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ISIN: DE000A1K0235 · WKN: A1K023
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Antwort auf Beitrag Nr.: 44.442.123 von traderunion am 16.04.13 13:58:54ja leider und auch schon wieder fast 1€ abgegeben!!
Nur weisses rauschen auf dem IR Kanal. ...
so Mädels, die 9,-€ sind zurück erkämpft!!
Die Konkurrenz schläft nicht:
Globalfoundries demos 3D TSV capabilities on 20nm
Press release; Jessie Shen, DIGITIMES [Wednesday 3 April 2013]
Globalfoundries on April 2 announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications. At its New York fab, the foundry has demonstrated its first functional 20nm silicon wafers with integrated through-silicon vias (TSVs).
Manufactured using Globalfoundries' 20nm-LPM process technology, the TSV capabilities will allow customers to stack multiple chips on top of each other, providing another avenue for delivering the demanding performance, power and bandwidth requirements of today's electronic devices, the company said.
TSVs are vertical vias etched in a silicon wafer that are filled with a conducting material, enabling communication between vertically-stacked ICs. The adoption of 3D chip stacking is increasingly being viewed as an alternative to traditional technology node scaling at the transistor level. However, TSVs present a number of new challenges to semiconductor manufacturers.
Globalfoundries disclosed that it utilizes a "via-middle" approach to TSV integration, inserting the TSVs into the silicon after the wafers have completed the front-end-of-line (FEOL) flow and prior to starting the back-end-of-line (BEOL) process. This approach avoids the high temperatures of the FEOL manufacturing process, allowing the use of copper as the TSV fill material.
To overcome the challenges associated with the migration of TSV technology from 28nm to 20nm, Globalfoundries indicated that its engineers have developed a proprietary contact protection scheme. The scheme enabled the company to integrate the TSVs with minimal disruption to the 20nm-LPM platform technology, demonstrating SRAM functionality with critical device characteristics in line with those of standard 20nm-LPM silicon.
"Our industry has been talking about the promise of 3D chip stacking for years, but this development is another sign that the promise will soon be a reality," said David McCann, VP of packaging R&D at Globalfoundries. "Our next step is to leverage Fab 8's advanced TSV capabilities in conjunction with our OSAT partners to assemble and qualify 3D test vehicles for our open supply chain model, providing customers with the flexibility to choose their preferred back-end supply chain."
As the fabless-foundry business model evolves to address the realities of today's dynamic market, foundries are taking on increasing responsibility for managing the supply chain to deliver end-to-end solutions that meet the requirements of the broad range of leading-edge designs. To help address these challenges, Globalfoundries is engaging early with partners to jointly develop solutions that will enable the next wave of innovation in the industry.
Es grüßt Rickmann
Globalfoundries demos 3D TSV capabilities on 20nm
Press release; Jessie Shen, DIGITIMES [Wednesday 3 April 2013]
Globalfoundries on April 2 announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications. At its New York fab, the foundry has demonstrated its first functional 20nm silicon wafers with integrated through-silicon vias (TSVs).
Manufactured using Globalfoundries' 20nm-LPM process technology, the TSV capabilities will allow customers to stack multiple chips on top of each other, providing another avenue for delivering the demanding performance, power and bandwidth requirements of today's electronic devices, the company said.
TSVs are vertical vias etched in a silicon wafer that are filled with a conducting material, enabling communication between vertically-stacked ICs. The adoption of 3D chip stacking is increasingly being viewed as an alternative to traditional technology node scaling at the transistor level. However, TSVs present a number of new challenges to semiconductor manufacturers.
Globalfoundries disclosed that it utilizes a "via-middle" approach to TSV integration, inserting the TSVs into the silicon after the wafers have completed the front-end-of-line (FEOL) flow and prior to starting the back-end-of-line (BEOL) process. This approach avoids the high temperatures of the FEOL manufacturing process, allowing the use of copper as the TSV fill material.
To overcome the challenges associated with the migration of TSV technology from 28nm to 20nm, Globalfoundries indicated that its engineers have developed a proprietary contact protection scheme. The scheme enabled the company to integrate the TSVs with minimal disruption to the 20nm-LPM platform technology, demonstrating SRAM functionality with critical device characteristics in line with those of standard 20nm-LPM silicon.
"Our industry has been talking about the promise of 3D chip stacking for years, but this development is another sign that the promise will soon be a reality," said David McCann, VP of packaging R&D at Globalfoundries. "Our next step is to leverage Fab 8's advanced TSV capabilities in conjunction with our OSAT partners to assemble and qualify 3D test vehicles for our open supply chain model, providing customers with the flexibility to choose their preferred back-end supply chain."
As the fabless-foundry business model evolves to address the realities of today's dynamic market, foundries are taking on increasing responsibility for managing the supply chain to deliver end-to-end solutions that meet the requirements of the broad range of leading-edge designs. To help address these challenges, Globalfoundries is engaging early with partners to jointly develop solutions that will enable the next wave of innovation in the industry.
Es grüßt Rickmann
Trading Spotlight
Equinet hebt Ziel für Süss Microtec auf 14 Euro - 'Buy'
Die Investmentbank Equinet hat das Kursziel für Süss Microtec nach einem Auftrag von Samsung von 10 auf 14 Euro angehoben und die Einstufung auf "Buy" belassen. Die Bestellung von neuartiger, dreidimensionaler Ausrüstung zur Massenfertigung von 300-Millimeter-Wafern sei ein Durchbruch für den Anbieter von Geräten und Lösungen für den Halbleitermarkt, schrieb Analyst Adrian Pehl in einer Studie vom Dienstag. Da das Unternehmen mit Samsung keine Exklusivität vereinbart habe, dürften rasch weitere Aufträge durch andere Konzerne folgen. Der Umsatz des entsprechenden Geschäftsbereichs des Konzerns könnte von jetzt 20 Millionen Euro auf etwa 100 Millionen Euro steigen./fri/gl
AFA0015 2013-04-02/11:08
ISIN: DE000A1K0235
Es grüßt Rickmann
Die Investmentbank Equinet hat das Kursziel für Süss Microtec nach einem Auftrag von Samsung von 10 auf 14 Euro angehoben und die Einstufung auf "Buy" belassen. Die Bestellung von neuartiger, dreidimensionaler Ausrüstung zur Massenfertigung von 300-Millimeter-Wafern sei ein Durchbruch für den Anbieter von Geräten und Lösungen für den Halbleitermarkt, schrieb Analyst Adrian Pehl in einer Studie vom Dienstag. Da das Unternehmen mit Samsung keine Exklusivität vereinbart habe, dürften rasch weitere Aufträge durch andere Konzerne folgen. Der Umsatz des entsprechenden Geschäftsbereichs des Konzerns könnte von jetzt 20 Millionen Euro auf etwa 100 Millionen Euro steigen./fri/gl
AFA0015 2013-04-02/11:08
ISIN: DE000A1K0235
Es grüßt Rickmann
Kenn mich nicht aus. Hat der jüngste Samsungauftrag eigentlich
was mit 3D Stacking zu tun?
Deliberately
was mit 3D Stacking zu tun?
Deliberately
Das Management kauft wieder Aktien...
Antwort auf Beitrag Nr.: 44.333.601 von geldspender am 30.03.13 12:52:24immerhin haben wir die 9,- zurück erkämpft. Damit sollte der Abwärtstrend unterbrochen sein!
Gruß P50
Gruß P50
eine Aktie mit Potenzial, hier werden keine Luftschlösser gekauft. Mal sehen wie der Kurs sich entwickelt.
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