EQS-News

SUSS MicroTec starts fiscal year 2024 with strong growth and improved margins

EQS-News: SÜSS MicroTec SE / Key word(s): Quarterly / Interim Statement SUSS MicroTec starts fiscal year 2024 with strong growth and improved margins 08.05.2024 / 07:30 CET/CEST The issuer is solely responsible for the content of this announcement.    Order book reaches new record level of € 456.9 million    Sales of € 93.5 million significantly up 46.1% on the same quarter    of the previous year    Gross profit and EBIT margin benefit from high sales level and    favorable product mix    Forecast for the full year 2024 confirmed Garching, May 8, 2024 – SÜSS MicroTec SE, a leading manufacturer of equipment and process solutions for the semiconductor industry, today publishes its quarterly statement for the first three months of the 2024 fiscal year. The preliminary financial figures for the first quarter of 2024 announced on April 18, 2024 are confirmed without exception. In the first quarter of 2024, SUSS MicroTec generated an order intake of € 98.3 million (Q1 2023: € 94.9 million). The Advanced Backend Solutions segment accounted for approximately two thirds of this. The positive development of the bonder product line was again noteworthy with new business of € 34.4 million. This was driven by existing customers using temporary bonding solutions to produce so-called HBM (High Bandwidth Memory) chips, thus supporting the capacity expansion for microchips used in AI applications. Two new customers were also acquired, including one for the production of energy-efficient silicon carbide (SiC) semiconductors. In addition, an order for a wafer-to-wafer hybrid bonder was collected. In the Photomask Solutions segment, order intake amounted to € 33.7 million, further increasing compared to the previous two quarters. The order backlog as of March 31, 2024 totalled € 456.9 million, an increase of 25.5% over the prior year (March 31, 2023: € 364.0 million).