Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus in Arizona; Expands Investment to $7 Billion

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces the groundbreaking and expanded planned investment of its new state-of-the-art outsourced semiconductor advanced packaging and test campus in Arizona.

The expanded investment includes additional cleanroom space and a second greenfield packaging and test facility, increasing total project investment by more than $5 billion, to a total of $7 billion across two phases. The groundbreaking ceremony brings together government officials, industry leaders, and community stakeholders to celebrate this significant milestone. Amkor’s investment supports the broader strategy to strengthen U.S. semiconductor leadership and will be the first U.S. based high volume advanced packaging facility.

Upon completion of both phases, the campus will offer over 750,000 square feet of cleanroom space and as many as 3,000 high-quality jobs. Construction of the first manufacturing facility on the campus is expected to be completed in mid-2027, with production beginning in early 2028. The new greenfield facilities will serve as a cornerstone of America’s advanced packaging capabilities, supporting key customers including Apple and NVIDIA. Amkor’s expanded investment is supported by the Trump Administration’s CHIPS for America Program, the Advanced Manufacturing Investment Tax Credit, and state and local governments.

“This groundbreaking represents a bold step in Amkor’s long-term strategy for growth and innovation,” said Giel Rutten, Amkor’s president and chief executive officer. “We’re building a facility to meet our customers’ most advanced needs that will help shape the future of semiconductor manufacturing in the United States. Arizona offers the right mix of talent, infrastructure, and industry presence, and we’re proud to deepen our roots here.”

Strategically located in Arizona’s growing high-tech corridor, the campus will house the most sophisticated outsourced semiconductor packaging and test facilities in the country. It will feature smart factory technologies and scalable production lines to meet evolving market demands for AI, high performance computing, mobile communications, and automotive applications. The campus will focus on advanced packaging and testing technologies and will complement TSMC’s front-end wafer fabrication for full end-to-end semiconductor manufacturing.