ASE announces Dr. William Chen is the 2022 recipient of IMAPS Daniel C. Hughes, Jr. Memorial Award - Seite 2
“Bill Chen is not only a prominent advocate for technology innovation and collaborative road mapping but has dedicated much of professional life to mentorship across the microelectronics ecosystem,” said Dr. Tien Wu, CEO, ASE, Inc. He continued, “It is altogether fitting that Bill should receive this recognition from the IMAPS community and all of us at ASE salute his accomplishment.”
“IMAPS is delighted to bestow this honor on Bill Chen, who continues to have significant impact within the IMAPS community especially related to his chairmanship of the Heterogeneous Integration Roadmap,” said Brian Schieman, Executive Director, IMAPS. He added, “This award is very well-deserved, and we are excited to recognize Bill in front of his peers in IMAPS and throughout our industry.”
One must be an IMAPS member in good standing for a minimum of five years to qualify for this Award. Recipients of this award automatically become Life Members and Fellows of the Society.
Supporting resources
- For more about ASE, please visit: https://www.ase.aseglobal.com
- For more about HIR, please visit: https://eps.ieee.org/technology/heterogeneous-integration-roadmap.html
- For more about IMAPS, please visit: https://www.imaps.org
- Follow ASE on LinkedIn for targeted updates and announcements: @aseglobal
- Follow ASE on Twitter: @aseglobal
About IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through premier professional events, an exclusive microelectronics packaging research library, local chapter networks, and other efforts. Founded in 1967 as ISHM, then merging with the International Electronic and Packaging Society (IEPS) in 1996, the Society has over 50 years of networking, education, and publication history.
About ASE, Inc.
Lesen Sie auch
ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing. and more. To learn about our advances in SiP, Fan out, MEMS & Sensor, Flip Chip, and, 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on Twitter: @aseglobal.
View source version on businesswire.com: https://www.businesswire.com/news/home/20221004005516/en/
The ASE Technology Holding Stock at the time of publication of the news with a raise of +1,83 % to 5,275USD on NYSE stock exchange (04. Oktober 2022, 16:32 Uhr).