Three HEICO Subsidiaries Supply Mission-Critical Parts for Artemis II Launch

3D PLUS, Exxelia, and VPT Designed and Manufactured Components

MIAMI, FL / ACCESS Newswire / April 13, 2026 / HEICO Corporation (NYSE:HEI.A)(NYSE:HEI) commends NASA and its team for a successful Artemis II mission, and proudly reports that its subsidiaries 3D PLUS, Exxelia, and VPT supplied mission-critical electronic components on NASA's Artemis II mission.

HEICO's Buc, France based 3D PLUS developed and produced critical memory devices for both the Space Launch System and Orion Spacecraft portions of the Artemis II program.

HEICO's Paris, France based Exxelia developed and produced capacitors and magnetics products integrated into the Orion Spacecraft portion of the Artemis II program.

HEICO's Blacksburg, VA based VPT developed and produced a broad portfolio of Class K and KL1 radiation-hardened DC-DC converters and EMI filter solutions embedded in the Orion Spacecraft. VPT's parts were also deployed throughout the Space Launch System's avionics, underscoring its significant role in powering mission-critical systems across the Artemis II program.

NASA's Artemis II mission was a landmark return to deep space human exploration, sending four astronauts on a roughly 10-day mission around the Moon. As the inaugural crewed flight of the Orion spacecraft atop the Space Launch System rocket, Artemis II tested critical systems for navigation, life support, and deep-space operations, paving the way for future lunar landings. This mission was a pivotal moment in NASA's broader Artemis program, laying the foundation for human presence on the moon.

3D PLUS's Co-Founder and CEO, Pierre Maurice, Exxelia's CEO, Paul Maisonnier, and VPT's CEO, Dan Sable, along with HEICO's Co-Chairmen and Chief Executive Officers Eric A. Mendelson and Victor H. Mendelson, remarked, "We congratulate NASA, and the thousands of people behind Artemis II. It's an incredible moment, and we're honored to have played a part in it. We're excited to keep supporting what comes next."

3D PLUS is the world-leading supplier of advanced high-density 3D microelectronic products, bare die and wafer-level stacking technology meeting the demand for high reliability, high performance and very small size of today's and tomorrow's electronics. Its product range includes memory, computer cores, interfaces, power solutions, protection ICs, camera heads, camera systems, and custom SiP solutions. With over 220,000 components in space and more than 25 years of flight heritage, 3D PLUS serves the global space industry for various applications and it is expanding continuously with products launched in space every month in GEO, MEO, and LEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions. Visit 3D PLUS's website: https://www.3d-plus.com.

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