Manz AG receives follow-up order for equipment to realize fan-out panel level packaging in microchip production

DGAP-Media / 27.05.2021 / 08:59 Manz AG receives follow-up order for equipment to realize fan-out panel level packaging in microchip production Order in the mid-single-digit million euro range from one of the world's leading microchip producers Megatrends of digitalization, electromobility and autonomous driving spur market growth CAGR of >20% expected for plant technology until 2024 Reutlingen, Germany, May 27, 2021 - Manz AG, a globally active high-tech equipment manufacturer with a comprehensive technology portfolio, is seeing increasing interest in equipment for realizing the innovative packaging process for microchips, Fan-Out Panel Level Packaging (FOPLP). Now, Manz has received a follow-up order in the mid-single-digit million euro range from one of the world's leading providers in the field of microchip manufacturing.

Martin Drasch, CEO of Manz AG, comments: "The electronics industry is currently characterized by high dynamics, especially against the background of rapid digitization. A basic prerequisite for this is increasing miniaturization, which means that increasingly smaller components have an increasingly greater performance capacity. In the automotive industry in particular, the megatrends of electromobility and autonomous driving will lead to a sharp rise in the number of chips installed. Here, our systems for the realization of fan-out panel level packaging will play a key role. This is because, in addition to a significant reduction in volume, thickness, weight and manufacturing costs of the packaging, FOPLP also has a significantly positive impact on the thermal conduction and speed of the components."

In recent years electromobility and autonomous driving have already led to a sharp increase in the number of sensors installed in cars. While in 2016 sensors amounted to between 60 and 100 per car, by 2020 there were already more than 200 sensors. The number of chips in smartphones has also increased enormously. In view of these developments, suppliers in the fan-out panel level packaging sector can expect strong revenue growth for production equipment of more than 20% per year in the coming years.