System-in-Package (SiP) Technology Market 2015-2022 - Global Strategic Business Report 2017 - 2.5D IC Packaging Technology Dominates SiP Market - Research and Markets - Seite 2
- Importance of SiP Technology in Electronics
- Rising Demand for High Performance and Compact Consumer Electronics Drive Growth
- List of Select SiP Solutions for Connected Devices
- Growing Demand for Smart, Energy Efficient Electronics Provides Business Case for SiP
- Growing Sales of Smartphones Bode Well for SiP Market
- Growing Demand for Tablet PCs
- Applications in Set Top Boxes Boosts Demand for SiP Technology
- Computing Devices
- IoT Opens New Growth Avenues for SiP
- TSVs for Die-to-Die/Die-to-Package Substrate Communication
- Advanced Nodes Demand Innovative Package Technologies
- PCB Considerations Vital for Using SiP in IoT Systems
- WLCSP for Compact Form Factors
- Trend Towards Smart Homes Offers Growth Opportunities
- Miniaturization of Electronics
- A Major Growth Driver for SiP
- Need for Compact and High Speed Performance Products Spurs Market Growth
- Shift in Direction towards More Than Moore's Law Benefits the SiP Market
- SMBs Spur the Adoption of SiP
3. TECHNOLOGY OVERVIEW
- System in Package (SiP): A Definition
- SiP Configurations, Features and Target Applications
- Development of SiP
- SiP Packaging
- Package-on-Package SiP
- Power Quad Flat No-Lead SiP
- Stacked Die SiP
- System-in-Package Land Grid Array
- SiP Benefits
4. RECENT INDUSTRY ACTIVITY
- Amkor Announces Product Qualification for SWIFT Packaging
- 3D Glass Solutions Collaborates with TE Connectivity
- Silicon Labs Introduces New Bluetooth SiP Module
- MediaTek Unveils SoCs for Fitness and Healthcare Devices
- Intel Launches Intel® Curie Module SiP
- Octavo Systems Launches OSD3358 SiP Device
- UTAC Collaborates with AT & S
- MediaTek Unveils New SiP Chipsets
- JCET Receives Order to Assemble SiP Modules for Apple
5. FOCUS ON SELECT GLOBAL PLAYERS
6. GLOBAL MARKET PERSPECTIVE
Total Companies Profiled: 51 (including Divisions/Subsidiaries 53)
- The United States (16)
- Japan (3)
- Europe (8)
- - France (4)
- - Rest of Europe (4)
- Asia-Pacific (Excluding Japan) (25)
- Middle East (1)
For more information about this report visit http://www.researchandmarkets.com/research/hcfb8c/systeminpackage
Media Contact:
Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call +1-917-300-0470
For U.S./CAN Toll Free Call +1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Diskutieren Sie über die enthaltenen Werte
Aktuelle Themen
Weitere Artikel des Autors
1 im Artikel enthaltener WertIm Artikel enthaltene Werte