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    EQS-News  109  0 Kommentare  Between Theory and (Best) Practice: The Who's Who of Power Electronics Gets Together in Stockholm

    Für Sie zusammengefasst
    • International conference SCAPE 2024 in Stockholm
    • Industry experts discuss future power electronics
    • Schweizer Electronic AG shares technical expertise

    EQS-News: Schweizer Electronic AG / Key word(s): Market Report/Miscellaneous
     Between Theory and (Best) Practice: The Who's Who of Power Electronics Gets Together in Stockholm

    03.05.2024 / 14:15 CET/CEST
    The issuer is solely responsible for the content of this announcement.


     Between Theory and (Best) Practice: The Who's Who of Power Electronics Gets Together in Stockholm

    • Participation in the international conference SCAPE 2024 in Scandinavia
    • Industry experts exchange views on future technologies
    • Schweizer Electronic AG's technical expertise an important part of the workshops

    Schramberg, 03.05.2024: When science and industry meet: From May 13-15, 2024, international experts from the semiconductor and PCB industries will meet in Stockholm, Sweden, for SCAPE 2024, a three-day conference on power electronics. Under the motto ‘International Wide-Bandgap Power Electronics Applications Workshop’, the aim of the event is the interdisciplinary exchange of expertise, the latest developments and visions for the future. At the invitation of a European OEM, SCHWEIZER will once again share its expertise with the industry through an interesting presentation and an exhibition area at the conference.

    The main topics of the conference will revolve around the latest technological developments in power electronics as well as the applications, possibilities and developments, e.g. through the use of materials such as silicon carbide (SiC) or gallium nitride (GaN). What makes SCAPE 2024 so exciting is the reflection of the scientific research results of the questions and topics in workshops, lectures and technical discussions with the perspective of the industry. In a thematic block on packaging technologies, Thomas Gottwald, Chief Technology Officer of Schweizer Electronic AG, will report on the groundbreaking p² Pack technology in his presentation "Embedding of SiC Mosfet into a PCB". To illustrate this, SCHWEIZER will also present a high voltage evaluation kit, which will be available in the exhibition area.

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    EQS-News  Between Theory and (Best) Practice: The Who's Who of Power Electronics Gets Together in Stockholm EQS-News: Schweizer Electronic AG / Key word(s): Market Report/Miscellaneous  Between Theory and (Best) Practice: The Who's Who of Power Electronics Gets Together in Stockholm 03.05.2024 / 14:15 CET/CEST The issuer is solely responsible for the …

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