Applied Materials Unveils Next-Gen Chipmaking Products to Supercharge AI Performance

• Kinex is the industry’s first integrated die-to-wafer hybrid bonding system; enables production of higher performance, lower power advanced logic and memory chips
• Xtera system enables higher performance Gate-All-Around transistors at 2nm and beyond by depositing void-free, uniform epitaxial layers
• PROVision 10 eBeam metrology system improves yield of complex 3D chips by providing sub-nanometer resolution, fast throughput and deep imaging
  
  

SANTA CLARA, Calif., Oct. 07, 2025 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced new semiconductor manufacturing systems that boost the performance of advanced logic and memory chips foundational to AI computing. The new products target three critical areas in the race to deliver ever more powerful AI chips: leading-edge logic including Gate-All-Around (GAA) transistors, high-performance DRAM including high-bandwidth memory (HBM), and advanced packaging to create highly integrated systems-in-a-package that optimize chip performance, power consumption and cost.

“As chips become more complex, Applied is focused on driving materials engineering breakthroughs to provide the performance and power-efficiency improvements needed to scale AI,” said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials. “We are collaborating earlier and deeper with our customers to co-develop solutions that accelerate chipmaker roadmaps and enable major device inflections in logic, memory and advanced packaging.”

New Kinex Bonding System Enables Production of Higher Performance, Lower Power Advanced Logic and Memory Chips

To optimize performance and power efficiency, today’s leading GPUs and high-performance computing (HPC) chips use advanced packaging schemes to combine multiple chiplets into complex systems. Hybrid bonding is an emerging chip-stacking technology that uses direct copper-to-copper bonds, resulting in significant improvements in overall performance, power consumption and cost.

Increasingly complex chip packages create challenges for hybrid bonding in high-volume manufacturing. To accelerate the use of hybrid bonding in advanced logic and memory chips, Applied Materials, in collaboration with BE Semiconductor Industries N.V. (Besi), developed the Kinex Bonding system – the industry’s first integrated die-to-wafer hybrid bonder. The system brings together Applied’s expertise in front-end wafer and chip processing with high levels of bonding accuracy and speed from Besi’s leading die placement, interconnect and assembly solutions.