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Beitrag zu dieser Diskussion schreiben
Das ist es, was Rambus zur Zeit braucht: neue Lizenzabkommen rund um das ganze Spektrum. Über RaSer wurde in letzter Zeit kaum gesprochen. Besonders gut an der Meldung gefällt mir diese Passage:
We look forward to exploring future opportunities with Rambus."
We look forward to exploring future opportunities with Rambus."
Rambus Antitrust Case Moves Forward
Monday February 14, 8:31 am ET
Rambus Wins Venue Dispute, Ending Delay
Discovery to Proceed of Documents Surrounding Recent Guilty Pleas in Felony Price-Fixing Case
LOS ALTOS, Calif.--(BUSINESS WIRE)--Feb. 14, 2005--Rambus Inc. (Nasdaq:RMBS - News), a leading developer of chip interface products and services, today announced that it has won a dispute over where its antitrust case against certain semiconductor companies should be litigated. Rambus won a venue dispute at the trial court level and last week a California appellate court declined to overturn that decision. Absent a successful further appeal to the California Supreme Court, the case will continue to be litigated in California Superior Court in the City and County of San Francisco, which is where Rambus had filed the complaint nine months ago.
"We are very pleased to have this delay behind us, and now expect this case to move forward aggressively," said John Danforth, senior vice president and general counsel at Rambus. "Our first aim is to get access to what we understand to be the price-fixing documents that have already been gathered in related civil and criminal cases by a number of parties. We believe that those documents likely contributed to the near record fines, guilty pleas and jail sentences already reported by the U.S. Department of Justice in a related, still-pending criminal investigation."
Defendants, who include the semiconductor companies Hynix Semiconductor (000660.KS), Infineon Technologies (NYSE:IFX - News), Micron Technology (NYSE:MU - News), Siemens AG (NYSE:SI - News), have vigorously opposed venue in San Francisco, delaying the Rambus antitrust case for several months and seeking pre-trial appellate review of the trial court decision to keep the case in San Francisco.
Rambus filed its anti-trust suit in San Francisco in May 2004 charging that the defendants engaged in a concerted and unlawful multi-year effort to eliminate competition and stifle innovation in the market for computer memory technology and computer memory chips. Subsequent to Rambus filing suit, in October 2004, Infineon pled guilty to criminal price fixing, agreeing to pay a $160 million fine to the U.S. Department of Justice and admitting to conspiring with other DRAM companies from 1999 to 2002 to fix DRAM prices and eliminate competition. Four Infineon employees also pled guilty in December, 2004, agreeing to pay fines and serve person sentences. Among other things, the Rambus suit filed in San Francisco alleges that defendants, including Infineon, collectively rigged DRAM prices and costs to drive Rambus`s RDRAM product from the market. The 36-page Rambus complaint relies in substantial part on evidence obtained through a 2003 Federal Trade Commission proceeding and asserts four causes of action, including conspiracy to restrict output and fix prices in violation of the Cartwright Act; conspiracy to monopolize in violation of the Cartwright Act; intentional interference with prospective economic advantage; and unfair competition in violation of California Business and Professions Code Section 17200.
Additional information about the complaint can be found on Rambus`s website at www.rambus.com/inv/ (under Litigation Update section).
Monday February 14, 8:31 am ET
Rambus Wins Venue Dispute, Ending Delay
Discovery to Proceed of Documents Surrounding Recent Guilty Pleas in Felony Price-Fixing Case
LOS ALTOS, Calif.--(BUSINESS WIRE)--Feb. 14, 2005--Rambus Inc. (Nasdaq:RMBS - News), a leading developer of chip interface products and services, today announced that it has won a dispute over where its antitrust case against certain semiconductor companies should be litigated. Rambus won a venue dispute at the trial court level and last week a California appellate court declined to overturn that decision. Absent a successful further appeal to the California Supreme Court, the case will continue to be litigated in California Superior Court in the City and County of San Francisco, which is where Rambus had filed the complaint nine months ago.
"We are very pleased to have this delay behind us, and now expect this case to move forward aggressively," said John Danforth, senior vice president and general counsel at Rambus. "Our first aim is to get access to what we understand to be the price-fixing documents that have already been gathered in related civil and criminal cases by a number of parties. We believe that those documents likely contributed to the near record fines, guilty pleas and jail sentences already reported by the U.S. Department of Justice in a related, still-pending criminal investigation."
Defendants, who include the semiconductor companies Hynix Semiconductor (000660.KS), Infineon Technologies (NYSE:IFX - News), Micron Technology (NYSE:MU - News), Siemens AG (NYSE:SI - News), have vigorously opposed venue in San Francisco, delaying the Rambus antitrust case for several months and seeking pre-trial appellate review of the trial court decision to keep the case in San Francisco.
Rambus filed its anti-trust suit in San Francisco in May 2004 charging that the defendants engaged in a concerted and unlawful multi-year effort to eliminate competition and stifle innovation in the market for computer memory technology and computer memory chips. Subsequent to Rambus filing suit, in October 2004, Infineon pled guilty to criminal price fixing, agreeing to pay a $160 million fine to the U.S. Department of Justice and admitting to conspiring with other DRAM companies from 1999 to 2002 to fix DRAM prices and eliminate competition. Four Infineon employees also pled guilty in December, 2004, agreeing to pay fines and serve person sentences. Among other things, the Rambus suit filed in San Francisco alleges that defendants, including Infineon, collectively rigged DRAM prices and costs to drive Rambus`s RDRAM product from the market. The 36-page Rambus complaint relies in substantial part on evidence obtained through a 2003 Federal Trade Commission proceeding and asserts four causes of action, including conspiracy to restrict output and fix prices in violation of the Cartwright Act; conspiracy to monopolize in violation of the Cartwright Act; intentional interference with prospective economic advantage; and unfair competition in violation of California Business and Professions Code Section 17200.
Additional information about the complaint can be found on Rambus`s website at www.rambus.com/inv/ (under Litigation Update section).
Rambus and NEC Electronics Sign Agreement for High-Speed Backplane Serial Link Interface Technology
Monday February 14, 8:02 am ET
LOS ALTOS, Calif. & KAWASAKI, Japan--(BUSINESS WIRE)--Feb. 14, 2005--
RaSer(TM) X Enables up to 8 Gbps Interconnect Speed
for High-Volume Enterprise Applications
Rambus Inc. (Nasdaq:RMBS - News), a leading developer of chip interface products and services, and NEC Electronics Corporation (TOKYO:6723 - News), a leader in application-specific integrated circuits, today announced that NEC Electronics has licensed the RaSer(TM) X backplane serial link interface for high-performance ASIC applications.
ADVERTISEMENT
The Rambus RaSer X interface solution is designed to tackle the toughest interconnect problems associated with backplane environments in high-speed enterprise switches and routers, storage area network switches and blade servers. The addition of RaSer X to NEC Electronics` own lineup of serial interface solutions will allow customers an even greater selection of high performance, low risk solutions. The first serial link cell licensed to NEC Electronics will operate at 6.25 Gbps.
"Our customers need the flexibility to tackle a variety of protocols, applications and frequency ranges," said Tetsuo Yoshino, vice president of the 1st Systems Operations Unit at NEC Electronics Corporation. "Rambus`s serial link technology complements our existing offerings by bringing added value to our customers with flexible solutions that enable faster time-to-market. We look forward to exploring future opportunities with Rambus."
"As system capacity requirements continue to increase, enterprise users need to extend the lifecycle of existing equipment investments," said Kevin Donnelly, vice president of the Logic Interface Division at Rambus. "Our proven RaSer X technology and the extensive internal expertise of NEC Electronics will help bring compelling solutions to the market that offer new levels of flexibility and scalability as well as the ability to bring these solutions to the market quickly and within budget."
Rambus`s RaSer X serial link technology enables up to four times the bandwidth of existing solutions and incorporates proven signaling technology to enable high performance over various backplane materials, connectors and trace lengths. The RaSer X solution incorporates a multi-tap transmitter and receiver equalizer, low-jitter transmitter, high-sensitivity receiver and calibrated on-chip termination resistors, as well as the Auto-Adapt(TM) feature that continuously adjusts multiple coefficients of both the transmit Feed Forward Equalizer (FFE) and the receive Decision Feedback Equalizer (DFE) to compensate for humidity and temperature variances.
The Rambus RaSer serial link interface family includes 0.18-micron, 0.13-micron, 90 nanometer and 65 nanometer versions on multiple foundry processes. In addition, Rambus offers its customers engineering services for chip integration, package, board and system characterization and test in order to ensure success in the development of high-speed backplanes. Additional information about the various Rambus RaSer serial link solutions can be found at www.rambus.com/raser.
About Rambus Inc.
Rambus is one of the world`s leading providers of advanced chip interface products and services. Since its founding in 1990, the company`s innovations, breakthrough technologies and integration expertise have helped industry-leading chip and system companies solve their most challenging and complex I/O problems and bring their products to market. Rambus`s interface solutions can be found in numerous computing, consumer, and communications products and applications. Rambus is headquartered in Los Altos, Calif., with regional offices in Chapel Hill, North Carolina, Taipei, Taiwan, and Tokyo, Japan. Additional information is available at www.rambus.com.
About NEC Electronics
NEC Electronics Corporation (TOKYO:6723 - News) specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets, system solutions for the mobile handsets, PC peripherals, automotive and digital consumer markets, and platform solutions for a wide range of customer applications. NEC Electronics Corporation has 26 subsidiaries worldwide including NEC Electronics America, Inc. and NEC Electronics (Europe) GmbH. Additional information about NEC Electronics worldwide can be found at www.necel.com.
Monday February 14, 8:02 am ET
LOS ALTOS, Calif. & KAWASAKI, Japan--(BUSINESS WIRE)--Feb. 14, 2005--
RaSer(TM) X Enables up to 8 Gbps Interconnect Speed
for High-Volume Enterprise Applications
Rambus Inc. (Nasdaq:RMBS - News), a leading developer of chip interface products and services, and NEC Electronics Corporation (TOKYO:6723 - News), a leader in application-specific integrated circuits, today announced that NEC Electronics has licensed the RaSer(TM) X backplane serial link interface for high-performance ASIC applications.
ADVERTISEMENT
The Rambus RaSer X interface solution is designed to tackle the toughest interconnect problems associated with backplane environments in high-speed enterprise switches and routers, storage area network switches and blade servers. The addition of RaSer X to NEC Electronics` own lineup of serial interface solutions will allow customers an even greater selection of high performance, low risk solutions. The first serial link cell licensed to NEC Electronics will operate at 6.25 Gbps.
"Our customers need the flexibility to tackle a variety of protocols, applications and frequency ranges," said Tetsuo Yoshino, vice president of the 1st Systems Operations Unit at NEC Electronics Corporation. "Rambus`s serial link technology complements our existing offerings by bringing added value to our customers with flexible solutions that enable faster time-to-market. We look forward to exploring future opportunities with Rambus."
"As system capacity requirements continue to increase, enterprise users need to extend the lifecycle of existing equipment investments," said Kevin Donnelly, vice president of the Logic Interface Division at Rambus. "Our proven RaSer X technology and the extensive internal expertise of NEC Electronics will help bring compelling solutions to the market that offer new levels of flexibility and scalability as well as the ability to bring these solutions to the market quickly and within budget."
Rambus`s RaSer X serial link technology enables up to four times the bandwidth of existing solutions and incorporates proven signaling technology to enable high performance over various backplane materials, connectors and trace lengths. The RaSer X solution incorporates a multi-tap transmitter and receiver equalizer, low-jitter transmitter, high-sensitivity receiver and calibrated on-chip termination resistors, as well as the Auto-Adapt(TM) feature that continuously adjusts multiple coefficients of both the transmit Feed Forward Equalizer (FFE) and the receive Decision Feedback Equalizer (DFE) to compensate for humidity and temperature variances.
The Rambus RaSer serial link interface family includes 0.18-micron, 0.13-micron, 90 nanometer and 65 nanometer versions on multiple foundry processes. In addition, Rambus offers its customers engineering services for chip integration, package, board and system characterization and test in order to ensure success in the development of high-speed backplanes. Additional information about the various Rambus RaSer serial link solutions can be found at www.rambus.com/raser.
About Rambus Inc.
Rambus is one of the world`s leading providers of advanced chip interface products and services. Since its founding in 1990, the company`s innovations, breakthrough technologies and integration expertise have helped industry-leading chip and system companies solve their most challenging and complex I/O problems and bring their products to market. Rambus`s interface solutions can be found in numerous computing, consumer, and communications products and applications. Rambus is headquartered in Los Altos, Calif., with regional offices in Chapel Hill, North Carolina, Taipei, Taiwan, and Tokyo, Japan. Additional information is available at www.rambus.com.
About NEC Electronics
NEC Electronics Corporation (TOKYO:6723 - News) specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets, system solutions for the mobile handsets, PC peripherals, automotive and digital consumer markets, and platform solutions for a wide range of customer applications. NEC Electronics Corporation has 26 subsidiaries worldwide including NEC Electronics America, Inc. and NEC Electronics (Europe) GmbH. Additional information about NEC Electronics worldwide can be found at www.necel.com.
http://www.theinquirer.net/?article=21201
Samsung memory stirs up hornet`s nest
But there is an alternative
By Wil Harris: Freitag 11 Februar 2005, 07:31
WHEN WE wrote about Samsung`s TCCD memory chip production this week, we stirred up something of a hornet`s nest.
We were lauded, ridiculed, praised and insulted for our exclusive news. We`ve had a chance to do more investigation now, and we`re still finding massive inconsistencies in the data being presented to us.
First off, an article over at Legit Reviews claims to be the be all and end all of this matter. The Legit guys talked to a bunch of companies and got official comments from them all, and claim these comments prove the INQ wrong. They don`t. The comments are merely the public faces of a bunch of RAM companies who are suddenly facing big changes in their stock. At least two of the companies that `Legit` interviewed that told them that there was no problem, told the INQ a completely different story, off the record and on the phone. Moral of the story? As Jeremy Paxman once said, when talking to people on the record, always think: "Why are these lying bastards lying to me?"
One thing that is clear is that Corsair still has stock. The Fremont guys have just signed a six month agreement to get hold of the chips from Samsung, and we suspect that it will be the only company able to get any. The channel is already emptied of TCCDs, there are no places for anybody who isn`t Corsair to buy them. This is good news for Corsair, which, we think, are going to have the monopoly on the parts.
Now, there are some alternatives for the memory companies. There are new Winbond modules being produced, and there are Micron modules that are almost as good. But they ain`t TCCD.
We spoke to Samsung. It told us officially that it was continuing production of DDR to support AMD systems. However, it flat-out refused to say specifically, and officially, whether that production was scaling down, but our conversations with the firm suggests to us that it is. Samsung is aggressively ramping up productions of DDR2 memory using new Fully-Buffered parts, as well as PlayStation 3 XDR memory . Samsung is heavily pushing the latter, and is even making plans to set aside more capacity in the event that a PC desktop chipset starts to support it. The technologies are competing with each other for time in the fabs, and enthusiast-grade modules are such small sellers, they`re the first to lose capacity.
So, there you have it. Only the coming days will confirm our story, but expect to see something of a switcheroo in most product lines. That is, of course, unless the memory chaps manage to kick up such a fuss at Samsung that it can convince the firm to make a u-turn. But with the inflection point for DDR2 approaching, where manufacturing capacity make price and performance a more attractive proposition than DDR1, we would be surprised to see that happening. µ
Samsung memory stirs up hornet`s nest
But there is an alternative
By Wil Harris: Freitag 11 Februar 2005, 07:31
WHEN WE wrote about Samsung`s TCCD memory chip production this week, we stirred up something of a hornet`s nest.
We were lauded, ridiculed, praised and insulted for our exclusive news. We`ve had a chance to do more investigation now, and we`re still finding massive inconsistencies in the data being presented to us.
First off, an article over at Legit Reviews claims to be the be all and end all of this matter. The Legit guys talked to a bunch of companies and got official comments from them all, and claim these comments prove the INQ wrong. They don`t. The comments are merely the public faces of a bunch of RAM companies who are suddenly facing big changes in their stock. At least two of the companies that `Legit` interviewed that told them that there was no problem, told the INQ a completely different story, off the record and on the phone. Moral of the story? As Jeremy Paxman once said, when talking to people on the record, always think: "Why are these lying bastards lying to me?"
One thing that is clear is that Corsair still has stock. The Fremont guys have just signed a six month agreement to get hold of the chips from Samsung, and we suspect that it will be the only company able to get any. The channel is already emptied of TCCDs, there are no places for anybody who isn`t Corsair to buy them. This is good news for Corsair, which, we think, are going to have the monopoly on the parts.
Now, there are some alternatives for the memory companies. There are new Winbond modules being produced, and there are Micron modules that are almost as good. But they ain`t TCCD.
We spoke to Samsung. It told us officially that it was continuing production of DDR to support AMD systems. However, it flat-out refused to say specifically, and officially, whether that production was scaling down, but our conversations with the firm suggests to us that it is. Samsung is aggressively ramping up productions of DDR2 memory using new Fully-Buffered parts, as well as PlayStation 3 XDR memory . Samsung is heavily pushing the latter, and is even making plans to set aside more capacity in the event that a PC desktop chipset starts to support it. The technologies are competing with each other for time in the fabs, and enthusiast-grade modules are such small sellers, they`re the first to lose capacity.
So, there you have it. Only the coming days will confirm our story, but expect to see something of a switcheroo in most product lines. That is, of course, unless the memory chaps manage to kick up such a fuss at Samsung that it can convince the firm to make a u-turn. But with the inflection point for DDR2 approaching, where manufacturing capacity make price and performance a more attractive proposition than DDR1, we would be surprised to see that happening. µ
so, einen hab` ich noch:
http://www.realworldtech.com/page.cfm?ArticleID=RWT021005084…
Schöner Artikel, besonders gefällt mir:
Since ECC support is clearly not a requirement of a processor to be used in a game machine, the presence of ECC support, if confirmed, would clearly indicate IBM’s ambition to promote the use of CELL processors for serious computational applications outside of the application domain of the Sony Playstation.
http://www.realworldtech.com/page.cfm?ArticleID=RWT021005084…
Schöner Artikel, besonders gefällt mir:
Since ECC support is clearly not a requirement of a processor to be used in a game machine, the presence of ECC support, if confirmed, would clearly indicate IBM’s ambition to promote the use of CELL processors for serious computational applications outside of the application domain of the Sony Playstation.
http://www.theinquirer.net/?article=21201
Samsung memory stirs up hornet`s nest
Samsung is aggressively ramping up productions of DDR2 memory using new Fully-Buffered parts, as well as PlayStation 3 XDR memory. Samsung is heavily pushing the latter, and is even making plans to set aside more capacity in the event that a PC desktop chipset starts to support it.
Macht Spaß, solche kleinen Notizen aufzuspüren. Die lassen mich optimistisch in die Zukunft sehen, egal was mit dem ganzen juristischen Kram rauskommt.
Samsung memory stirs up hornet`s nest
Samsung is aggressively ramping up productions of DDR2 memory using new Fully-Buffered parts, as well as PlayStation 3 XDR memory. Samsung is heavily pushing the latter, and is even making plans to set aside more capacity in the event that a PC desktop chipset starts to support it.
Macht Spaß, solche kleinen Notizen aufzuspüren. Die lassen mich optimistisch in die Zukunft sehen, egal was mit dem ganzen juristischen Kram rauskommt.
muss ehrlich sagen, bin sehr gespannt was als nächstes kommen wird: CELL, FTC, PAYNE, HYNIX, LIZENZVERTRÄGE...
vielleicht schon den ersten schleckerbissen............
vielleicht schon den ersten schleckerbissen............
Was ist eigentlich los mit der Repräsentation von Rambus? Keine Nachrichten, keine Neuabschlüsse? Ziemlich schwach meiner Meinung nach!
jethor
jethor
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