SkyWater Florida and Deca Technologies Announce $120M DOD Award to Expand Advanced Packaging Capabilities in Osceola County, Florida

SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, and Deca Technologies (Deca), a leading provider of advanced electronic interconnect technology, today announced the kick-off of a significant new Department of Defense (DOD) effort to expand domestic fan-out wafer level packaging (FOWLP) capabilities for both government and commercial customers. These capabilities will be made possible through the five-year DOD contract recently awarded to Osceola County and SkyWater Florida, which is expected to fund the facilitization, tooling and build-out of the Center for Neovation. With an expected value of $120 million over five years, the award includes options for an additional $70 million, for a total value of up to $190 million. SkyWater is the first domestic licensee of Deca’s M-Series and Adaptive Patterning solutions to support the reshoring of the semiconductor supply chain.

The first generation of Deca’s M-Series FOWLP is broadly adopted across multiple device technology nodes in leading smartphones. Deca’s Gen 2 M-Series delivers a powerful new heterogenous integration solution for designers and manufacturers by streamlining the design and assembly processes and providing additional flexibility for multi-chip architectures with sub 20µm pitch. The Gen 2 M-series provides advantages to many markets such as artificial intelligence, high-performance computing and other advanced applications, giving system architects limitless potential through reticle-free maskless digital lithography and the flexibility of a molded interposer layer.

Through SkyWater’s collaboration with Deca, embedded devices including active and passive bridge die, integrated passives and a powerful technology roadmap are planned. SkyWater will implement Deca’s Adaptive Patterning, the industry’s only real-time design-during-manufacturing capability, allowing designers to scale to unprecedented device interface density with wider process windows for robust manufacturability.

The award is part of the DOD’s Office of the Secretary of Defense (OSD’s) Re-shore Ecosystem for Secure Heterogeneous Advanced Packaged Electronics (RESHAPE) efforts, and directly supports the Biden-Harris Administration’s initiatives to strengthen America’s supply chains. This initiative is significant as less than 3% of semiconductor advanced packaging manufacturing takes place in the U.S., posing national security and economic risks for domestic businesses as chips go overseas for this critical step.