaferPierce, in order to find a new approach and to show how small semiconductor chips can be produced and mounted on flexible substrates and carriers.

Semiconductor assembly and packaging:

The idea is to use the chip which comes in wafer shape and to put it into the housing. Wire bonding is the classical method which means that it is simply glued then contact is established through smaller wires. It is a well established technologyk however it comes with some disadvantages, namely the space requirement and that it is fairly expensive with the increase of connections.

In some industries Dr. Wernle sees the demand to introduce packaging processes with a smaller footprint, which means the chip should only occupy the space on the PCB that it has itself. This step was pointed to in the 60`s by IBM with the three-fold process, which means that the chip is being “flipped” or turned around, so to speak and mounted with the active side down onto the PCB. This is why it is called flip chip technology.

In the past it was used with the three-fold process using welding and soldering. Nowadays you can use adhesives. NanoPierce believes that WaferPierce is a most interesting alternative for that process.

How does that work?

The semiconductor wafer is now manufactured and produced to apply individual NanoPierce contacts to the wafer. Basically the wafer is submerged into the respective chemical baths so that NCS is coated on all of the contact pads on the entire wafer at one time. Then you separate the wafer into individual dies which have to be mounted onto the substrate. NanoPierce is able to work with a number of different substrates, such as paper, PET, PVC, FR4, etc. The NanoPierce process is very robust and can contract not only copper and aluminum, but a number of conductive links which gives NCS a flexibility not found in any other processes. It can be used with any glue, including that which is available at the local supermarket, then you insert the die. So the NCS contacts pierce into the connections and account for the connectivity and conductivity. How you get the contact onto the wafer is a bit more tricky, but the application is simple an low cost.

Only recently, NanoPierce hit a milestone where it has been able to account for its first good micrograph, so you can imagine how complicated the process has been at the beginning. (I heard that a few weeks before the Open House, Nanopierce in Colorado Springs finally dipped their first whole wafer in the electroless process and that it was coated perfectly across all contact pads on the entire wafer. I believe this to be the micrograph referenced by Dr. Wernle.) He showed a picture of a silicon die with varying degrees of up to 1000% magnification. This consisted of a silicon die and a nickel plated surface which is embedded with the particles and which pierces into the copper bed. He said this is what WaferPierce is all about and it works too!

Where can we apply this technology?

WaferPierce - in Chip Modules:

* Applications:

✓ Phone Cards
✓ Health Cards
✓Finance Cards (Visa Cash, ...)
✓ GSM/UMTS Cards

* Market Volume:

✓1.5 billion units 2000
✓1.9 billion units 2001
✓Average annual growth rate greater than 25%

In smartcard chip modules and telephone cards you need to keep in mind that last year there were 1.5 billion parts being produced and at one point this year there were 1.9 billion units being produced. It is an up and coming market. The producers of these chip modules are looking desparately for opportunities to reduce the cost for the individual units and modules. Imagine 10 million units including chip and everything cost 25 pfennigs (10 to 12 cents) per day, so if you only save one pfennig (1/4 to ½ a cent) at the manufacturing level it accounts for a fortune.

WaferPierce - LED

*Applications

✓ Traffic Lights
✓ Automotive Tail Lights
✓Displays
✓ Power Lights

* Market Volume

✓Tokio - 700 MW Power Consumption for Traffic Signals
✓50 Million Cars
✓ Greater that 100 Billion Dies (Chips) used in 2000
✓ . . .

Another application is for LEDs (light emitting diodes) that NanoPierce has become involved with due to Mr. Sieg of Elcos who has really inspired them. LEDs are also on the rise for a number of applications such as traffic lights, automotive tail lights, to illuminate and replace power lights. An LED may not replace the ordinary bulb, but think about a Hologen lamp. In order to develop those in the industry there is a whole variety of applications in that sector. Market values are enormous and there is a great deal of pressure to do something to reduce costs and power consumption. When illuminating signs and traffic signal lights it takes 700 megawatts of electrical power consumption which is the output of a medium sized power plant. By using LED technology, thre could be great savings, especially due to the prolonged life of the individual diodes.

It is very difficult to get market volume figures but it is estimated that there were at least 200 billion dies used in 2000 and it is a developing market on the rise.

WaferPierce - Smart Inlays

* Replacement of Barcode Labels

✓ Express Mail Service
✓ Luggage Tracking
✓ Libraries
✓Article Surveillance

* Market Volume

✓ Barcode Labels in four major applications
✓ 1999 6.5 Billion
✓This volume has to be replaced year by year

A new application and market will be smart inlays which is a product for smart labels and to be used as a substitute for bar codes such as in express mail service or the identification of luggage. This is, of course, an issue being much discussed these days in light of the recent (terrorist) activities, how to identify luggage going onto airplanes.Also fingerprint identification. This is a very important issue which works by means of sensors on a card such as that developed by Siemens Infineon. A lot of these things have to be combined with an electrical connector and labels in monitoring of the protection against theft.

This is a market of hundreds of millions a year. We need to be perfectly clear about one thing. You can’t simply mount such a label and then use it for a few years. There are consumer goods. The label is used for one or two days maximum and then it is thrown out. In these applications back in 1999, 6.5 billion components were used. There is expected to be a dramatic increase in this market segment going forward. This can also be seen by the fact that semiconductor companies that have some sort of “know how” in this field have started to offer these technologies. Everyone would like to participate in this business.

These are just a few applications, but the applications are continuing to expand into other areas. WaferPierce can be used for any chips that have a low connection size where you have a number of packaging units. For instance in the driver circuits for LDCs. This is very important. Also in flash memories for PCs.

So what has been done in Colorado Springs to launch this product on the market?

This was introduced last year at the Colorado Springs Open House as an electroplating process. They have exploited that process and by means of a new process they have now managed to apply contacts in WaferPierce. The clean room being built should be completed in one to two weeks and they have also come up with samples of the wafers which can now be provided to customers.

What has been done in Munich?

NanoPierce has tried to increase their sales and marketing activities in their market segment. They have developed the product and can now start selling it. They have expanded their cooperations. They have developed the flip chip process in relation to WaferPierce and are focusing on smart inlays for smart labels and smart card chip modules. They have designed their test wafer which Fraunhofer Institute manufactured for them.

Colorado Springs also applied the contacts and produced flip chip samples. Dr. Wernle showed a slide of a chart showing the design of a wafer described as a very simple structure and with various connections used to show the industrial community how it works in order to gain their confidence and trust.

Over the past two years NanoPierce has developed a close relationship with their cooperation partners shown on a slide to be Elcos, Simotec, Multitape and Orga with space left open for new cooperations under discussion to be added to the list.

Dr. Wernle ended his presentation here and introduced Hans Ulrich Voller to speak on the basic principals of flip chip technologies. This presentation will be the beginning of Part 2 coming up next.

>>>>>>


Hold NPCT and prosper

Jetsia
Auditors of NanoPierce Technologies, Inc. Remove ``Going Concern`` Qualification on Financial Statements
DENVER--(BUSINESS WIRE)--Sept. 27, 2001--NanoPierce Technologies, Inc. (OTCBB:NPCT - news) today announced the filing of its June 30, 2001 Annual Report on Form 10-KSB with the Securities and Exchange Commission.

The Company further announced that in connection with the filing of the June 30, 2001 Financial Statements, its independent auditors Gelfond Hochstadt Pangburn, PC, Denver, Colorado issued an unqualified opinion, removing the ``Going Concern`` uncertainty paragraph from their Opinion.

Kristi J. Kampmann, Chief Financial Officer of the Company, said, ``The removal of the `Going Concern` uncertainty paragraph by the Company`s auditors is a significant financial event for the Company. We believe that the Company is sound and that the Company will be able to support continuing and the ever-expanding operations of the Company.``

Paul H. Metzinger, Chief Executive Officer & President of the Company, commented, ``We have worked long and hard to achieve this opinion from our independent auditors. The importance of an unqualified opinion on our financial statements from our independent auditors for future institutional financings of the Company cannot be understated. It is yet another significant development for the Company, which will promote additional confidence in the trading market for our securities, as well as enhance our financial image and stature with industry partners in the microelectronics markets.``

The Company reported at June 30, 2001 total assets of $6,307,592 of which, current assets were $4,972,996, total current liabilities of $170,739 and stockholders` equity of $6,136,853. The Company reported no long-term liabilities for the fiscal year ended June 30, 2001.

The June 30, 2001 Annual Report on Form 10-KSB can be obtained by accessing the Company`s filings with the Securities and Exchange Commission at www.sec.gov.

NanoPierce Technologies, Inc. of Denver, Colorado, USA, is traded on the Nasdaq stock market (OTCBB:NPCT - news) as well as on the Frankfurt and Hamburg (OTC:NPI - news). In addition to the 12 patents it owns, NanoPierce has numerous applications pending, others in preparation, and various other intellectual properties related to NanoPierce`s proprietary NCS (NanoPierce Connection System). This advanced system is designed to provide significant improvement over conventional electrical and mechanical interconnection methods for high-density circuit boards, components, sockets, connectors, semiconductor packaging and electronic systems.

For more information on NanoPierce Technologies, Inc. please visit this web site: http://www.nanopierce.com

This announcement contains forward-looking statements about NanoPierce Technologies, Inc. that may involve risks and uncertainties. Important factors relating to the company`s operations could cause actual results to differ materially from those in forward- looking statements and are further detailed in filings with the Securities and Exchange Commission available at the SEC website (http://www.sec.gov). All forward-looking statements are based on information available to NanoPierce Technologies, Inc. on the date hereof, and NanoPierce Technologies, Inc. assumes no obligation to update such statements.


--------------------------------------------------------------------------------
Contact:

NanoPierce Technologies, Inc.
Paul H. Metzinger, + 1-303-592-1010
+ 1-303-592-1054 (fax)
paul@nanopierce.com
www.nanopierce.com
or
NanoPierce Card Technologies GmbH
Dr. Michael E. Wernle, + 49-8102-8961-0
+ 49-8102-8961-11 (fax)
michael@nanopierce.com
or
Stock Enterprises
James Stock, + 1-702-614-0003 (Investor Relations)
or
WatchListLive.com
www.watchlistlive.com
Der zweite Teil von Kathy`s OH Bericht steht auf ihrer I2I Seite. Es ist eine Zusammenfassung von Hans Ulrich Völlers (Uni/TZM Göppingen) Vortrag:


http://www.investortoinvestor.com/dcforum/cgi-bin/dcboard.cg…


Hold NPCT and prosper

Jetsia
Jetsia,
wie bewertest du diese news?
hat das mit NPCT zu tun?
Taiwan katapultiert Nano-Technologie voran

Regierung will Forschungszentrum in Taipeh finanzieren /
Regierung stellt 290 Millionen Dollar bereit

28. September 2001, 17:16 Uhr

Von Dirk Delbrouck



Mit einem Finanzpaket von 290 Millionen Dollar soll bis Juli 2002 ein
Forschungszentrum in Taipeh entstehen. Damit will die taiwanische
Regierung die Wissenschaft unterstützen. In den neuen Labors soll die
Nano-Technologie weiterentwickelt werden.

Mit der finanziellen Hilfe, die die Regierung über einen Zeitraum von fünf
Jahren leisten will, sollen zudem geeignete Materialien für diese
Technologie gefunden werden. Das Projekt soll unter Führung des
taiwanischen Industrial Technology Research Institute (ITRI) laufen und mit
100 Forschern starten.

Durch zweidimensionale und 3-D Meßverfahren will man versuchen, die
Merkmale von Nanostrukturen auf der Teilchenebene zu verstehen. Aus den
Erkenntnissen erhofft man sich innerhalb der nächsten zehn Jahre erste
praktische Anwendungen. Vorstellbare Anwendungsgebiete seien
beispielsweise Halbleiter, Kraftstoffzellen sowie besondere Displays.
TheCooleWickerl, ich denke nicht, das dies Auswirkungen auf Nanopierce hat

- Zum einen ist hier doch eher von Grundlagenforschung die Rede. Praktische Anwendungen sind wenn, dann erst in ein paar Jahren zu erwarten.

- Nanopierce ist ja auch kein Nanotechnologie-Unternehmen im eigentlichen Sinne (obwohl der Name nicht schlecht gewählt ist ;) ) dies hat Dr. Neuhaus bereits einmal ausgeführt.

- Sollten sich aber Technologien für noch kleinere Chips aus den unterstützten Projekten ergeben, müssen diese ja auch irgendwie mit der "Außenwelt" in Verbindung treten. Gerade das Nanopierce Connection System ist besser als bisherige Verbindungstechnologien für pads im Nanobereich zu gebrauchen, wenn man sich mal die technischen Ausführungen z.B. von Dr. Wernle durchliest. So lange noch elektrischer Strom bei den Produkten verwendet wird, ist Nanopierce im Rennen, und das kann ja noch eine Weile dauern ;) ...


Hold NPCT and prosper

Jetsia
Gern geschehen :)

Interessantes Posting von Kathy auf dem RB bzgl der IMAPS (Nanopierce wird auf ihrem Messestand auch die Smart label inlays demonstrieren):


>>>>>>
Events surrounding Nanopierce are rapidly developing. I also hear that Nanopierce will be demonstrating the application of chips for smart label inlays that were specially designed by Nanopierce and manufactured by Fraunhofer Institute at the IMAPS in their booth. These chips will be applied to substrate modules with antennas. These inlays will be manufactured by Nanopierce and sold to smart label companies to be used in their products.

I have also heard that there will be at least six people from Nanopierce at the IMAPS doing demonstrations of product samples, three of them will be giving symposiums. I think that this will be very important for Nanopierce to show what they can do before the largest audience of microelectronics participants in the world.

Kathy

>>>>>
Quelle:
http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…


Hold NPCT and prosper

Jetsia


Werde demnächst wohl für ein paar Tage/1-2 Wochen "aus familären Gründen" :) nicht posten können...
Hallo jetsia,

ich wuensche Dir "ALLES GUTE ZU DEINEM BEVORSTEHENDEM EREIGNIS" und freue mich schon drauf wieder von Dir zu hoeren wenn Du zurueck bist!

See you

EHF (eazmf)
Kathy schrieb in ihrem Bericht zum OpenHouse:
"Over the past two years NanoPierce has developed a close relationship with their cooperation partners shown on a slide to be Elcos, Simotec, Multitape and Orga with space left open for new cooperations under discussion to be added to the list."

Bei http://www.multitape.de/ steht unter "Inlets" folgendes geschrieben:

"Chip-card inlets with unique connection technology

Contactless smart cards are now at the forefront of technology, and multitape has been a prime mover in this development through its production of highly efficient transponder inlets. In 1997, multitape expanded its product spectrum to include chip-module placements and the company also developed a unique connection technology which increases effeciency in the mass production of contactless or combination cards."

Sollte es sich da vielleicht um NCS handeln? Ist es vielleicht schon im Einsatz?

Gruß Noemi

PS: Danke Jetsia, daß du uns immer auf dem laufenden hältst, und auch von mir alles, alles Gute für Mutter und Kind!
noemi25, gut gestöbert! das klingt ja doch sehr nach NCS...
:) :) :)
dazu paßt die Passage aus dem Jahresbericht, das bereits "agreements for the application of NCS" existieren...

Auf Kathys Seite steht jetzt der dritte Teil des OH Berichts (s.a. thread von Katzennarr):
http://www.investortoinvestor.com/dcforum/cgi-bin/dcboard.cg…

Außerdem ist das Waferpierce-Verfahren auf der Homepage näher beschrieben:
http://www.nanopierce.com

Vielen Dank noemi und EHF (better known as eazmf, :) ) für die netten Wünsche

Hold NPCT and prosper

Jetsia
Danke ROAR!

noemi, ich hab mal Kathy gefragt, sie ist immer sehr gut informiert. Ihre Antwort:
>>>>>
Jetsia,

Multitape as far as I know is talking about their patented cut clamp system which they developed and is the preeminent smart card connection system for antenna attach which Dr. Wernle wrote about while working for Meinen-Ziegel. Mienen-Ziegel used the cut clamp system before they were absorbed by DataCard.

Multitape is working with NanoPierce for some time now and has supplied modules for test purposes for the reel to reel system being used by NanoPierce in Colorado Springs. That is all I know about that subject.

Kathy
>>>>>

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

Hold NPCT and prosper

Jetsia
servus,
jetsia, ich möchte mich der allgemeinheit hier anschliessen,
gesundheit und das alles gut verläuft.
toi, toi, toi!
Hi Jetsia!

Wenn ich die Zeichen hier richtig deute, wirst Du ja anscheinend Vater oder Mutter ;);)
Alles gute an dieser Stelle, hoffentlich läuft alles "nach Plan". ;)

Viele Grüße,

Dirk.
Dirk_I, ja bald werd ich wieder Mami :) Dir und TheCoolWickerl vielen Dank für die netten Wünsche...

Die IMAPS in Baltimore startet nächste Woche, da kann Nanopierce der ganzen Elektro-Industrie zeigen was sie drauf haben... :)

Hold NPCT and prosper

Jetsia
OK, hier noch mal Waferpierce zum mitschreiben und über`s Bett hängen...

>>>>>
WaferPierce is a flip chip technique using the NanoPierce Connection System NCS™ to create the NanoPierce surface on the bond pads at the wafer level. WaferPierce employs the time-proven electroless plating process to selectively deposit hard, conductive particles onto the bond pads on the wafer, prior to the wafer being cut into tens of thousands of individual chips.

The proprietary WaferPierce production process requires no masking or "under bump metallization” and has very high volume capabilities using inexpensive, off-the-shelf systems. With the addition of a single step, embedding the conductive particles on the bond pad surface, existing electroless systems can be retrofitted for WaferPierce production. WaferPierce is considered by the Company to be the ideal application opportunity for its technology.



Chip technology has far surpassed the electrical and mechanical connection technology that supports it. Demands placed on chip attach methods include size and cost reduction coupled with improved electrical, mechanical and thermal performance. The elegantly simple concept of flip chip attachment embodies what is for many applications the optimum chip attach technology for the future.

Flip chip application advantages include:

Creation of area array connection patterns – contacts spaced over the front side chip surface.
Facilitates lowest pitches – distances between contact pads.
Most efficient for high frequencies due to the shortest connection path.
Highest productivity of the assembly process due to simultaneous contact attachment.
Lowest packaging dimension - no housing or encapsulation needed.
Optimum thermal conduction.
The WaferPierce connection between a flip chip die and the contact partner, such as FP4 substrates, PCBs, flex circuits, etc., requires nothing more than an adhesive to fix the connection partners. When the flipped die is put into place and pressed onto the substrate, the sharp particles on the bump surface of the die pierce into the mating contact pads. The process can instantly produce high performance electrical connections to all the die contact pads simultaneously in just a fraction of a second.




Step 1: Apply adhesive
Step 2: Pick and place chip


Chip assembly with WaferPierce NanoPierce test chip with NCS bond pads
Any chip type LED (GaAs), CMOS (DRAM), etc
Any contact material Cu, Al, Au, conductive ink, etc.
Front or back I/O LEDs type front and back I/O or single sided I/O
Any production volume maskless process makes low or high volume production cost- effective

High assembly rate No underfill
No flux application
No reflow
No flux clean up

WaferPierce in comparison with the basic die attach
techniques flip chip and conventional wire bonding.

Conventional Wire Bond Flip Chip WaferPierce
Wafer Treatment None Zincate
Electroless Nickel

Bump

Electroless Gold
Zincate
Co-depostition

Nickel & particles

Electroless Gold

Chip Assembly Dispense die attach adhesive

Pick and place die

Cure die attach adhesive

Wire bond each pad

Encapsulate (transfer mold)

Cure encapsulate
Print solder paste

Pick and place die

Reflow solder

Clean flux residue

Underfill (capillary action)

Cure underfill
Dispense adhesive

Pick and place die

Cure adhesive



NanoPierce test die with NCS surface on bond pads

High performance electrical connection due to reduced electrical contact resistance.
Cost reduction because no anisotropic adhesives (ACA), pastes (ACP) or tapes are necessary.
Compatibility with existing high-volume, high-speed flip chip die attach machines.
>>>>>>>

Hold NPCT and prosper

Jetsia
Und hier noch mal der Markt bzgl. Waferpierce (von der Homepage):

>>>>>>>
Wafers are silicon slices as thin as 50 microns that are used as carrier material for integrated circuits (chips). As current developments work on increasing the wafer diameter, the size of the dies will be reduced beyond the point of invisibility. Shrinking the associated packaging and electrical interconnection becomes as important as the die itself.

New chip interconnection technologies must be developed in order to meet current chip package requirements for physical and electrical properties, and not less important, for cost effectiveness. These demands are met by the breakthrough development of the NanoPierce Connection System NCS™ at wafer level – WaferPierce.

WaferPierce is a state-of-the wafer level chip attach technology comprised of two key parts:

Bond pad treatment
Direct chip attach process


Wafer bond pad with hard, conductive particles


Comparable to flip chip technology, WaferPierce is a simultaneous contacting process based on the principles of SMT (surface mount technology), but incorporating the additional benefits of the NanoPierce Connection System technology NCS.



The low investment in capital equipment and the highly cost-effective nature of WaferPierce production and chip attach makes WaferPierce an enabling interconnection technology for any chip type (CMOS, LED, etc.) as well as for cost-sensitive electronic components such as smart labels and smart card chip modules.

The excellent performance benefits show great promise and have generated active interest among industry leaders for semiconductor, automotive and aerospace applications. Flip chip attachment is projected to grow rapidly in the next few years. As the simplest and most cost-effective chip attachment method, meeting the most stringent performance standards, WaferPierce is poised to capture a significant portion of this enormous and profitable market.
>>>>>

Wenn man bedenkt, dass der Markt elektronischer Verbindungen auf 24 Milliarden Dollar geschätzt wird, kann man spekulieren, wieviel Marktanteil sich Nanopierce mit dieser revolutionären Technologie erobern kann....

Schöne Träume ($$$$ :laugh: )


Hold NPCT and prosper

Jetsia
@Jetsia

Naja, wenn es schon das zweite ist, hast Du ja schon übung. ;):D;)

Alles gute,

Dirk. ;)
@all!
Finnegan23 (ein jeder der das NPCT-Board bei RB verfolgt kennt Ihn) hatte heute ein Gespraech mit Dr. Wernle.
Da ich mir nicht sicher bin dass jetsia auch morgen noch posten kann (vielleicht hat Sie es ja schon hinter sich waehrend ich diese Zeilen schreibe; nochmals Alles Gute an jetsia!!) habe ich mir die Freiheit genommen, diesen m.M. nach sehr interessanten Bericht hier zu psten:

Quelle:
http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

By: finnegan23 $$$$
Reply To: None Thursday, 4 Oct 2001 at 6:59 PM EDT
Post # of 51967


A (small) update.

I managed to talk to Dr. Wernle today. I will share a few of the things he
mentioned. As always, he was very cautious with what he was saying because
(my interpretation) he does not want to provoke any unjustified expectations.
While I can`t quote everything he said, I must say I feel assured that we are
on track and VERY close.

So:

- (this was very important for me...) The rules are changing a bit.
Nanopierce is no longer dependent on a single potential customer. If they are
getting the feeling a potential customer (even a big one) is trying to delay
the negotiations because he thinks he will achieve a better price that way -
they are able to tell him that they will sign an agreement with a different
company so he has to show his colors right now (this is very positive IMHO).

- Kent Kloock mentioned that he learned that we do know just about 25% of
what is going on. Dr. Wernle confirmed that. He said the company prefers not
to talk about the possibilities, the research and the progress, but only
about results. One reason for this is that the company does not want to be
thrashed for raising hopes if there are no results. From what I know (source
is not Dr. Wernle), A LOT is going on behind the scenes, in regard to
financing and new applications.

- They have samples of flexible PET circuit boards now (not only solid or
semi-flexible) and are heat-testing them. As you know, these are needed for
SmartLabel manufacturing. The boards are still in test-design (they won`t
work on a SmartLabel, but you can test the connections). They will have a
complete inlay ready for mass production within 3 to 5 weeks.

- the testing of Waferpiercing is almost completed. This means, the company
can answer about 75% of the questions of potential customers from the hip.
There is still testing to be done, but this will not influence negotiations
any further, because there is sufficient proof of the technology.

- Some delay is not Nanopierce`s fault. For example, they received the
substrates for the flexible boards 8 weeks late - according to Dr. Wernle one
has to deal with that while being a small company.

- expect inlays to be the first revenue-generating application. LEDs will be
next, if not simultaneous.

- NCS is very attractive as a connecting technology for chip manufacturers,
but for SmartLabels you need more. Dr. Wernle feels that his company is in an
excellent position there: Based on their experience, they know how to produce
them, how to organize central buying, and a lot more I can`t tell you in
detail. One could summarize it under the term "networking".

- the IMAPS in my eyes will be much more important than many are realizing.
NPCT was attending last year and this will be the second year and they can
prove that they have not only been talking but are ready to deliver now.

- for those who are not informed about the IMAPS rules (I did not know this):
IF you are allowed to lecture (not many are allowed to, and it is highly
unusual that a small company like Nanopierce can do twice), you have to
deliver an abstract of your paper in advance (in February 2001). You have to
deliver the final version in advance (somewhen in summer 2001). You are not
allowed to publish this in newspapers / magazines until 90 days after the
IMAPS. Dr. Wernle said that they have made tremendous progress after he filed
the paper so they are considering to write an appendix to the paper to let
everybody know what they can do now.

- IMAPS is not a trade fair where you acquire customers. But because the
elite of the big players will be there, it is a great opportunity to spread
the word. 8 people from Nanopierce will attend, 4 from Germany, 4 from the
US. It will be the first time Nanopierce has a booth and will show the
products. Dr. Wernle: "Many of us have a lot of experience in this business,
we know what to do and it will be impressive." Many funds managers will be
there, too.

- Dr. Wernle feels the hiring of a sales representative in Taiwan is totally
underestimated by the investment community.

- Potential customers will never admit how deeply impressed they are about
the technology because they are trying to get the best (lowest) price they
can. But the company feels that their potential customers really want and
need NCS.

- A big advantage will be: Well, NCS is fine, but the company has sufficient
highly qualified staff to offer NCS, software, chip-desing, configuration,
implementation, RFID knowledge, and so on. According to Dr. Wernle, the
success will come from the package they can offer.

=======================================================

Want a smily from Dr. W. again? "We won`t buy a Lear jet before 2004. I don`t
want my shareholders to think we are wasting their money." (this was kidding
*smile*)

=======================================================

Ok, I may add a few more things. Source is not (or not only) Dr. Wernle. I
received an email from Paul Metzinger, I made a few phone calls and I did
some research (no, I did not call CEOs, there are different ways to get an
info *smile*)...

- Paul Metzinger: "The future of Nanopierce is getting brighter all the time.
Our technology continues to receive ever greater recognition and endorsement
by world recognized authorities."

- I second that. The big guys are there and we are very close. The names are
familiar to everybody on this board, our guessing was not too bad. Sad, but
true, legal constraints (still) apply.

- There is more to come. Await significant news in October (not only one).

- The time frame for revenues keeps unchanged. Don`t expect anything
significant in the quarterlies before I/02 or even II/02.

- There is a lot to come from three different continents very soon.

=======================================================

I do NOT want to create "excitement" with this (as it has been stated on this
board today). Just wanted to share the info. Maybe some longs will like it.
For the bashers/negatives: No, no contracts announced. Yes, still the same
ole thing over and over. You will realize very soon... (this was no work at
all, just a few phone calls... why don`t you do it?)

Best regards
Finnegan

+++++++++++++++++++++++++++++++++++++++++++++++++++++++++

Vielen Dank an dieser Stelle auch an Finnegan fuer diesen Bericht. Much appreciated!!

+++++++++++++++++++++++++++++++++++++++++++++++++++++++++
So long
EHF (eazmf)
EHF, vielen Dank für`s posten SEHR INTERESSANT! Tja, ich bin immer noch da. Schön zu sehen, dass Du hier die Stellung, wenn ich weg bin...

Hold NPCT and prosper

Jetsia
Hi Jetsia -
auch von mir die besten Wünsche für dich und den Nachwuchs.

EHF - find ich prima das du den Part von Jetsia übernimmst. Danke.
Halt, so schnell werdet ihr mich noch nicht los... (und vielen Dank Gelbe Seiten für die Wünsche)

>>>>>>
Kathy`s Bericht zum Stand der Dinge:

"10/5/01 - NPCT - NanoPierce Update from Investor to Investor"

Dear Investor to Investor readers:
People have been asking me a lot of questions as to why NanoPierce went to Taiwan, set up sales offices in Taipei, and hired an Asian promotional firm to spread the word about NanoPierce in the Asian markets. I have spoken to Paul Metzinger about the questions I have been receiving and this is the information I have been give permission to disclose now that the news has been released.

What most people are missing in the Taiwan sales representative announcement is something that was not said in the press release. NanoPierce was asked by a company that has publically expressed its desire to go into the manufacturing of smart labels to go to Taiwan for a business meeting. Dr. Wernle spoke to this company about NCS and also about Simotec`s high speed ModulAS reel to reel production system, which is capable of using NCS to pick and place chips from NanoPierce`s specially designed wafers as demonstrated at the Munich Open House.

NanoPierce has been developing several avenues for revenue streams, and one of those avenues all along has been to sell Simotec machines for a commission. It is my understanding that the company will enter into appropriate business associations for the utilization of the NCS which will include (but not be limited to) licensing NCS to the potential customers for these machines. This could result in further joint ventures with additional companies in the future. NanoPierce was also hired by Simotec to design the software that runs those machines. NanoPierce has not entered into their strategic partnership with Simotec for nothing. A lot has developed for the company due to that agreement being in place.

There is a great deal more going on with this company then most people seem to understand. The news about the demonstration of a "WaferPierce(TM) NCS wafer in the highspeed, advanced micro-assembly production system, marketed as ModulAS(TM), of its strategic partner Simotec® to manufacture chip module substrates for smart cards and other applications" was extremely significant to NanoPierce.

http://www.nanopierce.com/daten/investor/press_archive/news0…

Events surrounding Nanopierce are developing very rapidly from the company`s point of view. I posted on Raging Bull on October 1st that it had been verified to me that NanoPierce will be demonstrating the application of chips for smart label inlays that were specially designed by Nanopierce and manufactured by Fraunhofer Institute at the IMAPS in their booth and that these chips will be applied to substrate modules with antennas. I also said that I had been told that these inlays will eventually be manufactured by NanoPierce and sold to smart label companies to be used in their products. This is not really all that surprising when you read this paragraph from the press release about the Simotec machine demonstration:

"Combined with NCS WaferPierce(TM) chips, this innovative production system can also be used to manufacture inlays (antenna and chip assemblies) which are used in the manufacturing of smart labels for such applications as parcel delivery systems, inventory control, product authenticity, baggage identification controls, library control systems and, most importantly, security identification devices. . .WaferPierce(TM) chips can also be used to manufacture "flip chip`` connection devices with the ModulAS(TM) system."

There is a photo of Paul Metzinger standing next to the Simotec machine during his closing speech at:

See a full front view of the machine in this photo showing Mr. Tideman of Schriener Ettiken (a smart label company in Germany) during his presentation on the subject of smart labels at:

There are other more detailed photos of the different parts of the machine on this page:

http://www.nanopierce.com/daten/company/openhoeuse_event/eve…

We have been given some very interesting clues along the way as to the direction that NanoPierce is headed with their technology. I was also told that while Dr. Wernle was in Taiwan speaking to the company interested in manufacturing smart labels and the Simotec machines that when the news came out about the LED assembly array patents NanoPierce had filed that Dr. Wernle received expressed interest from other companies in regard to the manufacturing of LED applications.

Next week on October 8 – 11, 2001 at the IMAPS 2001 – 34th International Symposium on Microelectronics at the Baltimore Convention Center, NanoPierce will have Booth Number 1402

There will be a Presentation given by Dr. Michael E. Wernle and Michael Kober on:
"Electrical and Thermal Performance of a New Process for High Density LED Array Assembly"

There will also be a Presentation given by Dr. Herbert J. Neuhaus and Bin Zou
"A New Electrical Surface Joining Technology For Flip Chip Application"

http://www.imaps.org

I believe that this will be a very important event for Nanopierce to show what they can do with NCS before the largest audience of microelectronics participants in the world.

My observation on the hiring of the Asian promotional firm. This was done to get more exposure of NanoPierce in the Asian markets due to the interest that has been coming out of Taiwan in regard to NanoPierce`s Connection System. A side benefit of that promotion is to increase interest for investment in the company through stock purchase or industry financing. This was not done frivolously in spite of statements I have read and heard to the contrary by uninformed parties. I am certain that future announcements coming from the company will show me to be correct in my assessment.

In summary, Dr. Wernle made the trip, and the smart label company requested that NanoPierce open an office there. Dr. Wernle came back with the beginnings of an agreement for sales representation in Taiwan. NanoPierce was asked to make the trip. NanoPierce did not go over there searching for representation.

As to further promotion that people keep requesting information on. The company is aware that people are restless and want to see some further promotional activity taking place. I was told that the Board of Directors has made the determination that any increased activity should take place when something more significant is released to the public and that news of that type is not ready for release right now. This decision of the Board of Directors has also been reaffirmed by the IR/PR firm responsible for the campaign. There are indications that something of that magnitude is on the horizon, but no date is specified and no details are available to me or the public due to confidentiality agreements in place. It is my personal opinion that we will see something that will justify our patience in the not too distant future. Things of this nature can not be rushed.

One last item. I am still working on the Simotec Presentation from the Open House in Munich and hope to have it posted this weekend. I have been sidetracked by other issues which have slowed down my progress, please forgive the delay in getting it up. I will let you know when it is ready.

Kathy Knight-McConnell
>>>>>
Quelle:

http://www.investortoinvestor.com/dcforum/cgi-bin/dcboard.cg…


Hold NPCT and prosper

Jetsia
@jetsia Dax

Hi !
Ich lese schon längere Zeit Deine interessanten Berichte
und Quellenangaben. Leider vermisse ich kritische An- merkungen, was zwar nachvollziehbar ist, weil Du offenbar
ein erhebliches Interesse an NPCT hast (verliebe Dich nie
in eine Aktie ;-)).
Ich fasse jetzt alles mal aus meiner "beschränkten Sicht"
(vor allem technisch) zusammen :

- NPCT stellt Kontakte in verschiedenen Anwendungen her,die
dadurch günstiger, mit weniger Ausschuss und schneller
hergestellt werden können.
- (Dauer-)Tests laufen noch, teils herrausragende
Ergebnisse.
- Smart Card/Labels und LED sollen wohl lizensiert werden,
da Markt zu gross.
- Wafer gemischt.
- Wafer dürften die "Killerapplikation" sein.
- Interesse von Investoren und Anwendern ist da.
- Weitreichende Gespräche und Visionen vorhanden.
- Geschäft soll nachhaltig in Q2 2002 losgehen.
- 2002 müsse die Aktie zum Mond fliegen (logische
Folgerung).

Zusammenfassend die schönste aller Welten und 2002 sind wir alle reich. Leider ist die (Börsen-)Welt nicht so. Demnach
sind folgende Fragen zu stellen :

- Wie gross sind die Risiken der einzelnen Applikationen
(insbesondere Wafer) einzuschätzen.
- Welche Risiken gibt es überhaupt noch (Diese müssen ja
gewichtig sein, sonst würde NPCT höher bewertet)?

Wie hoch ist eigentlich die Marktkapitalisierung von NPCT ?
Was würdest Du persönlich kritisieren, wenn Du lediglich
die negativen Aspekte berücksichtigst ?

any thougts ?
cu
PS: Alles Gute für die Geburt
Hi tntrxrwelle,

"verliebe dich nie in eine Aktie" - ZU SPÄT :)

Du hast recht, ich habe da ich kräftig in NPCT Aktien investiert habe ein erhebliches finanzielles Interesse daran, dass sich diese gut entwickeln. Ich glaube aber nicht, dass meine postings hier grundsätzlich was am Kurs ändern können...

Das hier kaum über negative Einflüsse geredet wird, liegt daran, dass hier fast überhaupt nicht diskutiert wird. Mittlererweile betrachte ich den Thread eher als Informationsdienst ;) Ich finde es aber schön, wenn auch mal jemand kritische Gedanken äußert.


Zu Deinen Fragen/Anmerkungen:

"- NPCT stellt Kontakte in verschiedenen Anwendungen her, die dadurch günstiger, mit weniger Ausschuss und schneller
hergestellt werden können."
--- ja und die Verbindungen haben, wenn man die technischen Artikel liest, zudem auch noch bessere elektrische Eigenschaften, ermöglichen weitergehende Miniaturisierung und neue Anwendungen (zB durch bessere Leitfähigkeit. höhere Dichte elektrischer Verbindungen bei LEDs etc.)

"- (Dauer-)Tests laufen noch, teils herrausragende
Ergebnisse."
--- ja, Hitze Tests etc sind noch nicht komplett. Bisherige Testergebnisse lt. Firmen-Aussage hervorragend

"- Smart Card/Labels und LED sollen wohl lizensiert werden,
da Markt zu gross."
--- bzgl. Smart Cards/LED stimmt dies, Labels will NPCT evtl. selber produzieren (die inlays mit Antenne sollen dann an die Smart Label Produzenten verkauft werden)

"- Wafer gemischt."
--- die aus den Wafern hergestellten dies werden ja für die obenstehenden Anwendungen benützt

"- Wafer dürften die "Killerapplikation" sein."
---korrekt, der größte potentielle Markt

"- Interesse von Investoren und Anwendern ist da."
--- ja lt. Aussage der Firma (als äusserer Beleg dafür können unter anderem die Vortäge von Fremdfirmen/ Institutionen auf dem OH gewertet werden).
Weiterhin steht im Jahresbericht nachzulesen, dass Nanopierce Vereinbarungen zur Anwendung von NCS hat.

"- Weitreichende Gespräche und Visionen vorhanden."
--- ja Gespräche finden schon seit Jahren statt aber lt. Aussage der Firma intensivieren sich diese. Große Firmen schicken ihre Testwafer etc.
Also Paul Metzinger keine Visionen hat kann man nun wirklich nicht behaupten :laugh:
Vor allem auch durch strategische Partnerschaften und gute Kontakte (Dr. Wernle) scheint es bis jetzt sehr gut zu gelingen, den business plan umzusetzen...

"- Geschäft soll nachhaltig in Q2 2002 losgehen."
--- das Geschäft wird wohl schon früher losgehen, wir werden davon aber scheinbar erst durch die Quartalsberichte ab Q2/2002 informiert werden (Stillschweigeabkommen)

"- 2002 müsse die Aktie zum Mond fliegen (logische
Folgerung)."
--- darauf warte ich :) dabei sollte man aber bedenken, dass große Firmen zunächst einen kleinen Teil ihrer Produktion umstellen werden und erst, wenn ihre Kunden mit den Produkten zufrieden sind umfassender einsteigen... also setze ich nicht auf einen Knall sondern eine schöne Bergtour ;)


"Zusammenfassend die schönste aller Welten und 2002 sind wir alle reich. Leider ist die (Börsen-)Welt nicht so. Demnach sind folgende Fragen zu stellen :
- Wie gross sind die Risiken der einzelnen Applikationen
(insbesondere Wafer) einzuschätzen."

--- Risiken für uns als Anleger:

die restlichen Tests verlaufen nicht positiv, die Aussagen über bisherige Ergebnisse stimmen nicht (das wäre schon krass, sowas soll aber an der OTC schon vorgekommen sein).

Die Massenproduktionsfähigkeit kann nicht nachgewiesen werden (was nutzt mir die schönste Technik, wenn ich sie nicht in grossem Stil anwenden kann) Hier scheint sich aber insbesondere durch ModulAS dass Problem schon gelöst zu haben.

Trotz guter Ergebnisse lassen sich die grossen Firmen nicht zu einer Umstellung bewegen (marketing Erfolg bleibt aus).
Dies ist der entscheidende Punkt. Viele Anleger warten auf die offizielle Akzeptanz (große Verträge) und zahlen dann lieber etwas mehr, als sich auf die bisherigen Info`s zu verlassen

- Welche Risiken gibt es überhaupt noch (Diese müssen ja
gewichtig sein, sonst würde NPCT höher bewertet)?

S.o. Risiken liegen wie gesagt in der Technologie (da scheint bis jetzt alles gut zu laufen), in der Massenproduktionsfähigkeit (scheint sich auch herauszustellen) in der Vermarktung (auch hier tut sich was über die strategischen Partnerschaften und Taiwan ...) und natürlich auch in der Finanzierung. Das Geld reicht bis ca. Ende 2002. Dann müssen entweder Einnahmen her oder eine Finanzierung. Ich hoffe mal auf das erstere oder wenn schon eine Finanzierung, dann eine Industrie-Finanzierung durch einen großen Partner (das wäre natürlich ein großer Vertrauensbeweis).

Was mich doch sehr positiv stimmt ist die Wegnahme der "Bedenken"-Klausel durch die Wirtschaftsprüfer (d.h. die Firma scheint entweder durch Verträge/und oder Finanzierung gesichert, sonst hätte kein Wirtschaftsprüfer so etwas gewagt). Die Wirtschaftsprüfer wissen natürlich mehr als wir und haften ja auch für ihre Aussagen. So was hab ich an der OTC noch nie gesehen :)
Und: die Tatsache, dass Nanopierce bereits "agreements" hat (s.o. Jahresbericht)

"Wie hoch ist eigentlich die Marktkapitalisierung von NPCT ?"
Da sie 55 bzw. incl aller Optionen 60 Millionen Aktien haben (davon 35 im free float glaub ich) und der Aktienpreis ca. 0,75 Dollar beträgt: 45 Millionen Dollar.

"Was würdest Du persönlich kritisieren, wenn Du lediglich
die negativen Aspekte berücksichtigst ?"

Ich glaube, die Dinge werden immer etwas länger dauern, als wir uns es erhoffen. Über einige sehr optimistische Aussagen, zeitlich verfehlte Ziele bzw. die HC Finanzierung war ich nicht gerade glücklich :cry:
Aus manchen "Gesprächen" (Boeing?)hat sich ja nun nach einigen Jahren (na ja, zumindest vielen, vielen Monaten) immer noch nichts für uns Sichtbares ergeben...

Aber ich denke, jetzt deutet wirklich alles in die selbe, positive Richtung.
Was mich stört, ist natürlich der niedrige Aktienkurs. Wenn man sich aber das Börsenumfeld mit den verunsicherten und enttäuschten Anlegern ansieht, weiß man schon, warum viele nicht auf OTC Aktien setzen (obwohl sich Nanopierce ja die letzten Monate beachtlich geschlagen hat). An der OTC kann man sich auch nie sicher sein, ob der Kurs nicht manipuliert wird (siehe HC Verfahren) ...
Viele Anleger die jetzt schon von Nanopierce wissen, werden erst reingehen, wenn sie Schwarz auf Weiss sehen, wieviele Einnahmen Nanopierce hat...
Fondsmanager werden ebenfalls erst bei gesicherten langfristigen Einnahmen einsteigen.
Außerdem wer weiß denn momentan schon von Nanopierce? Im Grunde doch Leute wie wir, die mehr oder weniger zufällig davon gehört haben. Wenn/falls Nanopierce erst mal auf mehreren Konferenzen/Messen präsentiert, Artikel und Werbekampangen gelaufen sind Verträge bekanntgegeben werden und die Fonds sich ihren Einstieg gesichert haben werden viele Anleger erst Notiz von Nanopierce nehmen (aber dann zu anderen Preisen).

Im Moment ist halt vieles Vertrauenssache (glaubt man den Aussagen/Projektionen des Managements). Ich glaube den Aussagen voll und ganz, andere eben nicht. Das Risiko ist momentan noch etwas größer, dafür gibt es die Aktie auch so günstig. Es ist halt immer eine "Gier/Angst" Abwägung oder wie die Banker sagen "Potential/Risiko" :laugh:

Ich bin wirklich sehr überzeugt von Nanopierce, ich bin aber mit anderen Aktien schon auf die Nase gefallen. Als Guru binn ich also eine völlige Fehlbesetzung. Also: vertrau nur Dir selber, informier Dich gut und treff Deine eigenen Entscheidungen. Das ist hier alles nur meine unmassgebliche Meinung. Ich kann daneben liegen. In spätestens einem Jahr wissen wir mehr ...

Hold NPCT and prosper

Jetsia

P.S.: vielen Dank für die Wünsche
Hi Jetsia

erstmal vielen Dank für Deine umfangreiche und wiederum
informative Antwort.

>verliebe dich nie in eine Aktie" - ZU SPÄT
Offenbar ;-)

>ich glaube aber nicht, dass meine postings hier >grundsätzlich was am Kurs ändern können...
Stimmt, aber nur, weil der Kurs in USA gemacht wird.

>Mittlerweile betrachte ich den Thread eher als >Informationsdienst Ich finde es aber schön, wenn auch mal >jemand kritische Gedanken äußert.
Stimmt, das ist auch nicht schlecht. Im Gegensatz zum
RG-Board ist es hier Basher und Spammer frei. Andererseits
fliegt hier eine Erfolgsmeldung (o.Bericht) nach der nächsten ein, welche quasi unreflektiert oder zumindest
leicht rosarotbrillig (neue wortkreation) wiedergegeben wird. Ganz negativ ausgedrückt, das worst-case Szenario
(Hitzetest nicht bestanden = Kohle weg) wird einfach aus-
geblendet.

>ja, Hitze Tests etc sind noch nicht komplett. Bisherige >Testergebnisse lt. Firmen-Aussage hervorragend
Man vergesse nicht den Salznebelsprühtest ;-)

> die aus den Wafern hergestellten dies werden ja für die >obenstehenden Anwendungen benützt
Das hatte ich bisher so nicht geschnallt. Ich hatte gedacht
bei LED und Label werde zwar auch die Kontaktart von NPCT
genutzt, aber in einem anderen Bereich. Verstehe ich das jetzt richtig, dass etwa die "gepiercten" Wafer das Rohprodukt sind, welches man auch für die Anwendungen bei
LED und Label benötigt, sprich wenn das mit den Wafern
nicht funktioniert, dann kann man den LED- und Labelbereich
auch vergessen ?

>darauf warte ich dabei sollte man aber bedenken, dass >große Firmen zunächst einen kleinen Teil ihrer Produktion >umstellen werden und erst, wenn ihre Kunden mit den >Produkten zufrieden sind umfassender einsteigen... also >setze ich nicht auf einen Knall sondern eine schöne >Bergtour
O.K. auf gaaannz lange Sicht richtig. Beim ersten Kontrakt wird es den Knall geben, ganz sicher (nobrainer, tenbagger ;-).

>Trotz guter Ergebnisse lassen sich die grossen Firmen >nicht zu einer Umstellung bewegen (marketing Erfolg bleibt >aus). Dies ist der entscheidende Punkt. Viele Anleger >warten auf die offizielle Akzeptanz (große Verträge) und >zahlen dann lieber etwas mehr, als sich auf die bisherigen >Info`s zu verlassen
Das ist m.E. das geringste Risiko. Wenn die Anwendung funzt
und sich damit Geld sparen u. damit ein Wettbewerbsvorteil erringen läßt, wird in der heutigen Zeit kein Unternehmen
sich diese Möglichkeit nehmen lassen. Ich gehe sogar soweit zu behaupten, dass derjenige vom Markt veschwindet, wenn er seine Produktion nicht umstellt (immer vorausgesetzt die
Prognosen über die Kostenersparnis stimmen).

>Die Wirtschaftsprüfer wissen natürlich mehr als wir und >haften ja auch für ihre Aussagen. So was hab ich an der >OTC noch nie gesehen Und: die Tatsache, dass Nanopierce >bereits "agreements" hat (s.o. Jahresbericht)
FRagt sich nur, auf welchen Zeithorizont die Prüfer ihre
Prognose abgeben. Wenn es lediglich das Geschäftsjahr
2002 betrifft, ok, dat wußten wir eh schon.

>Ich glaube, die Dinge werden immer etwas länger dauern, >als wir uns es erhoffen. Über einige sehr optimistische >Aussagen, zeitlich verfehlte Ziele bzw. die HC >Finanzierung war ich nicht gerade glücklich
HC war aber leider zu dem Zeitpunkt überlebensnotwendig.
Heutzutage hätte es überhaupt kein Geld gegeben. Insofern
eigentlich ein glücklicher Umstand.

>Aus manchen "Gesprächen" (Boeing?)hat sich ja nun nach >einigen Jahren (na ja, zumindest vielen, vielen Monaten) >immer noch nichts für uns Sichtbares ergeben...
Ist doch aber eigentlich immer als entfernte Vision gehandelt worden oder ?

>Was mich stört, ist natürlich der niedrige Aktienkurs.
Andererseits, ohne nennenswerte Umsätze, wie soll das Unternehmen denn bewertet werden ?
>Viele Anleger die jetzt schon von Nanopierce wissen, >werden erst reingehen, wenn sie Schwarz auf Weiss sehen, >wieviele Einnahmen Nanopierce hat...
Dann wird es definitiv zu spät sein. Wenn die Sache funzt,
werden die Investoren innerhalb weniger Tage das Umsatz-
potential (Umsatzrendite dürfte wohl brutal gut sein) aus-
rechnen und peitschen die Aktie gnadenlos nach Norden. Alle warten auf die Korrektur, die nicht kommt und wenn sie korrigiert, sagen sich die Anleger, ist mir zu teuer, weil sie den Pennystock nicht aus der Birne bekommen. M.E. hier keine Chance für die Vorsichtigen. Auch wenn ich mir immer sage, ich kann dann ja noch ein paar nachlegen ;-), man wird es psychologisch nicht schaffen und ich weiß es immerhin bereits vorher ;-))

>Fondsmanager werden ebenfalls erst bei gesicherten >langfristigen Einnahmen einsteigen.
Für die wird das gleiche gelten, aber die könnten sich noch am ehesten ein paar NPCT günstig ins Depot manipulieren.


>Außerdem wer weiß denn momentan schon von Nanopierce? Im >Grunde doch Leute wie wir, die mehr oder weniger zufällig >davon gehört haben.
Täusch Dich nicht. Für einen OTC-Wert ohne (Geschäfts-)Umsätze ist der Bekanntheitsgrad enorm. Du wirst es bei dem ersten Kontrakt sehen. Achte auf die (Aktien-)Umsätze und an meine Worte. Wer dann in den USA short ist, kann mir dann gleich mal sein Haus für die Eindeckung übertragen ;-)


>Als Guru bin ich also eine völlige Fehlbesetzung.
Würde ich so nicht sagen. In jedem steckt ein Guru. Aber es gibt keinen Guru, der vor dem entscheidenden Ereignis, welches ihn zum Guru machte, auch schon Guru war ! Am
besten hilft hier die sportliche Betrachtung : Guru zu werden ist leicht, ein Guru zu bleiben ist der schwere Teil.
cu

PS: Na ja, Presswehen können es wohl noch nicht sein. Bist
Du mit dem Laptop in der Klinik für 1,00 DM die Minute ?
Hallo,
am RB bin ich als Finnegan23 bekannt.

Kleine Anmerkung zur obigen Konversation:

Es laufen zwar weitere (neue) Hitzetests, ein gewisser Prozentsatz des Materials wird weiterhin in den Testzyklus eingeschleust.

Der erste Hitzetestzyklus ist aber seit kurzem abgeschlossen. Weitere Testergebnisse sind laut Dr. Wernle für interne Erkenntnisse wichtig, aber für Verhandlungen mit Investoren/Kunden nicht mehr ausschlaggebend, weil die Technologie (jetzt nachgewiesen) funktioniert.

Tut mir leid, wenn auch das wieder nur gute Nachrichten sind *smile*

Schönes WE allerseits
H./F.
@tntrxrwelle,

"Andererseits fliegt hier eine Erfolgsmeldung (o.Bericht) nach der nächsten ein, welche quasi unreflektiert oder zumindest leicht rosarotbrillig (neue wortkreation) wiedergegeben wird. Ganz negativ ausgedrückt, das worst-case Szenario (Hitzetest nicht bestanden = Kohle weg) wird einfach ausgeblendet."

--- Das stimmt so nicht (wieso rosabrille :cool: ;) ). Hier werden eben die Fortschritte der Firma gepostet. Auf die Risiken wurde in diesem Thread (und den Vorgänger-Threads) bereits mehrmals eingegangen, insbesondere, wenn jemand danach fragt ;) . In diesem Bereich tut sich aber (Gott sei Dank) nichts neues. Man könnte jetzt an jedes zweite posting einen disclaimer hängen (Aktienkurs = 0 wenn die Technologie nicht funktioniert, sie sich nicht vermarkten läßt oder das Geld nicht reicht). Fänd ich aber nicht sehr spannend :yawn:
Ich gehe mal davon aus, dass jeder, der in Nanopierce investiert sichh zumindest die Zeit nimmt, den ganzen Thread zu lesen oder weit besser: die Quartals- und Jahresberichte (Leute es ist euer Geld). Da wird auf alle Risiken hingewiesen. Es ist ja auch jedem freigestellt, seine Bedenken hier zu posten (dann wird wenigstens diskutiert... :) .



"Ich hatte gedacht bei LED und Label werde zwar auch die Kontaktart von NPCT genutzt, aber in einem anderen Bereich."

--- So sehe ich das auch. Waferpierce ist eine Möglichkeit, NCS aufzutragen. Wenn Waferpierce nicht funktionieren würde, könnten die anderen Anwendungen trotzdem laufen (sonst bräuchte man wohl auch keine LED Patente etc).


"Verstehe ich das jetzt richtig, dass etwa die "gepiercten" Wafer das Rohprodukt sind, welches man auch für die Anwendungen bei LED und Label benötigt, sprich wenn das mit den Wafern nicht funktioniert, dann kann man den LED- und Labelbereich auch vergessen ?"

--- Nein, ich war mir nicht sicher, wie ich diesen Auszug aus der PR verstehen sollte:
"demonstration of a WaferPierce(TM) NCS wafer in the highspeed, advanced micro-assembly production system, marketed as ModulAS(TM), of its strategic partner Simotec® to manufacture chip module substrates for smart cards and other applications".
Jetzt denke ich aber, dass mit "WaferPierce(TM) NCS wafer" nicht die mit NCS behandelten wafer, sondern das Design des Wafers(praktisch: ein Wafer "ready for NCS application") gemeint ist. Hier wäre es sehr hilfreich, wenn sich mal jemand mit mehr technischen Sachverstand als ich es habe zu Wort melden würde...



"Beim ersten Kontrakt wird es den Knall geben, ganz sicher (nobrainer, tenbagger ;-)."

--- Ja, wenn wir davon in einer Pressemitteilung hören. Da bin ich mir nach Dr. Wernle`s Aussagen aber nicht ganz sicher. Er verwies auf NDAs (Stillschweige-Abkommen) und meinte es könnte sein, dass wir von den Verträgen praktisch nur über den Umweg der Quartalsberichte erfahren würden...



"Ich gehe sogar soweit zu behaupten, dass derjenige vom Markt veschwindet, wenn er seine Produktion nicht umstellt (immer vorausgesetzt die
Prognosen über die Kostenersparnis stimmen)."

--- Na na na, nicht in die Aktie verlieben ;)


Zu den Wirtschaftsprüfern. Bei anderen Aktien, deren finanzieller Fortbestand auf ein Jahr gesichert war, habe ich den Wegfall dieser Klausel nicht beobachten können, ich denke schon, das da mehr im Busch ist...
Zur HC Finanzierung: die hat mich persönlich finanziell ganz schön geschröpft und mein Vertrauen in die Firma eine Zeit lang doch geschmälert. Im Nachhinein betrachtet, hat dies trotz des Wertverlustes dazu verholfen, dass Nanopierce überhaupt weitermachen konnte... insofern gebe ich dir Recht...
Boeing ist wohl tatsächlich als "entfernte Vision" gehandelt worden, aber Orga, Gemplus etc schienen doch immer etwas näher zu sein, als sie tatsächlich waren (andererseits wissen wir nicht, was sich hinter den Kulissen tut).

Ich bin jetzt mal gespannt, ob sich am Aktienkurs nach der IMAPS (Vorträge/Produkt-Demo) was tut...



Hold NPCT and prosper

Jetsia

P.S.: Macht Spaß, wenn hier mal richtig diskutiert wird also nur weiter so...

P.P.S.: Nein, noch keine Presswehen, wart, wart, :yawn:
@ Jetsia, Hitman

Mmmhh, vielleicht hätte ich einen neuen Thread eröffnen
sollen. Jetzt verhunze ich den schönen Jetsia-Info-Thread.

Betr. Hitzetest:
O.K. nennen wir das ganze doch einfach mal Belastungs-
tests. Ich denke mal die Wafer werden künstlich gealtert und dies dürfte noch nicht abgeschlossen sein. Zumindest habe ich die derzeitige Nachrichtenlage so verstanden.

>Ich gehe mal davon aus, dass jeder, der in Nanopierce >investiert sichh zumindest die Zeit nimmt, den ganzen >Thread zu lesen oder weit besser: die Quartals- und >Jahresberichte (Leute es ist euer Geld).
Rationale Anleger in einer rationalen Börsenwelt <seufz>,
ein schöner Traum ;-), aber ich denke, das Problem ist
differenzierter zu betrachten: gerade weil man in Deu nicht
shorten kann, versammeln sich illiquiden Werten in Disku-Foren nur Bullen. Bären haben entweder keine Ahnung oder wenden nicht ihre Zeit auf, für einen Wert, den sie nicht
im Depot haben. Deshalb ist es m.E. umso erforderlicher, die Selbstdisziplin aufzubringen, sich von Zeit zu Zeit
die Hörner und Hufe abzusetzen und ein paar Krallen auszu-
fahren. Im Übrigen verändern sich die Risiken im Laufe der
Zeit, das ist ist stetig zu hinterfragen und zwar nicht nach dem Motto (Belastungstest (-)= Kohle weg), ach ja, kennen wir, ist ein alter Hut. Gerade das schwächste Glied in der Kette der Unwägbarkeiten (die Tests) kommt m.E. viel
zu kurz. Die Tetsts sind ja gerade condition sine qua non
(um mal den Juristen raushängen zu lassen) für all die schönen Planungen, Visionen und Fantasien.

>>"Verstehe ich das jetzt richtig, dass etwa die >>"gepiercten" Wafer das Rohprodukt sind, welches man auch >>für die Anwendungen bei LED und Label benötigt, sprich >>wenn das mit den Wafern nicht funktioniert, dann kann man >>den LED- und Labelbereich auch vergessen ?"
>"demonstration of a WaferPierce(TM) NCS wafer in the >highspeed, advanced micro-assembly production system, >marketed as ModulAS(TM), of its strategic partner Simotec® >to manufacture chip module substrates for smart cards and >other applications".
>Jetzt denke ich aber, dass mit "WaferPierce(TM) NCS wafer" >nicht die mit NCS behandelten wafer, sondern das Design >des Wafers(praktisch: ein Wafer "ready for NCS >application") gemeint ist.
Ja ich denke, dass Du das richtig verstehst. Da Simotec eine unabhängige Firma ist, werden die wohl kaum ein System
"ohne eigenen Markt" entwickeln, welches lediglich auf NPCT zugeschnitten ist. Diese Ansicht unterstützt die Behauptung von NPCT, Lizensgebühren seien beiderseits nicht zu ent- richten, es liege ein win-win-situation vor. Simotec solle
profitieren, weil sich ein gehörige Nachfrage nach den Kontakten von NPCT entwickeln könnte (demnach bräuchte man
u.s.das Modul) und NPCT könnte denen, die das Modul mit den
NPCT-Kontakten nutzen wollen, Lizensgebühren abknöpfen.

>Er verwies auf NDAs (Stillschweige-Abkommen) und meinte es >könnte sein, dass wir von den Verträgen praktisch nur über >den Umweg der Quartalsberichte erfahren würden...
Echt ärgerlich. Die Werte am neuen Markt mit angeblichen
Stillhalteabkommen sind Legion (Metabox, Senator...usw.).
Oft wird nur stillgehalten, weil noch nichts in trockenen
Tüchern ist. So ist dann auch die Kursentwicklung.

>Na na na, nicht in die Aktie verlieben.
Zu spät;-),aber ab und zu habe ich lichte Momente.

>Bei anderen Aktien, deren finanzieller Fortbestand auf ein >Jahr gesichert war, habe ich den Wegfall dieser Klausel >nicht beobachten können.
Ich auch nicht, habe aber ehrlich gesagt auch noch nie darauf geachtet, weil diese Sec-10k (oder wie sie auch alle
heissen mögen) immer alle Risiken aufführen müssen, denkt man immer bei jedem Wert, man sei in einer Pleitebude
investiert.

>Im Nachhinein betrachtet, hat dies trotz des Wertverlustes >dazu verholfen, dass Nanopierce überhaupt weitermachen >konnte.
Gegen HC läuft doch noch die Klage, mit der sich NPCT die
Kursverluste zurückholen möchte. Wenn nun nächstes Jahr die Rakete steigt, sehe ich irgendwie keinen Ansatzpunkt für einen Schadensersatz, zumal wohl von seiten des Unter- nehmens keine Aktien verkauft worden sind.

>Boeing...aber Orga, Gemplus etc schienen doch immer etwas >näher zu sein, als sie tatsächlich waren (andererseits >wissen wir nicht, was sich hinter den Kulissen tut).
Hä ? Was oder wer ist Orga und Gemplus ?

Ich bin jetzt mal gespannt, ob sich am Aktienkurs nach der IMAPS (Vorträge/Produkt-Demo) was tut...
For sure ;-)

>Hold NPCT and prosper
Ein long life wollte ich eigentlich auch noch haben;-)

cu

P.S.: Wollen hoffen, das Dein Kind mal Computer mit "nanogepiercten" Wafern benutzen wird ;-)
@all

Ach ja hatte ich noch vergessen :
Dr.Wernle hat letztens angemerkt, dass die Eröffnung einer
Niederlassung in Taiwan von der Anlegergemeinde total unterschätzt werde.
Also mich kann er damit nicht meinen. Wer geschäftlich irgendetwas mit Chips u.ä. machen will und in Asien nicht
present ist, braucht eigentlich gar nicht erst anzufangen.
Ich habe nur eine (vielleicht nicht stichhaltige) Befürchtung:
In Asien lassen die sich alles immer genau erklären, modeln ein wenig daran rum (oder auch nicht), bauen nach und scheren sich einen Dreck um irgendwelche Patente. Auf Erfolge einer diesbezüglichen Klage kann man dann bis in die
Steinzeit warten.
cu
Hi,

also, die Belastungstests SIND abgeschlossen (das ist eine NEUE Nachrichtenlage), ich habe es auf RB damals nur in verkürzter Form gepostet. Nochmal: Dr. Wernle sagt aber, dass weiterhin (auf immer *g*) ein Teil der Herstellung in die Schränke wandert, aber, klipp und klar, die erste Runde ist abgeschlossen. Auch die potentiellen Kunden sind mit ihren Tests wohl ziemlich durch, aber da verlasse ich mich jetzt auf Hörensagen.

Zum Nachbauen: Yup, Patentklagen in SO-Asien sind ein Heidenspaß. Problem, das die Jungs haben, ist aber wohl, dass der NCS-Prozess eine Blackbox ist, das Geheimnis liegt mehr oder weniger in der Zusammensetzung der Tauchbäder und einigen anderen Kleinigkeiten (*smile*), vom fertigen (gepiercten) Produkt kann man recht wenig ablesen.

Orga, Gemplus und Schlumberger sind einige der größten Smartcardhersteller der Welt. An Orga (ehem. Bundesdruckerei) ist der Bund erheblich beteiligt. Die leiden grade aber selbst erheblich unter Nachfragerückgang bei Smartcards.

Zu NCS/Waferpierce: 2 Namen, ein Prozess (oder, genauer: WP ist die letzte Entwicklungsstufe von NCS, nämlich mit elektrolytischem Tauchen). Ohne NCS keine LEDs, keine Inlays. Der scheinbare Widerspruch, dass WP noch immer getestet wurde und trotzdem LEDs angeblich schon so gut wie fertig für die Massenproduktion sind, lässt sich laut Dr. W. auflösen: Es geht bei WP jetzt im wesentlichen darum, den Workflow effizienter zu machen und sichere Herstellung von größeren Stückzahlen zu ermöglichen. Was man bereits jetzt produzieren kann, reicht aber für LED, etc. erst einmal aus.

Die Simotech-Maschine ist AUCH auf NCS konfigurierbar, aber auch "klassisch". Mit welcher Konfiguration die bisherigen Maschinen verkauft worden sind, ist offiziell nicht in Erfahrung zu bringen.

Gruß
H./F.
@hitman

Tausend Dank !

Man lernt eben nie aus, Schlumberger war für mich eigentlich immer ein Ölkonzern ;-)
Wollen hoffen, dass das System tatsächlich eine Blackbox
ist.

cu
@all
Werde ich also auch mal ein wenig informieren :

DENVER--(BUSINESS WIRE)--Oct. 8, 2001--NANOPIERCE TECHNOLOGIES, INC., (OTC:BB:NPCT) announced it will debut its break-through WaferPierce(TM) connection system to the electronics packaging industry at the 2001 International Microelectronics and Packaging Society (IMAPS) Exhibition and Conference in Baltimore, Maryland.

NanoPierce will feature WaferPierce(TM), the Company`s revolutionary wafer-level chip attach technology, at its first-ever industry exhibition, in booth number 1402. This exhibition will be especially significant because of the prestigious assemblage, consisting of industry leaders and experts who will be viewing for the first time outside of Europe practical, real-life demonstrations of WaferPierce(TM) in Smart Labels, LED arrays and other applications. The corporate visibility of NanoPierce and its industry altering WaferPierce(TM) will be at its highest level because of the influence of the viewing audience within their respective organizations.

The NanoPierce team consisting of 9 members will also participate in the annual IMAPS conference with the presentation of two technical papers, as technical session chairs, and through membership in the IMAPS National Technical Committee, which acts as a steering committee to the Society.

On Wednesday October 10, Bin Zou, a Development Engineer in NanoPierce`s Technology Group located in Colorado Springs, will present at the Lead-Free Solder session a paper entitled ``A New Electrical Surface Joining Technology for Flip Chip Assemblies.`` This paper is co-authored by Robert Bahn of the Technology Group. Dr. Herbert J. Neuhaus, Executive Vice President of Technology & Marketing, will chair the Lead-Free Solder session. Dr. Neuhaus will also chair the Materials session on Tuesday, October 9.

Dr. Michael E. Wernle, President and CEO of NanoPierce Card Technologies, GmbH, will present a paper entitled ``Electrical and Thermal Performance of a New Process for High Density LED Array Assemblies`` at the Photonics session on Thursday, October 11. This paper is co-authored by Michael Kober from NanoPierce Card. Dr. Wernle will also chair the Photonics Session.

Finally, Drs. Neuhaus and Wernle will attend the National Technical Committee meeting on Thursday, October 11. Dr. Neuhaus is the current chair of the Materials sub-committee. Dr. Wernle serves on the Flip-chip subcommittee.

Looking to the future, NanoPierce also plans to exhibit at SEMICON Europe 2002 in Munich, Germany on April 6-8, 2002; SEMICON West, in San Jose, California, USA on July 17-19, 2002; and IMAPS 2002, in Denver, Colorado, USA on September 4-6, 2002.

``I cannot tell you how proud I am of NanoPierce`s participation at this year`s IMAPS meeting,`` stated Dr. Herbert J. Neuhaus. ``I have been involved in IMAPS and its predecessors for many years now. It is gratifying to see NanoPierce come in with a strong show of force. We know what we can do. We are ready to share it with the industry.``

Die Insider wissen das alles wahrscheinlich schon.
cu
Kathy Oct-09-01, 00:44 AM (EST)
85. "NanoPierce`s Q & A at the Munich Open House. . ."

There was about a half hour Question and Answer Session at the Open House in Munich of September 20, 2001. I have finally finished transcribing it as follows:
Question and Answer Session:
After the Simotec Presentation was complete, Dr. Wernle stepped back up to the podium and gave a short closing speech and then initiated a Q & A with the audience.

We have seen quite a number of informational pieces on NanoPierce, our technology and what we have done during the past few months. You’ve also listened to more technical presentations. Of course, yo may now say “What do I need that for? I wanted to know something about NanoPierce.” But this is exactly what you got, information on NanoPierce. If you know what it takes for us to be successful and if you remember what NanoPierce is building. It is about cooperation partners and the network is important.

You have met representatives of two of the companies that are active in markets where we want to be active. Companies we need in order to bring our technology into the market.

You have seen a machine that is able to place the wafers on a substrate and you heard from Schreiner where, how and to which markets we can sell these products. What we are trying to say is that we can not be successful alone. Shareholders need to be interested in what we do, with whom, because without this network it won’t work out. Without it we don’t have a chance.

He then asked if there were any questions of a financial, technical or political nature.

Q. (The speaker was not using a microphone so Dr. Wernle restated the question for him.) What is the practical application and how apply able is all of that?

A. Well, it is quite easy, we have had our own test wafer for one or two months. Colorado Springs is a virtual account for contacts and we have already produced flip chip samples that are already being evaluated. So they need to undergo temperature cycles and spraying. We are almost through with the temperature cycles. We started in early August. We now have the confidence in the process so that we can present it to customers and say this is how it works, please provide your materials. We will now use your materials and you can test it for yourself. So basically we are in a test phase with active materials, the customer’s material. Colorado Springs will be ready this week or next week (clean room) then there will be tests for the next two months with customer samples in order to start the rollout early next year.

We now have all the tools in order to process customer material and with our own material which we have created and developed. We have completed this process.

Q. What about the coating process, is that done before the semiconductor process or after? Is that raw wafer or is that a finished wafer?

A. We get the wafer finished with all of the functionality and we don’t mind whether it is a smart card wafer or a wafer for light diodes, however you can get it from the different semiconductor manufacturers and, of course, one is to get it in any part from the die or housing or the whole wafer. We use the whole wafer which is submerged into the respective bath, after that it is separated, and then comes in the form that is, and can be, processed by machines like the Simotec machine.

Q. Is the wafer subjected to any temperature cycles through the processes?

A. Not really. It is just about room temperature.

Q. I would like to speak about finance. Is financing insured by bank loans or is there any venture capital investment in that area and which ones? And how does that look against the backdrop of the really difficult situation seen in the finance markets? Are these opportunities, have they all been exploited or is there the readiness to provide additional capital in the capital markets?

A. Let me start first of all, then as we speak about the financial markets maybe you would like to comment, Paul? We do have substantial financing so we do have enough money, cash in the bank, up until 2003. We do not have any bank loans and who would give a bank loan to a company like ours, because the banks don’t know what we are doing. Companies or the banks are looking for security, buildings, real estate, etc. And of course, we are a company that is fully financed up until 2003.

According to the progress that we have made during the past few months this is sufficient. In addition, there are really a number of people with financial backgrounds to stand by and backup this company. To, in the case where it should be necessary, provide more finance. This is exactly why we have mentioned particularly two of our investors at the beginning.

If we look at the stock prices and the quotations, of course, it is not such a positive development, but not too bad either.

Q. In German, no translation was available.

A. We do not have any venture capital, if that is your question. We are only financed by means of shares, stock, so it is equity financed.

Q. What about any venture capital enterprises or companies? Are there any plans for them to be integrated or support for you?

A. Paul Metzinger responded to this question - Given the current state of the market conditions as well as the price of our stock, we are not going to be doing any equity financing at these levels. We do not need to rely on that type of financing. Given sufficient increase in our share price we will always consider financing. We have developed an alternative financing concept that I am not free to disclose at the present time that will provide a substantial financing for individual segments of our company’s activities.

For instance the WaferPierce application only, smart label production only, smart cards only, LEDs only. We have made those contacts with major Wall Street firms as well as the resources of the two individuals sitting in front here.

In the sense of the traditional venture capitalists, we have no need for them. We are also keeping very open the possibility of industry partner financing. I think it is inevitable given the progress of our company that we will at some point, in the very near term future, meaning in the next two years, I think we will be approached by some of the largest global players in the world to make a direct investment in NanoPierce or its subsidiaries.

Q. What is your estimate, how likely is it that, as you say, this revolutionary technology offers the opportunity that large companies involved in similar sectors, be it Siemens or other US American firms, consider the opportunity as possible to take over your company with a fairly low market capitalization?

A. Dr. Wernle answered this - Very easy (to answer). There would have to be sufficient sellers for that and if the majority of the shares are held by companies that Paul Metzinger controls or lets say that are controlled by friends and family, then with the prospects for the company there will not be sufficient sellers.

So for that reason I can really not imagine that to be an option. Of course, there could be a price where even these groups are willing to sell, but that is very far away from where we are today. And it is at a level where I can not imagine that you would keep the stock, you would go for the profit, I believe, and that is exactly what things are about. So we shouldn’t be concerned if some time in the future somebody comes along and tries to do that. By the way the company does not only exist in terms of shares, there are also people, the staff, and this company lives off the “know how” we have and the “know how” we’ve developed and the patents. It is a combination, it is not one segment alone. It is the combination that makes this company really precious.

Q. Could you say that the current economic situation is positive for NanoPierce? Companies need to save so do you get more offers or else are other companies not willing to invest in such technology?

A. For the time being it doesn’t play a major role because the markets that we have addressed were addressed in a very conscious way. We try not to solicit to a broad base, we would prefer to get a foothold in very specific markets. In markets where we ourselves or one of our cooperation partners are familiar with the exact situation or the problems of this market. This is only if you know exactly that there is enough money available to invest in such a technology. So that means for us it doesn’t play any role whatsoever. So we have taken it to those markets that we believe it will be successful. We will only address the mass market later on. This hasn’t effected us at all. Of course, from time to time some contact people are not available in a company any longer because they have left, but as far as the commercialization is concerned it doesn’t really effect us.

But let me say a few words on the technology. I think we are talking about the contact with global players. As far as I know there are huge research departments at either Intel or IBM, or what have you, so do you think it is correct that they won’t say “okay, we’ve developed such technology on our own of course its got a different name, but the technology a such is the same.”

Well, to talk, only a few technologies come to my mind that have been developed by global companies. Usually these ideas are developed by small companies that are later on swallowed by the bigger ones. But the underlying idea usually is generated by small and flexible companies. There are one or two technologies developed by global companies such as you see a process developed by IBM. They were using it for quite some time but it is such a complicated process. It really was developed by IBM and in the market which we would like to operate, no one is really interested in this procedure and this process because it is too complicated indeed.

We haven’t felt the effects of that and we don’t feel it in the markets. We have been verifying reports and their service on that. We don’t think there is any significant development made by either a small or large company. Also for a specific segment, even in big global companies, there are only a few people who are responsible for that, who are really familiar with the business and these are experts. And the experts are those that matter. So usually we deal with small departments irrespective of whether it is a big or small company.

Q. In this contact, the patent situation needs to be discussed.

A. What do you mean by that? There is no relevant development in the markets that might negatively effect us.

Q. So after a period of two years you would really have to make sure that your patents are water tight.

A. The company has a longer history. The first few patents that we have date back to 1994-1995. We’ve still got them, I think 12 or 13 patents. So as far as patents are concerned we feel very comfortable. Of course, there are no guarantees given, but based on what has already been patented or else based on what has been filed for patenting during the last 15 months, we personally feel that we are on the safe side with fundamental patents that cover any kind of hard particle, coated with any metal applied to any surface, so if someone just deals with particles and would like to manufacture a contact material then this is part of our patent.

When reading this (original) patent I really couldn’t believe that we were successful in filing this patent. Again it dates back to 1987, before I was working with this company, so we are really on the safe side. During my presentation I think it was the first or second issue covered. We’ve got the technology, we are protected by the patents, we’ve got the market. Based on this setting things look really good.

Q. Is the actual process of adding the particles into the nickel/gold bumping process, the equipment that you use, is it really state of the art? Is it something very difficult to make? And what I finally want to come down to is how fast can you license your technology to actual nickel/gold bump suppliers? What is the time frame to introduce your technology or license to existing players to broaden the market of suppliers and bring the total price down of the WaferPierce?

A. The equipment that we have been using in order to apply the particles to the wafer is standardized equipment, it is wetbench. It’s a working bench with a big table of 3 meters size, it has certain apertures or openings for chemical containers for 5-7 liters. It can be rotated and stirred. It’s a pretty simple straight forward equipment. We obtained that second hand from a used device dealer. I think it cost about 40 to 50 thousand dollars. So it is standardized equipment that is used in the semiconductor business.

What is special about this thing is the combination of chemicals. Also there is just one tank or container in which the particles are applied. So this is the special thing about it. It is very special as you simply need to know how to do it. We’ve experimented with that, now we know how to do it, and once you see it, you wouldn’t believe that it can be so simple. But that’s the way it is. For reasons that you might understand we don’t want to go into any further detail about the design of this tank or container because it is really our “know how” that we have put all of our knowledge inside, but once you know the format of this container the costs are not relevant. So, again, it is a standardized equipment and that is no problem.

As far as the commercialization is concerned, let me iterate what I said earlier on. Of course, customers would first of all like to test and try out how their materials behave during the feeding process. Once they have agreed, then after a period of up to 3 months of testing until around Christmas, and after we’ve deployed a few of the WaferPierce, we expect to work on that (commercialization) and to produce this, but this is an investment of time which is negligable, then we are prepared to start production. Of course, customers need to be prepared as well, and customers might also have to pass it on to their own customers who also have to qualify this process.

If someone produces smart labels today and buys inlays from a different company then of course it is integrated in the project. Then it needs to go through a qualification process by the various customers. That is just a standard process in the industry. That is just the way it is. It’s just like building a house. We still need a roof. If it takes some time to build a roof, we still need the roof. It just takes time to build it. Of course, it is unquestionable that we will get this roof.

Q. Do you know what you will have to do to reach the point where you are sold broadly into the market?

A. This won’t be an issue. It won’t be a specific point in time as it is a kind of soft transition and I think you will see clear cut results in the next calendar year.

This was the last question. After that a break was called and then the company tour, demonstration of the Simotec machine, and a section of time was set aside to “Meet Your CEO” for face to face conversation in the refreshment tent.
Hallo NPCTler,

hier das letzte Interview mit Paul.

Paul was interviewed on CEOcast this morning. Sorry but a transcript is not
available, only by audio online.
http:\www.ceocast.com
then on the left type in NanoPierce and it will take you to
the interview.

Sincerely,

Sarah Roth
Kathy Oct-10-01, 11:55 AM (EST)
90. "A new letter to shareholders just received from Paul Metzinger. . ."

WaferPierce ™ the New Dimension In Connection Technology

To our Present and Prospective Shareholders of NanoPierce Technologies, Inc.,

I thought many of you would appreciate obtaining a better understanding of our WaferPierce ™ application and the benefits to be obtained from practicing the art described in our recently filed Patent Application “Electroless Process for the Preparation of Particle Enhanced Electric Contact Surfaces”. This subject matter was also described in the paper “A New Electrical Surface Joining Technology For Flip Chip Application”, which was presented by Mr. Bin Zou at the IMAPS conference in Baltimore.

Always keep in mind that the most important attribute of NCS ™ is: Simplicity is its strongest feature. With that in mind the WaferPierce ™ “electroless” process and application provides, among others, the following significant advantages over prior art, which we believe will provide NanoPierce Technologies, Inc., with a compelling and sustainable competitive position over other connection technologies.

First, only a low bonding force is needed during and after the chip or chip module is bonded to a substrate or antenna structure, since the sharp, pointed, hard particles can easily penetrate the conductive contact surface. This low residual stress on the chip or chip module compared to the high stress incurred in conventional chip attachment methods, such as conductive adhesive bonding, allows thinner chips or chip modules to be used to make smaller, more flexible, mobile RFID devices, such as smart cards and smart inlay devices.

Second, the cost of manufacturing smart cards and smart labels is significantly reduced by the elimination of manufacturing steps and the use of less expensive materials. Because high temperatures are not employed in connecting components – as in soldering or wire bonding – a simple, inexpensive substrate material can be employed, for example, polyvinyl chloride, polyethyleneterephthalat (PET/PETP”), glycol-modified PET (“PET-G”), acrylonitrile-butadiene-styrene copolymer (“ABS”), polystyrol (“PS”), polyproplyne (“PP”), cellulose or paper and blends, laminates or co-extruded combinations of these materials. These materials can also be printed easily. No special handling or curing steps are required.

Third, if the chip bond pads are particle-enhanced, it is possible for manufacturers to design products so that the placement of the chip is not very critical. In contrast, when conductive adhesives are employed, the printing of the adhesive on the chip must be very precise, because chips are small. With WaferPierce ™, simpler, less expensive manufacturing equipment can be used and operated at higher speeds. In addition, manufacturing of the card or label is simplified in that non-conductive adhesives can be applied rather indiscriminately without concern for the viability of the electrical connection between the components being bonded. The advantage is more significant for small components and pitch distance attachments. When compared to isotropic conductive adhesive, (an adhesive that conducts electricity equally in all directions as opposed to an anisotropic adhesive which conducts electricity in only one direction), the printing or dispensing of non-conductive adhesive is much simpler, as there is no danger of causing shorts by spreading excess adhesive. This also greatly increases manufacturing line speed and reduces the costs of the necessary manufacturing equipment. Non-conductive adhesives are also less expensive. In addition, the electrical and thermal performance of smart cards and smart inlays is improved while maintaining reliability.

Fourth, if the particle-enhanced contact is formed on the chip carrier substrate or antenna structure, the chip requires no treatment. It can be simply bonded to the chip carrier substrate or antenna structure by non-conductive adhesive.

Fifth, if the particle-enhanced contact is formed on the chip, hundreds or thousands of chips in a wafer can be plated in one treatment. After dicing the chips can be readily used by simply bonding with non-conductive adhesive. Further, if an electroless plating process is used to make the particle-enhanced surface on a chip or wafer, no masking is required for plating because the electroless process is selective (meaning the chemical composition is attracted to and only deposited on the contact surfaces of the chip pads).

Sixth, because the particle connections provide a very low resistance path between the chip and the antenna, and the non-conductive adhesives set rapidly, the electrical connection between components can be tested immediately. Thus, manufacturing defects can be detected promptly, avoiding excessive waste and manufacturing losses because of delayed detection inherent in present manufacturing processes.

Seventh, the process for forming electrical connections using WaferPierce ™ enables the use of different, less expensive antennae and coil materials. Current processes are not compatible, for example, with various forms of coil technology, such as aluminum coils, which oxidize rapidly (i.e., in a matter of minutes) and form a hard oxide layer, which precludes electrical connection. These materials cannot be used with the slow forming bonds of currently employed adhesives. In contrast, WaferPierce ™ penetrates the aluminum oxide or other insulatory films to form an electrical connection. Other materials that can be used to form antenna patterns capable of connection with a particle-enhanced contact include, for example, copper, aluminum, gold, and other metals, conductive inks, conductive pastes, metal foils and graphite.

Eighth, if the bond pads of chips are particle-enhanced, for example, by enhancing all the chips on a wafer before it is diced, the chips can be stored in inventory and used with any module or antenna, regardless of the composition of the contact surfaces opposing the chip. For example, in a smart inlay the chips could be used with any antenna sheet regardless of whether the antenna is formed of a conductive paste or ink, or whether the metal foil is aluminum, copper or any other metal.

As the reader can quickly realize, NCS ™ has the ability to radically change the landscape of connection technologies currently used by the micro-electronics industry.

In summation let me give credit to Mr. Bin Zou who largely authored the substance of this monograph by his description of the NCS/WaferPierce ™ process in the Patent Application. If there are any errors in this presentation they are attributable to me.

I have always believed an informed shareholder is a loyal and supportive shareholder.


Remember to always keep in mind what I said in my interview when describing NCS ™:

“A simple and elegant solution for
complex connection challenges.”

This corporate slogan will become a recognized standard in the micro-electronics industry.


Sincerely,

NANOPIERCE TECHNOLOGIES, INC.



Paul H. Metzinger
President and CEO
Transcript of Interview of Paul Metzinger by Michael Wachs of CEOcast 10/9/01

M - Paul, thanks for joining CEOcast today.

P - Thank you Michael.

M - These are exciting times for the company as you move ever closer to being able to generate revenues. Perhaps you could begin with a brief overview of the company and then we’ll get into the WaferPierce connection system and what opportunities are in the electronics packaging industry.

P - As we have stated in previous interviews, NanoPierce Technologies owns a patented connection system (NCS) that we believe is going to radically change connection technology for the entire microelectronics industry. We currently are debuting WaferPierce Technology at the IMAPS Conference which is the International Microelectronics and Packaging Society Conference in Baltimore.

It’s the first ever demonstration to the “Who’s Who” of the microelectronics world. And in particular Dr. Bin Zou is going to be describing in a paper he delivers there, our connection technology, which is an alternative to conventional flip chip and other methods of chip attachment such as wire bonding. I want to congratulate the NanoPierce team because they are putting on a real tour de force there about our technology and its immense applications at the wafer level.

M - Paul, let’s talk about this WaferPierce connection system. Why is this potentially so useful to the packaging industry?

P - It’s quite simple Michael, because you see when you apply NCS at the wafer level, what you in effect are doing is applying it to all of the contact pads on all of the chips on the wafer in a simple electroless process that is completed in less than 15 minutes.

Now that electroless process is very much a highly guarded trade secret of NanoPierce, but we have perfected it and it is now covered in certain respects by a very comprehensive patent application that we recently filed.

When you apply our connection technology at the wafer level you are enabling those chips all of which have our NCS on it to be used in the of multiple applications and myriads of products. Because, you have to understand, I don’t mean to belabor this, but I want to do it for your listeners. When you do it at the wafer level you are literally treating every chip on the wafer in one process. By doing that the person who uses the wafer can just inventory the chips for use in all kinds of applications and products. And by putting it on at the chip level you can increase density of application miniaturization, because it enables you to achieve a higher design with the ability to place that chip rapidly in one step using inexpensive adhesives. They are very cheap and so the attachment is made by using glue instead of flip chip technology or wire bonding. It’s an enormous application.

M - Paul, this is really the first time outside of Europe that you’re demonstrating practical applications for the WaferPierce. What are some of the other applications and who do you target first when you begin to go to commercial steps?

P - Well, one of the most important targeted areas that we are going to, when you take the chip that has NCS on it off the wafer, you can use it to manufacture products such as smart inlays, which is the antenna connected to a chip that is used in the manufacturing of smart labels. You can use them in the manufacturing of complex LED (light emitting diode) arrays. You can use them in the manufacturing of smart cards.

So, in other words, just imagine if you were in manufacturing and you needed to make smart cards, you could take wafer x that has this type of chip on it, take the chips off , make that product. You wanted to make product B, you take the wafer xyz. So the inventory possibilities, the fact, and this is something I want to stress, at the wafer level when you manufacture a product with a chip off that wafer, it is immediately testable, meaning you know you’ve got good chip electrical connections and therefore that leads to extreme high production output and that is a big characteristic and benefit of the technology. It also has no lead connected with it such as with soldering technology.

So, at the wafer level you can use it in the manufacturing of virtually any kind of electrical component.

M - Paul, if you look at other opportunities now with some of the technical breakthroughs that you’ve made, what are some of the areas that you are focusing on?

P - Like I indicated, we are focusing very heavily on smart inlays for the production of smart labels. It is also another important application as an alternative to flip chip, conventional flip chip technology. Now flip chip is one of the fastest growing markets in the world. It is projected to be growing at the rate of about 56% a year for the next 10 years. For instance one of the largest flip chip users in the world is Delphi-Delco. They take over 300,000 connection devices a day just to be used in the automotive industry. We have come up with a superior, competitive, cost effective flip chip technology and we are going to concentrate significant human and financial resources to the flip chip application, as well as in the manufacturing of smart inlays and LEDs.

M - Paul, I’m sure it is not coincidental that, as you move closer to commercialization, you opened an office in Taiwan. What’s the opportunity for the company in that market?

P - Well, it’s huge. We use that word often, but we truly mean it. I want to kind of give your listeners a perspective of why we opened that office. It was to exploit the rapidly expanding and very large markets in Asia for products using NCS. And that is smart cards, smart inlays for smart labels, light emitting diode arrays.

China recently announced that they intend to produce RFIDs, that’s radio frequency identification devices for its entire population. You’re talking billions of identification devices just simply for China alone. Most significantly, and what’s very important is, we want to be near, or at, the largest wafer fabrication facilities in the world. And Taiwan, as you know, has a lot of those type of fabrication facilities, as well as other Asian countries.

To give you some flavor, Michael, in the next five to ten years, four companies alone in Taiwan are going to build twenty wafer fabrication facilities, spending $50 billion and they will produce 7-7.5 million wafers annually. Those wafers are 12" wafers containing up to 30 thousand chips on them. That’s why we want to be in Taiwan. We intend to aggressively attempt to capture a significant portion of the existing and the projected wafer fabrication facilities in the world.

M - Paul, that’s a huge market opportunity for the company, and as you get ever closer to realizing that, what steps do you need to take on the infrastructure side to make this a reality?

P - We are going to complete our white room in Colorado Springs, which if everybody had a chance to go down there and look into it, would look like a miniature Intel white room. It is nearing production capability. We are aggressively pursuing our proposed plans for getting that up and running.

We have hired and are continuing to hire production personnel, managers of inventory control. We are gearing up for production and it’s going to be a very exciting time for us in the next several months, because it is now finally coming to a focused finality. Going after the markets we are, we are intent to implement our vision.

M - Paul, what about partners? What role will strategic partners play there and at what point do you bring them in?

P - Very good question, Michael. We are in discussions with multiple global players relating to the WaferPierce application in particular, with flip chip application industry leaders, with smart label manufacturers, they are important to us. The choice of these partners is going to be very critical. We have to make sure they are the right ones. We have to make sure that the business deals will not lock us out of large markets by giving too much exclusivity to any one of those.

We do fully anticipate that, because of the interest level, at some point we can anticipate that one or more of them will proffer investment capital to some type of a business relationship with NanoPierce. We are very pleased at the current state of our discussions with these global players.

M - Paul, what should investors now look forward to in coming quarters? If you had to draw a time line for them, what kind of events would they see and when would you like those to occur?

P - The next six months are going to be, as I have stated in other interview and in private conversations, the next six months are probably going to be the most significant six months in the history of NanoPierce.

There will be numerous major developments occur leading to production internally, to the finalization of agreements, we believe, with global players. We have investment interest developing in this company and its stock from institutions. It’s going to be, the next six months are going to be a precursor of the future of NanoPierce. We have very large visions. We at NanoPierce do not pursue small visions.

End of the Interview
Hallo, da bin ich wieder...

Am 08.10.2001 um 8.43 Uhr hat der kleine

Jan

gesund und munter das Licht der Welt erblickt :) :) :)

Hold NPCT and prosper
Hold little babies and be happy

Die stolze Mama
Jetsia
Hier ein Bericht von daytrader_50 von der IMAPS:

>>>>
I visited the Nanopierce booth at the IMAPS convention in Baltimore yesterday. The booth displayed a nice graphic presentation of our technology and a display case showing a 6 inch treated test wafer, smart cards and labels, smart inlays and modules and various high resolution photographs of NCS on chip pads amongst other things. It is awesome to actually see a wafer up close! At first glance, it appears to resemble a large cd with its polished surface but as one looks closer, a criss cross grid or matrix is evident showing the individual chips. The pads on the wafer chips are not visible to the naked eye yet the NCS test chip based on the philips I code chip(as I understand) has on its bonding pads what appears to be hundreds of particles, all at uniform height...quite amazing!
I met and spoke with Dr. Wernle, Dr. Neuhaus, Fred Blum and several other Nanopierce employees all of whom I found to be affable, knowledgeable and focused team players. I saw pictures of the white room showing the electroless plating equipment refered to as the wet bench. Fred has been instrumental in bring this project forth and has been
diligent with keeping costs down.

My visit to IMAPS shortly after the open house in Germany with its in depth coverage from Kathy, Finnegan and Kent Kloock in conjunction with the CEO cast interview and Mr. Metzingers recent shareholder letter leaves little for me to say EXCEPT, Yes, I had the strong sense that we are on the threshold of industry adoption.

Dr. Neuhaus mentioned that several large companies were by earlier that Nanopierce has been in discussion with. He said that they will have an exhibit at other such future conventions. The technical papers delivery went well.
It appeared to me that the attendance was low at the convention. Since, Sept. 11, convention trafffic has been way off in the DC area. Perhaps it was the last day and most of the visitors had been by the prior two days. There were however, at least 5 technical seminars underway in large rooms and they were well attended.

The convention floor was an awesome sight. A huge space covered with every conceivable piece of equipment and process the industry has to offer. This IS the place to be showcasing product!

It was personally rewarding to have attended and met our fine group of professionals!


>>>>>
Quelle:
http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

Hold NPCT and prosper


Jetsia
@jetsia dax

Glückwunsch und hoffentlich bleibt dir die Zeit für weitere tiefgründige recherchen bei NPCT

Als meist stiller leser kann ich deinen aufwand für nur bewundern.

Wunram
Hallo Jetsia,

herzlichen Glückwunsch :) und schön, daß du wieder da bist! Das ging ja richtig flott. ;) Alles Gute auch für den kleinen Jan!

Gruß Noemi

PS: Danke, daß du uns schon wieder mit den neuesten Infos versorgst, obwohl du sicher im Moment auch anderes zu tun hast.
Herzlichen Glückwunsch auch von mir Jetsia,

schön, daß Ihr beide offensichtlich die Geburt gut überstanden habt. Viel Spaß bei Eurem gemeinsamen Abenteuer.

Liebe Grüße, Jacqueline
Von mit natürlich auch die besten Glückwünsche zur Geburt !!!
cu
Hi Jetsia!

Auch von mir; Herzlichen Glückwunsch :):) und alles gute für den Nachwuchs ;)

Dirk.
Ich wünsche dir und deiner Frau alles gute.

Das sind doch eigentlich die wirklich glücklich machende Ereignise im Leben.

Ich hoffe er bringt euch viel Freude.
Oh sorry,
ich muß mich verbessern deiner Frau.

Habe eben von Agabimu einen auf den Deckel bekommen ob ich Macho denken würde das ausser ihr nur Männer an der Börse sind.

Ich hoffe du verzeihst mir diesen patzer.
Vielen Dank Euch allen für die lieben Wünsche (und Grafiken)

@katzennarr: Mein Mann hat`s auch überlebt ;)

Hold NPCT and prosper
Hold little babies and be happy :kiss:

Jetsia
@jetsia

zwar schon ein bischen zu spät, nichtsdestotrotz auch von mir alles, alles gute fuer dich, deinen neuen kurzen und deine familie.

Lasst es euch gut gehen und mögen die schlaflosen (bzw. schlafreduzierten) Nächte sich in Grenzen halten.

grüße vom flughafen
Diesen Artikel hat Kathy auf dem RB ausgegraben:

http://www.fabtech.org/site-global/news/2001/07/31.02.shtml

>>>>>>
NanoPierce Card Technologies GmbH announces production of the first test wafers with WaferPierce

NanoPierce Card Technologies GmbH has announced that initial samples of the new WaferPierce process have been successfully produced.
Development of a test wafer in compliance with NanoPierce specifications commenced in April of this year, when the company began working with the Fraunhofer Institute for Silicon Technology (ISIT), a preeminent research and development facility for silicon and wafer technology located in Itzehoe, Germany. These wafers are now available in pre-production quantities. The chips on the wafer have contact pads that are compatible to the I-code chip produced by Philips Semiconductor, a widely used chip in radio frequency identification (RFID) applications. For the first time, NanoPierce has at its disposal wafer-based test material made to its own specifications.

"This development represents a significant advantage for us and an important step forward for NanoPierce," stated Dr. Herbert J. Neuhaus, Executive Vice President of Technology of NanoPierce Technologies, Inc. "Previously we only had access to commercially available test material. The test wafers which are now available to us have chips whose size and properties closely approximate the components used in our highest priority applications, such as smart card chip modules and smart labels."

During the past two weeks, the first contacts were applied to these wafers by means of the patent-pending WaferPierce technology developed by NanoPierce in the company`s laboratory in Colorado Springs, Colorado.

"We are producing initial samples on a small scale in our in-house lab. However, our own cleanroom, including a wetbench specifically designed to accommodate the WaferPierce process, will be completed within the next nine weeks," said Dr. Neuhaus.

"These new test wafers finally enable us to provide a select group of customers with sufficient test material," stated Dr. Michael E. Wernle, President & CEO of NanoPierce Card Technologies. "We are currently producing initial samples for a range of various applications. Due to this important breakthrough, we can now demonstrate WaferPierce to our customers in functional applications, and we can move on to the next level of the design-in process. This development confirms that the technical market introduction of WaferPierce is proceeding systematically according to both our development and our marketing plans."

For more information, try http://www.nanopierce.com

>>>>>>>

Hold NPCT and prosper

P.S.: Vielen Dank zentralflughafen
Ausgegraben von Taekwondo (RB Board) Artikel zur IMAPS:


You Say You Want a Revolution
News Analysis
A "revolutionary" interconnection technology from NanoPierce Technologies has been demonstrated on a high-speed production system for smart card manufacturing. NanoPierce`s approach consists of embedding small hard particles on a contact pad and plating over it with nickel. These hard, conductive protrusions are then used to make a contact between pads on a chip and pads on a substrate. There is no wafer bumping or wire bonding kind of process to create the connection. This should qualify it as truly revolutionary. Now, with a demonstration in a legitimate high-volume application for a low-cost end product, the approach is making progress toward being successful as well as revolutionary. The demonstration was done with a production system from Simotec at an event in Munich last week.

The primary challenges for any radical new technology are educating the potential users about what it provides, and creating the required infrastructure in the industry to make it feasible. How have other genuinely revolutionary products fared? One in the packaging world that made a splash and has had some success is the MicroSpring contact approach from FormFactor. Using cleverly engineered wire bonds, spring-like contacts are created on each bond pad at the wafer level. So far, this has actually found success in probe cards, rather than a wafer-level packaging technology. This example shows the benefits of working on revolutionary things -- the ultimate breakthrough that it allows might not be what you expect.

My favorite revolutionary technology in the semiconductor industry comes from Ball Semiconductor. Their approach -- and they`ve been at it for five years, which says something -- is to create semiconductor devices on silicon spheres. The main benefit is that the processing can be done in closed tubes, rather than gigantic clean rooms. They have many patents and have developed design and process approaches, but this is probably a case where it is just too big a leap away from the standard technology to make it in the mainstream. I hope that it finds its niches, though. Think what we can learn by envisioning IC manufacturing in something other than a wafer format.

One of the biggest revolutionary developments recently has been plastic semiconductor devices. FlexICs just announced that they will begin shipping samples of semiconductors made on plastic wafers. They use "trailing-edge" (i.e., old) fab equipment to make transistors in polysilicon on six-inch plastic substrates. The key capability is that the processes are done below 100°C, which allows the use of plastic substrates. If these products are successful, they will open up many new applications for lightweight, low-cost electronics. Because this approach isn`t so revolutionary that it abandons the wafer format, it might just make it.
-Jeffrey C. Demmin, Editor-in-Chief
(September 28)



Hold NPCT and prosper

Jetsia
Monday October 22, 3:04 am Eastern Time
Press Release
SOURCE: NanoPierce Technologies, Inc.
The Institute for Machine Tools and Industrial Management of the Technische Universitat Munchen to Present the NanoPierce Connection System During Productronica 2001
MUNICH, Germany--(BUSINESS WIRE)--Oct. 22, 2001--NanoPierce Card Technologies GmbH, a subsidiary of NanoPierce Technologies, Inc. (OTCBB:NPCT - news; Frankfurt and Hamburg OTC:NPI), announced today that the Institute for Machine Tools and Industrial Management (iwb) of the Technische Universitat Munchen will be presenting the NanoPierce Connection System (NCS(TM)), a proprietary process developed by NanoPierce, to a global audience during the Productronica 2001 in Munich.

With 1400 exhibitors from 32 countries, Productronica is considered the leading trade fair worldwide for electronics production equipment. The fair will be held from November 6-9, 2001, at the Munich Trade Fair Center. At its booth, the iwb will be exhibiting, among others, a highly flexible mounting and handling system for bottom structured components out of the microsystemtechnology. The NanoPierce Connection System, also known as NCS, which was developed and patented by NanoPierce Technologies, Inc., will be implemented as part of this demonstration.

``We are particularly pleased to see NCS being used in conjunction with such an advanced assembly system for semiconductors,`` commented Dr. Michael E. Wernle, President and Chief Executive Officer of NanoPierce Card Technologies GmbH. ``When we were approached and asked to provide suitable material for the show, we naturally agreed to do so immediately.``

Dipl.-Ing Dirk Jacob, who heads the ``Microassembly`` field of research stated: ``In NCS we have found an extremely exciting and, what is perhaps even more important, flexible process for creating electrically conducting connections in micro assembly. We are particularly impressed by the ease with which NCS can be put into use. We are looking forward to its practical application with great expectations.``

The iwb of the Technische Universitat Munchen has been under the direction of Professor Dr. Gunter Reinhart since 1993. With over 100 employees, 60 of whom are scientists, the iwb is one of the foremost institutes worldwide for automation technology, with a particular emphasis on micro assembly technology. In addition to the mounting system that will be exhibited at the Productronica 2001, the Institute is involved in developing automated non-contact handling and transport systems for semiconductor wafers. As part of the Institute`s push to intensify its activities in these areas, a 120 m(2), Class 1000 clean room was recently put into operation at its facility in Garching, near Munich. Along with pursuing its commitment to higher education, the Institute is intensively engaged in research and development projects supporting the areas of automotive industry, machine tools, electronic manufacturing and the aviation / space industry.

NANOPIERCE CARD TECHNOLOGIES GmbH is a 100% subsidiary of NanoPierce Technologies, Inc., of Denver, Colorado, USA, which is traded on the Nasdaq stock market (OTCBB:NPCT - news) as well as in Frankfurt and Hamburg (OTC:NPI - news). In addition to the twelve patents it owns, NanoPierce has numerous applications pending, others in preparation, and various other intellectual properties related to NanoPierce`s proprietary NCS (NanoPierce Connection System). This advanced system is designed to provide significant improvement over conventional electrical and mechanical interconnection methods for high-density circuit boards, components, sockets, connectors, semiconductor packaging and electronic systems. To learn more about NanoPierce Technologies, Inc., log on to the company`s website at http://www.nanopierce.com.

This announcement contains forward-looking statements about NanoPierce Technologies, Inc., and its subsidiaries, that may involve risks and uncertainties. Important factors relating to the Company`s operations could cause actual results to differ materially from those in forward-looking statements and are further detailed in filings with the Securities and Exchange Commission (SEC) available at the SEC`s website (http://www.sec.gov). All forward-looking statements are based on information available to NanoPierce Technologies, Inc., on the date hereof, and NanoPierce Technologies, Inc., assumes no obligation to update such statements.


--------------------------------------------------------------------------------
Contact:

NANOPIERCE TECHNOLOGIES, INC.
Paul. H. METZINGER
President & CEO
370 17th Street No. 3640
Denver, CO 80202, USA
Phone: + 1-303-592-1010
Fax: + 1-303-592-1054
Email: paul@nanopierce.com
or
iwb - Technische Universitat Munchen
INSTITUTE FOR MACHINE TOOLS AND INDUSTRIAL MANAGEMENT
Dipl.-Ing. Dirk Jacob
Boltzmannstrasse 15
D-85747 Garching, GERMANY
Phone: +49-89-289-15496
Fax: +49-89-289-15555
www.iwb.tum.de
Email: dirk.jacob@iwb.tum.de
or
NANOPIERCE CARD TECHNOLOGIES GmbH
Dr. Michael E. WERNLE
President & CEO
Lise - Meitner - Strasse 1
D - 85662 Hohenbrunn (Munich),
GERMANY
Phone: + 49-8102-8961-0
Fax: + 49-8102-8961-11
Email: michael@nanopierce.com
or
INVESTOR RELATIONS
STOCK ENTERPRISES, INC.
James R. STOCK
Phone: + 1-702-614-0003
Email: stockenter@aol.com

>>>>>>

Hold NPCT and prosper

Jetsia
Kathy hat Dr. Neuhaus eine mail mit Fragen zum wafer level packaging Verfahren einer Japanischen Firma:

http://ragingbull.lycos.com/mboard/boards.cgi?board=NPCT&rea…

From Kathy:

I sent an email to Dr. Neuhaus and Dr. Wernle asking what they could tell me about the new wafer level packaging that was announced by a Japanese company recently and I have received a response from Dr. Neuhaus:

Subj: RE: New wafer level packaging technology
Date: 10/22/01 10:35:39 AM Eastern Daylight Time
From: herb@nanopierce.com (Dr. Herbert J. Neuhaus)
Reply-to: herb@nanopierce.com
To: KKnightmcc@aol.com
CC: michael@nanopierce.com (Michael E Wernle)

Hi Kathy:

There are literally thousands of variations of flip-chip packaging in
existence. Don`t let the alphabet soup confuse you. The site you sent refers
to a type of flip chip where the underfill is applied to the wafer. This
usually called (as it is here) wafer level packaging. Other than that it
pretty much standard flip chip.

Remember that we do not compete with flip chip but instead depend on the
broad acceptance of flip chip by the industry. We offer a type of flip chip
that is extremely simple and low cost. Ours is, therefore, particularly
attractive to low-cost, consumable electronic applications such as Smart
Labels and many, many others.

You are correct: the type of flip chip you ask about requires a lot more
processing steps. A Smart label application could never afford it.

The key our market advantage is to match up the unmet needs (technical,
cost, reliability, etc) of large, rapidly growing market segments with the
cost & performance of our technology. NanoPierce has no interest in
criticizing other packaging technologies. You never know who we may partner
with in the future.

Best regards,
Herb Neuhaus

-----Original Message-----
From: KKnightmcc@aol.com
Sent: Friday, October 19, 2001 11:57 AM
To: michael@nanopierce.com; herb@nanopierce.com
Subject: New wafer level packaging technology


Hi Herb and Dr. Wernle,

I was wondering if you could take a look at this new Japanese wafer level
processing and give me some type of comparison from your point of view. I
looked at it and is appears to have more steps in processing:

http://www.iep.co.jp/english/tech/index.html

Thank you for your anticipated response,

Kathy

>>>>>>>>

Hold NPCT and prosper

Jetsia
katzennarr hat es ja oben auch schon gepostet, der Vollständigkeit wegen poste ich hier noch mal den link:

Eine Info von Kathy bzgl. des Clean Rooms:

http://www.investortoinvestor.com/dcforum/cgi-bin/dcboard.cg…

Hold NPCT and prosper

Jetsia