Semtech Unveils High-Performance TIAs for 1.6T AI Data Centers - Seite 2

GN1834D: Powering the 1.6T Infrastructure Revolution

The GN1834D expands Semtech’s industry-leading 200G TIA portfolio that enables the emerging 1.6T optical interconnect market through advanced 200G per channel performance and innovative 2.5D mounting technology. As a key component in 8x200G optical modules that deliver 1.6T throughput, the GN1834D provides the analog performance foundation that hyperscale operators need for next-generation AI cluster connectivity. This hybrid assembly approach combines flip chip mounting at the critical photodetector-to-TIA interface with wire bond outputs, minimizing parasitic effects and delivering superior signal integrity for next-generation applications.

GN1818: Power-Optimized 100G for Extended 800G Infrastructure

As operators continue scaling 800G infrastructure while planning 1.6T transitions, the GN1818 delivers strategic power optimization for existing deployments. The GN1818 represents a significant advance in 100G TIA efficiency, achieving up to 20% power reduction compared to alternatives while maintaining the proven performance characteristics that have made Semtech a trusted choice for hyperscale AI deployments. This power efficiency enhancement extends the value of current 800G infrastructure investments while operators prepare for 1.6T migration.

GN1818’s strategic advantages include:

• Up to 20% power reduction: Low-power innovation while maintaining high-performance standards
• Proven heritage: Built on Semtech's established high-performance and reliable TIA design principles
• Compact 250μm pitch: Maximum port density for space-constrained optical modules
• Performance without compromise: Maintains signal integrity and low latency for AI applications

Comprehensive Portfolio Drives Market Leadership

Semtech’s competitive advantage in the emerging 1.6T market lies in portfolio breadth that enables customer standardization across diverse connectivity requirements. The 200G per channel portfolio provides robust design flexibility for next-generation optical modules and now includes:

• GN1834D: Linear TIA with 2.5D mounting, 750μm pitch
• GN1832: Linear Flip Chip TIA, 500μm pitch
• GN1834: Linear Flip Chip TIA, 750μm pitch
• GN1836: Linear TIA, 250μm pitch

This comprehensive approach enables module manufacturers to optimize designs for specific applications while maintaining supply chain efficiency through single-supplier standardization.