OSS Wins U.S. Intelligence AI Project for Liquid Immersion-Cooled Storage Server at the Edge

ESCONDIDO, Calif., March 12, 2024 (GLOBE NEWSWIRE) -- One Stop Systems, Inc. (Nasdaq: OSS), a leader in rugged high-performance compute (HPC) for artificial intelligence (AI), machine learning (ML) and sensor processing at the edge, has secured a pilot project to provide a liquid immersion-cooled data storage system for use on a deployable ground station. The project is expected to lead to follow-on production orders.

Procured through a global defense prime contractor, the win represents the first liquid immersion-cooled high-performance compute solution for a U.S. intelligence agency mobile ground station application and a new intelligence community end user for OSS.

The deployment will leverage OSS' unique rugged mobile edge technology, consisting of the company’s Gen 4 PCIe 3U-SDS configured as a high-speed NVMe data recording system that can deliver up to 52GB/s sustained storage bandwidth.

OSS will integrate two 3U-SDS units into a liquid immersion-cooled system which will be a part of a deployable ground station at the edge. The custom storage accelerator system will be ruggedized for the harshest of edge environments.

“This project, for a major government intelligence agency contracted through a prime contractor partner, represents expansion of our mission applications into the intelligence community, consistent with our growth strategies,” commented OSS VP of sales, Robert Kalebaugh. “It also demonstrates our commitment to provide high throughput, ruggedized storage capabilities and solutions that are directly impacting the AI/ML mission objectives of emerging Department of Defense platforms. We anticipate that this initial design win will lead to other deployments that require high speed, low latency compute accelerators and data acquisition solutions.”

The immersion-cooled technology solutions utilize non-conductive, chemically inert, non-corrosive fluids. These liquids are similar to water and fully immerse products like the 3U-SDS, where the liquid’s boiling point properties remove the heat from the electronics efficiently without the use of large heat sinks, fans, or liquid pumps. The absence of heat sinks allows for very compact rugged platforms and helps provide high performance, and low noise, in small form factors, which are key product features for the edge.