SUSS MicroTec launches ELD 300 Excimer Laser Debonder for 3D-Integration

(DGAP-Media / 08.07.2014 / 15:00)

SUSS MicroTec launches ELD 300 Excimer Laser Debonder for 3D-Integration

Garching, July 8, 2014 - SÜSS MicroTec, a leading supplier of equipment and
process solutions for the semiconductor and related markets, has launched
an excimer laser debonder, the ELD300, for the stress free debonding of 200
and 300mm 3D-IC wafers, today.

The laser debonder can be used as a stand-alone, semi-automated system or
as an integrated process module in SUSS MicroTec's XBC300 Gen2 platform.
The debonding method used in the ELD300 relies on a 308nm Excimer laser to
separate the glass carrier from a tape mounted thin wafer. The ultraviolet
light of the pulsed laser beam is absorbed in the adhesive or in an
optional UV absorption layer within a few hundred nanometers. The absorbed
energy breaks the chemical bonds in the adhesive or absorption layer
without generating thermal stress on the thin device wafer so that the
glass carrier can easily be lifted off after the debonding process. With
the alternative module for mechanical peel-off debonding and the modules
for post-debond cleaning of tape mounted thin wafers or carrier wafers,
SUSS MicroTec's XBC300 Gen2 platform offers a full solution package for
debonding and cleaning applications.

The ELD300 mainly focuses on 2.5D and 3D-IC applications but also addresses
the requirements in the areas of 3D MEMS, CMOS Image Sensors and power
devices. The main competitive advantages of Excimer laser assisted
debonding with the ELD300 are the short process times which result in high
throughput, the debonding selectivity of the process, the absence of
mechanical or thermal stress on the thin device wafer and eventually the
high degree of automation which is of essence for high volume
manufacturing.

"With the launch of the ELD300 SUSS MicroTec now offers two dedicated
solutions for room temperature debonding: mechanical peel-off and Excimer
laser assisted processes.", says Frank P. Averdung, President and CEO of
SUSS MicroTec AG. "We see ourselves well positioned for the challenging
tasks that can be expected from high volume production of 3D-ICs."

About SUSS MicroTec
SUSS MicroTec is a leading supplier of equipment and process solutions for
microstructuring in the semiconductor industry and related markets. In
close cooperation with research institutes and industry partners SUSS
MicroTec contributes to the advancement of next-generation technologies
such as 3D Integration and nanoimprint lithography as well as key processes
for MEMS and LED manufacturing. With a global infrastructure for
applications and service SUSS MicroTec supports more than 8.000 installed
systems worldwide. SUSS MicroTec is headquartered in Garching near Munich,
Germany. For more information, please visit http://www.suss.com




Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: [phone]
Fax: [phone]
Email: [e-mail]


End of Media Release

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Issuer: SÜSS MicroTec AG
Key word(s): Enterprise

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Language: English
Company: SÜSS MicroTec AG
Schleissheimer Strasse 90
85748 Garching
Germany
Phone: [phone]
Fax: [phone]
E-mail: [e-mail]
Internet: www.suss.com
ISIN: DE000A1K0235
WKN: A1K023
Listed: Regulierter Markt in Frankfurt (Prime Standard);
Freiverkehr in Berlin, Düsseldorf, Hamburg, München,
Stuttgart


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