SOITEC SOITEC REPORTS FY'19 FOURTH QUARTER REVENUES
SOITEC REPORTS FY'19 FOURTH QUARTER REVENUES
Q4'19 revenues reached €140m, up 45% at constant exchange rates and perimeter compared with Q4'18
- 200-mm wafer sales increased by 21% at constant exchange rates compared with Q4'18
300-mm wafer sales up 95% at constant exchange rates versus Q4'18
Bernin (Grenoble), France, April 17th, 2019 - Soitec (Euronext Paris), a world leader in designing and manufacturing innovative semiconductor materials, today announced consolidated revenues of 140.3 million Euros for the fourth quarter of FY'19 (ended March 31st, 2019), up 53.0% compared with 91.7 million Euros in the fourth quarter of FY'18. This reflects a 44.7% growth at constant exchange rates and perimeter1 as well as a positive currency impact of +2.1% and a scope effect of +6.2% that is related to the acquisition of Dolphin Integration assets in August 2018.
Sequentially, fourth quarter FY'19 revenues were up 20.1% on a reported basis and up 19.0% at constant exchange rates and perimeter1 compared to the third quarter of FY'19.
Paul Boudre, Soitec's CEO, commented: "We posted another strong performance in the fourth quarter and are finishing the fiscal year well above our initial sales growth guidance, as anticipated in prior communications. It has been a productive quarter for Soitec in terms of new research alliances and strategic partnerships signed in the Silicon Valley, in Singapore and in China. In the meantime, we enhanced our industrial relationship with our Shanghai-based partner, opened a direct sales channel in China and expanded our collaboration with Samsung Foundry. We are confident in our ability to continue providing the semiconductor industry with innovative and effective engineered materials that enable mass deployment of new applications for 5G, AI, electric vehicles and many other market segments."
Fourth quarter FY'19 business review by business unit
Communication & Power
Sales of products for radiofrequency applications continue to be driven by the increase in RF-SOI content and greater RF complexity. The adoption of advanced communication protocols enabling higher data transfer rates leads the latest generations of smartphones requiring more Antenna Tuners, more Switches and more LNAs (Low Noise Amplifiers) leading to additional volumes of RF-SOI. In the meantime, new solutions for most advanced 4G - LTE standards, as well as first 5G Sub-6GHz devices, require new solutions to serve the new generations of 5G smartphones, IoT devices and telecommunications infrastructure.