TTM Technologies, Inc. announces the State of New York as the Selected Location for a Proposed New Facility in Syracuse to Produce Ultra-HDI PCBs in Support of National Security Requirements - Seite 2

Catherine Gridley, Executive Vice President and President of TTM’s Aerospace & Defense Sector, proudly stated, “We expect the investment and standup of this capability to be another step toward creating a secure, trusted, and resilient national microelectronic supply chain. Selecting Central New York for this proposed high-tech facility further demonstrates TTM’s support for New York State and the NY SMART-I Corridor, and continues to solidify TTM and Central New York’s place as a leader in microelectronics.”

Phil Titterton, Executive Vice President and Chief Operating Officer, commented, “Our selection of Syracuse for this new facility is not only a reflection of New York State, it is also a reflection of the talented men and women TTM currently employs in Central New York. Our workforce looks forward to welcoming talented new TTM’ers into the exciting new jobs we intend to create with this campus expansion.”

TTM is in the advanced stages of project planning, having identified the 24-acre property adjacent to its existing facility in Syracuse for the campus expansion. We have completed initial building designs and facility layout, and are now applying for the required permitting. The increase in campus size will also allow for additional capacity expansion already being considered for future phases of development.

Groundbreaking is anticipated in the first half of 2024, with the project's final scale, scope, and timeline subject to finalizing funding with various stakeholders. Phase one of the proposed project, including capital for campus-wide improvements is estimated to be $100 to $130 million, and is anticipated to run through 2026. TTM’s planned capital investment commitments will be determined after finalizing terms with various stakeholders.

“From Micron’s historic investment in the Town of Clay to TTM’s plans for a PCB plant in Syracuse, a global chip making hub is rising in Central New York,” Governor Hochul said, “TTM’s printed circuit boards sit at the cutting edge of chips technology, and thanks to New York’s robust chips ecosystem, partnerships with the Majority Leader and other stakeholders, and a bold commitment from the state, TTM is ready to join our thriving chips sector and bring an estimated 400 good-paying jobs Upstate. Companies like TTM are helping to strengthen New York’s reputation as a leader for growth, innovation, and national security, and I look forward to welcoming even more 21st-century businesses to our state as we continue to build the economy of tomorrow.”