Infusion of Mesh Technology into Powerful Internet of Things (IoT) Generating Lucrative Market Opportunities - Seite 2

We are pleased to announce that we are moving to Stage B, which is our MESH network architecture performance evaluation. In this phase we will perform an in-depth analysis of the network performance by implementing sets of setups and configurations. We intend to simulate the system with a wide range of conditions and scenarios, reviewing the performance of the hardware and software. Finally, we will perform our MESH architecture validation, including state-machine implementation, payloads, characteristics analysis, interface code, firmware, and more.

"This is a significant stage for us, developing this new MESH technology" stated Danny Rittman, Gopher's Chief Technology Officer. "In Stage B we intend to produce Proof-of-Concept documents; including test cases for our MESH architecture and performance validation. With this data and a risk mitigation plan we intend to move into the system's design implementation stage."  The design, formulation, and implementation of our proposed MESH network is subject to a number of risks including raising appropriate capital to support the design and implementation of the network. The Company is looking forward to sharing additional developments with its shareholders in the future. Read this and more news for GOPH at http://www.marketnewsupdates.com/news/goph.html

In other industry related developments in the markets of note:

Pareteum Corporation (NYSE:TEUM) and iPass, Inc. (NASDAQ:IPAS), a leading provider of global mobile connectivity, announced recently the creation of a strategic partnership for collaboration in sales and marketing, and the development of new products and services that will address a broad range of mobility challenges. Mobile operators, enterprises and IoT providers are increasingly experiencing mobile data security risks, competitive cost and mobile carrier friction for end users that includes the lack of globally pervasive affordable Wi-Fi offload and connectivity for IoT devices.

Intel Corporation (NASDAQ: INTC) is entrenched in the mesh technology industry with its Intel® Xeon® Scalable processors that implement an innovative "mesh" on-chip interconnect topology that delivers low latency and high bandwidth among cores, memory, and I/O controllers. The mesh architecture where cores, on-chip cache banks, memory controllers, and I/O controllers are organized in rows and columns, with wires and switches connecting them at each intersection to allow for turns. By providing a more direct path than the prior ring architectures and many more pathways to eliminate bottlenecks, the mesh can operate at a lower frequency and voltage and can still deliver very high bandwidth and low latency.