Media Alert

Rambus Presenting Sessions on Shaping the Next-Generation Data Center at DesignCon

Rambus Inc.

What:

 

DesignCon 2024

 

 

 

 

Who:

 

 

Rambus Inc. (Nasdaq: RMBS), a premier chip and silicon IP provider

 

 

 

 

Where:

 

 

Santa Clara Convention Center

 

 

 

Room: Great America 1

 

 

 

5001 Great America Pkwy

 

 

 

Santa Clara, CA 95054

 

 

 

 

When:

 

 

January 31, 2024. The first session begins at 8:00 a.m. PT

At DesignCon, technology experts from Rambus will be conducting a series of presentations on Wednesday, January 31. These will cover the selection and implementation of IP solutions for the data center, 5G/edge and IoT applications, including emerging technologies like DDR5, HBM3E, PCIe 6.1 and CXL 3.1 interfaces, quantum safe cryptography and VESA display stream compression.

Hear Steven Woo, fellow and distinguished inventor at Rambus, discuss, "Memory Systems for AI in the Data Center," exploring technologies that will power next-generation computing, including sophisticated Large Language Models (LLMs) and generative AI. Lou Ternullo, senior director of product marketing at Rambus, will investigate “How PCIe 6.1 and CXL 3.1 Interfaces Will Enable Next-Generation Data Centers” – or drop in on his later presentation diving into, “Meeting the Needs of AI Training with HBM3E.”