SEALSQ Integrates Internet of Payment (IoP) in Next-Generation IoT-Enabled Semiconductors, Revolutionizing Connected Commerce

Geneva, Switzerland, Sept. 20, 2024 (GLOBE NEWSWIRE) -- SEALSQ Corp (NASDAQ: LAES) ("SEALSQ" or "Company"), a company that focuses on developing and selling Semiconductors, PKI and Post-Quantum technology hardware and software products, today announced the integration of Internet of Payment (IoP) capabilities into its next-generation IoT-enabled semiconductor solutions. This bold step positions SEALSQ at the forefront of a digital revolution, where connected devices transcend their traditional roles, morphing into dynamic commercial hubs capable of secure and autonomous transactions.

IoP: Ushering in a New Era of Commerce

The Internet of Things (IoT) has transformed everyday objects into smart, connected devices capable of communication and data exchange. Now, with the IoP integration, SEALSQ is taking this transformation further by enabling these connected devices to conduct autonomous, secure transactions, effectively making them part of a vast and efficient commerce network.

The IoP concept reimagines the role of IoT devices, evolving them into commercial platforms that facilitate seamless financial transactions. With this groundbreaking development, everyday items — cars, home appliances, or industrial machinery—will no longer merely communicate but will become active participants in the global economy, processing payments, ordering services, and managing resources autonomously.

Carlos Moreira, CEO of SEALSQ noted, “The innovative integration of IoP technology into our latest semiconductors represents a significant leap forward for the IoT industry.” “SEALSQ is enabling a future where connected devices are not just smarter but financially empowered, transforming how individuals and businesses interact, communicate and exchange data.”

Mr. Moreira added, “We continue to make substantial investments in next-generation technologies and are well positioned to benefit from the expected demand for post-quantum chips. We are now preparing to release engineering samples of our QS7001 Quantum-Resistant secure chips before the end of the year. SEALSQ’s strong value proposition has been reflected by significant new agreements and partnership signed this year with existing and new clients.”

Next-Generation Semiconductor Features

SEALSQ’s next-generation semiconductors will be equipped with advanced capabilities that address the growing demands of IoP applications, including:

• Secure, Autonomous Transactions: SEALSQ’s embedded secure payment modules ensure that IoT devices can conduct transactions safely and autonomously, mitigating risks associated with data breaches and fraud.
• Real-Time Transaction Processing: With cutting-edge microprocessor designs, SEALSQ chips enable real-time, seamless communication between devices and financial institutions, ensuring frictionless payment experiences for users.
• Scalability: SEALSQ’s semiconductors are designed to scale across various industries—from automotive to home automation to industrial IoT applications—ensuring that the potential of IoP is realized in a diverse range of use cases.
• Energy-Efficient Payment Modules: Low-power consumption features make SEALSQ’s semiconductors ideal for a wide variety of IoT devices, ensuring they can operate autonomously for long periods while still processing transactions.

IoP in Action: From Vision to Reality