EANS-News

AT&S successfully issues 175 million hybrid bond

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Corporate news transmitted by euro adhoc with the aim of a Europe-wide
distribution. The issuer is responsible for the content of this announcement.
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Capital Measures

Leoben - AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, one of
the globally leading manufacturers of printed circuit boards and IC substrates,
has completed the issue of a subordinated bond with an indefinite term and an
early redemption option after five years (hybrid bond) very successfully. The
issue, which was exclusively directed at institutional investors with a minimum
subscription of EUR 100,000, was primarily placed with international investors
with the issue amount totalling EUR 175 million. The targeted transaction volume
thus significantly exceeded the first time a hybrid bond was issued by AT&S. The
coupon was determined at 4.75% due to the great interest. After admission to
trading, the hybrid bond will be traded on the Semi-official Market of the
Vienna Stock Exchange.

"With the proceeds from this issue, we can strengthen our equity base and at the
same time support the further strategic investment programme as a basis for
long-term profitable growth," said CEO Andreas Gerstenmayer. "We are pleased
that we have also been able to broaden our investor base after the very positive
investor road show due to the strong demand. This demonstrates the confidence in
our development so far and our plans for the future."



Further inquiry note:
Elke Koch, Director Investor Relations & Communications
Tel: [phone]; Mobile: [phone]; [e-mail]

Marina Konrad, Head of Corporate Communications
Tel: [phone]; Mobile: [phone]; [e-mail]

Fabriksgasse 13, 8700 Leoben/Austria
www.ats.net



end of announcement euro adhoc
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issuer: AT & S Austria Technologie und Systemtechnik Aktiengesellschaft
Fabriksgasse 13
A-8700 Leoben
phone: [phone]
FAX:
mail: [e-mail]
WWW: www.ats.net
ISIN: AT0000969985
indexes: ATX GP, WBI, VÖNIX
stockmarkets: Wien
language: English