TTM Technologies, Inc. announces the State of New York as the Selected Location for a Proposed New Facility in Syracuse to Produce Ultra-HDI PCBs in Support of National Security Requirements

SANTA ANA, Calif., Nov. 01, 2023 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ: TTMI) (“TTM”) announced that we have selected New York State as the location for a proposed new greenfield high-tech manufacturing facility. We began with an assessment of the entire contiguous United States, looking at all counties. That broad assessment was then narrowed to 27 markets in 16 states, and ultimately resulted in the selection of New York State after a rigorous competitive process that included 10 states. The selection of New York builds upon TTM’s long history as an industry partner in the State of New York, with 90 years of history on Long Island, and 56 years in Syracuse.

The planned investment aligns with New York State’s continued emphasis as a premier technology hub for U.S. electronics and the recent selection of Buffalo-Rochester-Syracuse (BRS) for the Federal Tech Hub designation. Central New York is well recognized for its highly skilled workforce, educational institutions, and a strong base of aerospace & defense companies, all elements contributing to TTM’s selection. TTM’s investment in this project will bring an estimated 400 good-paying manufacturing and engineering jobs to Central New York and will support an equal number of additional construction jobs during the development and construction of the facility.

The project reflects our support for cultivating an even stronger microelectronics ecosystem in New York and across the US Aerospace & Defense industrial base. The proposed facility will be a key contributor to the domestic microelectronics ecosystem, with a footprint planned to be adjacent to and at least as large or larger than the existing 160,000 square-foot RF/microwave and microelectronics facility in Syracuse, an integral part of the NYS microelectronics ecosystem since 1967.

It is expected that the proposed facility will bring disruptive capability for the domestic production of ultra-HDI (high density interconnect) PCBs in support of national security requirements. It is expected to be the highest-technology PCB manufacturing facility in North America, providing customers with reduced lead times and a significant increase in domestic capacity for ultra-HDI PCBs. In addition, this facility will be TTM’s most sustainable facility in North America.