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     215  0 Kommentare AMD Showcases Graphics, Energy Efficient Computing and Die-Stacking Innovation at Prestigious Hot Chips 27 Conference

    CUPERTINO, CA--(Marketwired - Aug 24, 2015) - Top technologists from AMD (NASDAQ: AMD) are detailing the engineering accomplishments behind the performance and energy efficiency of the new high-performance Accelerated Processing Unit (APU), codenamed "Carrizo," and the new AMD Radeon™ R9 Fury family of GPUs, codenamed "Fiji," at the prestigious annual Hot Chips symposium starting today. The presentations will focus on new details of the high-definition video and graphics processing engines on the 6th Generation AMD A-Series APU ("Carrizo"), and the eight year journey leading to die-stacking technology and all-new memory architecture included on the latest top-of-the-line AMD Radeon™ Fury Series GPUs ("Fiji") for 4K gaming and VR. Using a true System-on-Chip (SoC) design, 6th Generation AMD A-Series processors are designed to reduce the power consumed by the x86 cores alone by 40 percent,1 while providing substantial gains in CPU, graphics, and multimedia performance versus the prior generation APU. The new AMD Radeon™ R9 Fury X GPU achieves up to 1.5x the performance-per-watt of the previous high-end GPU from AMD.2

    "With our new generation of APU and GPU technology, our engineering teams left no stone unturned for performance and energy efficiency," said Mark Papermaster, chief technology officer at AMD. "Using innovative design for our APUs, we've vastly increased the number of transistors on-chip to increase functionality and performance, implemented advanced power management, and completed the hardware implementation of Heterogeneous System Architecture. For our latest GPUs, AMD is the first to introduce breakthrough technology in the form of die-stacking and High-Bandwidth Memory. The results are great products with very large generational performance-per-watt gains."

    The details will be shared in two symposium presentations. On August 24, Guhan Krishnan, AMD fellow, design engineering, will present "Energy efficiency in graphics and multimedia in 28nm 'Carrizo' APU." This session will provide an in-depth view of the multitude of advancements resulting in superior performance, battery life, and user experiences on performance notebook and convertible form factors. In "AMD's next Generation GPU and memory architecture" on August 25, Joe Macri, corporate vice president and product chief technology officer at AMD, will share the journey from inception to market that covered eight years and involved several key partners, as well as provide architectural details behind the performance and efficiency of the new AMD Radeon R9 Fury line of GPUs.

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    AMD Showcases Graphics, Energy Efficient Computing and Die-Stacking Innovation at Prestigious Hot Chips 27 Conference CUPERTINO, CA--(Marketwired - Aug 24, 2015) - Top technologists from AMD (NASDAQ: AMD) are detailing the engineering accomplishments behind the performance and energy efficiency of the new high-performance Accelerated Processing Unit (APU), …

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