checkAd

     177  0 Kommentare Onto Innovation Receives TSMC Honor for Unique Advanced Node and Packaging Technologies

    Onto Innovation Inc. (NYSE: ONTO) today announced the company has received the Novel Technology Collaboration Award from TSMC as part of their initiative recognizing the outstanding contributions of their global suppliers.

    This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230328005734/en/

    Mike Plisinski, Onto Innovation CEO, receives Novel Technology Collaboration Award from J.K. Lin, senior vice president at TSMC. (Photo: Business Wire)

    Mike Plisinski, Onto Innovation CEO, receives Novel Technology Collaboration Award from J.K. Lin, senior vice president at TSMC. (Photo: Business Wire)

    “We are honored to receive this award from an industry leader like TSMC acknowledging our collaborative development to address their high-value process challenges through the deployment of Onto’s unique product capabilities,” said Mike Plisinski, chief executive officer of Onto Innovation. “It has been a privilege to collaborate with the talented team at TSMC to create innovative solutions that enable their product roadmap for advanced nodes and advanced packaging.”

    “Working together, TSMC and Onto have developed unique process control solutions for advanced logic applications using our Atlas platform and next-generation advanced packaging applications using our Dragonfly platform,” added Plisinski.

    Onto received the Novel Technology Collaboration Award from TSMC leadership during a ceremony on March 16, 2023. Onto looks forward to continuing its relationship with TSMC as they implement future roadmap strategies that leverage the unique capabilities of Onto’s optical metrology and macro inspection portfolio products.

    About Onto Innovation Inc.

    Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain combined with our connected thinking approach results in a unique perspective to help solve our customers’ most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. With headquarters and manufacturing in the U.S., Onto Innovation supports customers with a worldwide sales and service organization. Additional information can be found at www.ontoinnovation.com.

    Seite 1 von 3



    Business Wire (engl.)
    0 Follower
    Autor folgen

    Onto Innovation Receives TSMC Honor for Unique Advanced Node and Packaging Technologies Onto Innovation Inc. (NYSE: ONTO) today announced the company has received the Novel Technology Collaboration Award from TSMC as part of their initiative recognizing the outstanding contributions of their global suppliers. This press release …