Government-funded IBAS Program Enters Next Phase of Silicon Interposer Development at NeoCity in Florida

BRIDG, a not-for-profit, public-private partnership specializing in advanced system integration and packaging, today announced the U.S. Department of Defense-funded Industrial Base Analysis and Sustainment (IBAS) technology development program has kicked off phase four of its contract. The IBAS program’s goal is to establish a comprehensive domestic silicon interposer manufacturing capability, supporting several advanced electronic systems.

Awarded to BRIDG in October 2019, phase one of the program was completed in November 2022 with BRIDG partners, imec and SkyWater Technology. The IBAS federal defense contract, valued at up to $20 million, provides an advanced packaging technology for next generation microelectronic multi-chip systems that will strengthen national security and cyber resiliency for the U.S. defense industrial base.

“We are excited to launch the next phase of this contract,” stated Jim Vandevere, president of BRIDG. “The continued support from IBAS to foster advanced packaging technologies is an acknowledgement to what our NeoCity coalition is all about.”

Silicon interposers are used to integrate semiconductor devices into a highly compact and power efficient format, providing increased performance and capability. Versatile and compact, silicon interposers are quickly becoming one of the most popular choices for advanced packaging.

“This final program phase is an important milestone as we prepare our interposer platform offering,” said Dale Miller, SkyWater Florida vice president and general manager. “We look forward to continuing our partnership with BRIDG and imec to complete this phase and provide a broader interposer technology offering that will support RF, digital and mixed signal applications.”

“We look forward to having this next phase of silicon interposer technology available to support next generation applications for the DoD,” stated Matt Walsh, Office of the Secretary of Defense IBAS advanced packaging chief engineer. “The OSD IBAS organization understands the critical need for an advanced packaging ecosystem in the U.S., and the silicon interposer work at BRIDG and SkyWater Technology is part of that effort.”

“We are pleased that our partnership with BRIDG and SkyWater has helped reach this next stage of the IBAS program, which leverages imec's interposer technology. Partnerships help fuel innovation, and our work with BRIDG and NeoCity is a testament to our commitment to strengthening our footprint in the U.S. and contributing to the ecosystem’s growth by levering our nearly 40 years of experience impacting innovation and advanced product roadmaps through industry-relevant R&D,” stated Raj Jammy, president of operations, imec USA.