ACM Research Introduces Thin Wafer Cleaning System for High-volume Power Semiconductor Device Manufacturing

Patented Touch-free Bernoulli Handling and Processing System Supports Wet Processes for Ultra thin Wafers with High-Warpage

FREMONT, Calif., Sept. 15, 2020 (GLOBE NEWSWIRE) -- ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer-processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced the introduction of its Thin Wafer Cleaning System, a high-throughput, four-chamber system designed for single-wafer wet processes including cleaning, etching and surface finishing. The system is intended for the manufacture of both MOSFET and insulated-gate bipolar transistor (IGBT) devices for the power semiconductor market, and features complete touch-free handling and processing based on the Bernoulli effect to eliminate possible wafer damage and improve final device yield. It supports 200mm and 300mm Si wafers and is suitable for Taiko wafers down to 50-micron thickness, ultra-thin wafers of less than 200-micron thickness, high aspect ratio (>10:1) deep trench wafers as well as double-thickness bonded wafer pairs. 

Modor Intelligence, a market research consulting firm, expects the IGBT market to increase from US$5.4 billion in 2019 to US$9.4 billion in 2025, based on the broad application range of IGBTs to modern appliances such as cookers, microwaves, electric cars, trains, variable-frequency drives, variable speed refrigerators, air conditioners, lamp ballasts, municipal power transmission systems and stereo systems. Modor Intelligence also reports that sales of electric cars in Europe, North America and China are creating new avenues for IGBTs to support infrastructure and for manufacturing electric vehicles.¹

Furthermore, keeping up with the miniaturization trend while improving device performance has sparked demand for smaller pitch, deeper trench and thinner wafers.  Yole Développement, a market research and technology analysis firm, predicted the market for thinned wafers will increase from 100 million in 2019 to 135 million in 2025, a compound annual growth rate (CAGR) of more than 5%. Yole Développement expects this market growth to be driven by memory, CMOS image sensors and power silicon carbide components as well as LED and laser diodes.²