EQS-News

Siltronic ends wafer production for 'small diameters'

EQS-News: Siltronic AG / Key word(s): Restructure of Company Siltronic ends wafer production for 'small diameters' 22.03.2024 / 14:34 CET/CEST The issuer is solely responsible for the content of this announcement. Press release

Siltronic AG
Einsteinstraße 172
81677 Munich
www.siltronic.com

 

Siltronic ends wafer production for "small diameters"

Munich, March 22, 2024 – Siltronic AG (MDAX/TecDAX: WAF) plans to gradually cease production of polished and epitaxial small diameter wafers at its Burghausen site. The process, which excludes unpolished wafers, is set to be completed in the course of 2025.

Siltronic currently produces wafers with a diameter of 300 mm, 200 mm and wafers with smaller diameters (SD) of up to 150 mm. The SD wafer technology was developed primarily in the 1990s and earlier. The most significant technological breakthroughs in recent decades have been achieved with larger diameters, which also show the highest growth potential. An average volume growth of 6 percent per year is expected for 300 mm wafers.

"SD wafer production at Siltronic originated in Burghausen in 1968. It has contributed to our success for many years, thanks to the outstanding work of our employees. However, the wafer industry has evolved significantly due to structural changes and innovations. Demand has increasingly shifted to wafers with larger diameters and improved properties, while SD wafers are approaching the end of their life cycle. This has led to a notable decline in volumes, which recently had a negative impact on earnings. As this will likely continue to intensify in the coming years, we have decided, together with the Supervisory Board, to gradually reduce the production of small diameters and to cease it in the course of 2025," comments Dr. Michael Heckmeier, CEO of Siltronic AG.

"Despite this decision the Burghausen site remains of crucial importance for Siltronic. Our global technology as well as research and development center, the production of 300 mm wafers and 200 mm hyperpure silicon ingots as well as a large part of our administrative functions are located here," Michael Heckmeier continues.