ACM Research Announces Receipt of Purchase Order from a Large U.S. Manufacturer

FREMONT, Calif., Nov. 07, 2023 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced the receipt of a purchase order for its Ultra C b backside clean and bevel etch tool from a major U.S. semiconductor manufacturer. The tool is expected to be shipped to the prospective customer’s U.S. facility in the second quarter of 2024.

“We believe this new order from a large U.S. manufacturer underscores the strength of ACM’s technology and marks another key milestone in our international market expansion,” said ACM’s President and Chief Executive Officer, Dr. David Wang, CEO. “The tool combines backside cleaning and bevel etcher function and is in addition to the ongoing evaluation by this customer of two SAPS cleaning tools, and we believe this demonstrates a deepening relationship which we hope will result in demand for additional ACM tools. Furthermore, we expect this order to enhance ACM’s brand and to position us to attract new opportunities with other major global customers.”

About the Ultra C b Backside Clean and Bevel Etch Tool

ACM’s Ultra C b backside cleaning portfolio supports 200mm and 300mm wafers, pivotal in IC wafer manufacturing, wafer-level packaging, and the power device sector. Utilizing a unique contactless Bernoulli wafer chuck, it ensures the wafer's front side remains undamaged, delivering nitrogen gas to shield the device side from any chemical exposure. The system stands out for its superior particle performance, etch uniformity, and customization options, satisfying stringent undercut specifications on wafer bevels while maintaining a pin mark-free environment.

The Ultra C b excels in throughput, capable of handling over 300 wafers per hour for certain applications, and offers versatility through its precise chemical processes for silicon etching or film removal. It accommodates a wide range of substrates, including heavily doped, bonded, and ultra-thin wafers, even those with high warpage. Additionally, the tool's adaptability is enhanced with an optional non-contact robot for specialized wafer handling, reaffirming ACM's commitment to innovation and tailored semiconductor manufacturing solutions.