ERS electronic GmbH takes the lead in Fan-Out Panel Level Packaging equipment manufacturing with its new thermal debonding tool, the MPDM700

Munich (ots) - The new ERS MPDM700 supports the increasing demand
for fast prototyping and New Product Introduction of advanced
packaging in large panel format; it offers ERS´s complete range of
thermal debonding capabilities and even more powerful warpage
adjustment.

ERS electronic GmbH, the innovation leader in thermal management
solutions for the semiconductor manufacturing industry, is taking the
first ever step towards developing the new generation of thermal
debonding and warpage adjustment tools for Fan-Out Panel Level
Packaging (FOPLP).

With the MPDM700, users can thermally process any wafers and
panels (all formats up to 650 x 550mm carriers) without a conversion
kit, making it the ideal tool for research and development teams
working on advanced package development, New Product Introduction and
pre-production of advanced packaging devices in Fan-Out Wafer Level
Packaging (FOWLP) processes.

ERS designed the MPDM700 to perform the manual separation of
wafers and carriers related to FOPLP technologies and eWLB process.
Its special vacuum design and large range of operating temperatures
(up to +240°C) allow the debonding of very thin panels and warpage
correction of up to 10mm. Like the previous generation of ERS tools,
the MPDM700 features a contactless and smooth transport mechanism,
which enables the transport of the panels from one temperature zone
to the other while repairing warpage.

ERS started shipping the MPDM700 in November 2018 and installed
one of the first of its kind in the Fraunhofer-Institut für
Zuverlässigkeit und Mikrointegration (IZM), Berlin.

"We are pleased to have ERS´s MPDM700 that has enabled us to
perform thermal debonding on a 457 x 610 mm panel with more than
13.000 assembled components. Likewise, we are happy with ERS's
willingness to tailor their offer to fit our needs. Furthermore, we
believe that the controlled debonding and cooling of large panels
signifies a necessary step towards reliable fan-out panel level
packaging (FOPLP)," says Dr. Tanja Braun from Fraunhofer-IZM.

"We are delighted to add Fraunhofer IZM to our list of thermal
debonding customers. We are getting more and more demand for large
panel debonding and warpage adjustment. The MPDM700 is the first of a
series of thermal debonding tools that we are developing with
customers by leveraging our experience in thermal debonding and
warpage correction of reconstituted wafers," says Klemens Reitinger
CEO & CTO of ERS electronic GmbH.

About ERS:

ERS electronic GmbH, based in Germering, has been producing
innovative thermal test solutions for the semiconductor industry for
50 years. Today, thermal chuck systems developed by ERS in its
product families; AC3, AirCool©, AirCool© Plus and PowerSense© are an
integral component in all larger-sized wafer probers right across the
semiconductor industry.

Originaltext: ERS electronic GmbH
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PR & Marcom
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