121 Aufrufe 121 0 Kommentare 0 Kommentare

    TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions

    Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node designs and 3D-ICs. The rapid adoption of AI applications has created unprecedented demand for advanced silicon solutions capable of handling colossal datasets and computations. To meet these escalating requirements, the industry is pushing the boundaries of advanced-node silicon and 3D-IC technologies. TSMC and Cadence are at the forefront of this revolution, together empowering customers to accelerate time to market while increasing performance.

    This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240925780123/en/

    Anzeige 
    Handeln Sie Ihre Einschätzung zu Cadence Design Systems!
    Short
    323,09€
    Basispreis
    1,98
    Ask
    × 14,20
    Hebel
    Zum Produkt
    Long
    276,42€
    Basispreis
    2,42
    Ask
    × 11,62
    Hebel
    Zum Produkt
    Präsentiert von

    Den Basisprospekt sowie die Endgültigen Bedingungen und die Basisinformationsblätter erhalten Sie bei Klick auf das Disclaimer Dokument. Beachten Sie auch die weiteren Hinweise zu dieser Werbung.

    Cadence is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node designs and 3D-ICs. The rapid adoption of AI applications has created unprecedented demand for advanced silicon solutions capable of handling colossal datasets and computations. TSMC and Cadence are together empowering customers to accelerate time to market while increasing performance. (Graphic: Business Wire)

    Cadence is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node designs and 3D-ICs. The rapid adoption of AI applications has created unprecedented demand for advanced silicon solutions capable of handling colossal datasets and computations. TSMC and Cadence are together empowering customers to accelerate time to market while increasing performance. (Graphic: Business Wire)

    TSMC has certified Cadence’s industry-leading digital and custom design flows for implementation and signoff on TSMC’s latest N3 and N2P process technologies. As long-standing design technology co-optimization (DTCO) partners, TSMC and Cadence continue that tradition by collaborating to optimize power, performance and area (PPA) on A16, adding EDA features to enable advanced features such as backside routing.

    Cadence and TSMC are also collaborating on Cadence.AI to drive next-generation digital and analog design automation fueled by AI, delivering industry-leading productivity and quality of results. Cadence.AI is a chips-to-systems AI platform spanning all aspects of design and verification. The collaboration between TSMC and Cadence is focused on three main domains:

    The Cadence Integrity 3D-IC Platform is a leading system-level exploration solution and a single-vendor platform that unifies packaging, analog and digital implementation—making efficient 3D-IC design possible. This opens new opportunities for innovation by supporting all the latest 3Dblox features and constructs. To enable the ultra-high-density interconnect in TSMC 3DFabric technologies, TSMC and Cadence are collaborating on a next-generation high-capacity substrate router for die-to-die and die-to-substrate connections.

    Seite 1 von 3



    Business Wire (engl.)
    0 Follower
    Autor folgen

    TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node designs and 3D-ICs. The rapid adoption of AI applications has created …