EQS-News

SUSS MicroTec presents hybrid bonding all-rounder XBC300 Gen2 D2W/W2W

EQS-News: SÜSS MicroTec SE / Key word(s): Product Launch SUSS MicroTec presents hybrid bonding all-rounder XBC300 Gen2 D2W/W2W 13.05.2024 / 09:00 CET/CEST The issuer is solely responsible for the content of this announcement. W2W, collective D2W and sequential D2W on a single platform New solution allows parallel development of different hybrid bonding processes   Up to 40 percent space saving compared to stand-alone D2W or W2W hybrid bonders   Bonder specialist SET contributes ultra-high-precision die bonder  Garching, May 13, 2024 – SÜSS MicroTec SE, a leading manufacturer of system and process solutions for the semiconductor industry, presents a world novelty: the first hybrid bonding all-rounder. The integrated platform XBC300 Gen2 D2W/W2W covers the complete range of current process technologies for hybrid bonding on 200 mm and 300 mm substrates. It enables wafer-to-wafer (W2W) as well as collective and sequential die-to-wafer (D2W) bonding. Thanks to its versatility, different hybrid bonding processes can be developed and qualified in parallel, making the XBC300 Gen2 D2W/W2W perfectly tailored to the needs of research facilities and development departments of semiconductor manufacturers. Compared to stand-alone W2W or D2W hybrid bonders, the XBC300 Gen2 D2W/W2W requires up to 40 percent less space. It is therefore a particularly efficient and footprint-optimized solution for testing hybrid bonding methods and preparing them for high-volume production.  "Semiconductor manufacturers have to evaluate individually for each application which hybrid bonding technology leads to better process results. With our innovative solution, we provide them with a single tool to evaluate the best bonding process in each case. Our new solution is therefore the optimal flexible platform for the subsequent commissioning of independent W2W or D2W hybrid bonders with high throughput for large volumes," says Markus Ruff, Head of Product Line Bonder at SUSS MicroTec.