ASE announces Dr. William Chen is the 2022 recipient of IMAPS Daniel C. Hughes, Jr. Memorial Award

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), announced today that the International Microelectronics Assembly & Packaging Society (IMAPS) has decided to award the 2022 Daniel C. Hughes, Jr. Memorial Award to ASE Fellow, Dr. William (Bill) Chen, for his lifetime achievement within the industry. The award was presented at a ceremony at IMAPS 2022 in Boston, Massachusetts by IMAPS President, Dr. Beth Keser.

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Dr. William (Bill) Chen (Photo: Business Wire)

This accolade is IMAPS’s highest, most prestigious annual technical honor, and is awarded to the individual who, in the opinion of the Daniel C. Hughes, Jr. Memorial Award Selection Committee, has the greatest combination of technical achievements related to microelectronics, combined with outstanding contributions supporting the microelectronics industry, academic achievement, or support and service to IMAPS.

Bill Chen is chief architect for technology strategy, lead mentor, and hands-on engineer for strategy implementation at ASE, blazing the trail for packaging innovators and innovation across the electronic industry ecosystem. His strategy portfolio includes SiP, copper wire-bond, 2.5D packaging, and fan-out wafer-level packaging, all game-changing technologies brought to high volume production to address new demands for emerging applications in IoT, cloud computing, autonomous automotive, AI and smart mobility. Previously, Bill spent over thirty-five years at IBM, where he pioneered the concept and implementation of predictive verified modeling incorporating materials science, micromechanical, and finite element for design and manufacturing benefiting generations of packaging products, from BGAs to mainframe systems.

Bill is a past president of the IEEE Electronics Packaging Society and was the co-chair of the Packaging & Assembly TWG at ITRS until its closure by SIA in 2016. He now chairs the Heterogeneous Integration Roadmap, co-sponsored by three IEEE Societies (EPS, EDS & Photonics) together with SEMI and ASME EPPD. He is the recipient of IEEE Electronics Packaging Technology Field Award and ASME InterPACK Award. Besides being ASE Fellow, he has also been elected IEEE Fellow, ASME Fellow, and now IMAPS Fellow. Living by his motto, “Challenge things that are difficult but worthwhile,” Bill is driven to inspire young engineers to always maintain an enthusiastic attitude while facing challenges, which once overcome will sustain the prosperity and impact of the semiconductor industry.