Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry

Cadence (Nasdaq: CDNS) today announced an expansion of its collaboration with Samsung Foundry, including a new multi-year IP agreement to broaden Cadence memory and interface IP solutions in Samsung Foundry’s SF4X, SF5A and SF2P advanced process nodes. Furthering their ongoing technology collaboration, the companies are leveraging Cadence’s AI-driven design solutions and Samsung’s advanced SF4X, SF4U and SF2P process nodes to deliver high-performance, low-power solutions for AI data center, automotive—including advanced driver-assistance systems (ADAS)—and next-generation RF connectivity applications.

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Cadence expanded its collaboration with Samsung Foundry, including a new multi-year IP agreement and joint development of advanced AI-driven flows on the latest SF2P and other advanced process nodes.

Cadence’s AI-driven design solutions and comprehensive portfolio of IP and silicon solutions enhance designers’ productivity and accelerate time to market (TTM) for leading-edge SoCs, chiplets and 3D-ICs on advanced Samsung Foundry processes.

“We support a full portfolio of IP, subsystems and chiplets on the Samsung Foundry process nodes, and our latest multi-year IP agreement strengthens our ongoing collaboration,” said Boyd Phelps, senior vice president and general manager of the Silicon Solutions Group at Cadence. “By combining Cadence’s AI-driven design and silicon solutions with Samsung’s advanced processes, we’re delivering the leading-edge technologies our mutual customers need to innovate and bring their products to market faster.”

Hyung-Ock Kim, vice president and head of the Foundry Design Technology Team at Samsung Electronics, added, “Cadence’s suite of digital tools from RTL to GDS is now certified for Samsung’s latest SF2P process node, supporting advancements like Hyper Cell and LLE 2.0 technologies. Cadence and Samsung are also collaborating closely to enable analog migration, enhance power integrity and improve thermal and warpage analyses for 3D-ICs using GPU acceleration. Additionally, a multi-year agreement between Cadence and Samsung Foundry to expand memory and interface IP solutions further strengthens our partnership.”