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     593  0 Kommentare System-in-Package (SiP) Technology Market 2015-2022 - Global Strategic Business Report 2017 - 2.5D IC Packaging Technology Dominates SiP Market - Research and Markets - Seite 2


    • Importance of SiP Technology in Electronics
    • Rising Demand for High Performance and Compact Consumer Electronics Drive Growth
    • List of Select SiP Solutions for Connected Devices
    • Growing Demand for Smart, Energy Efficient Electronics Provides Business Case for SiP
    • Growing Sales of Smartphones Bode Well for SiP Market
    • Growing Demand for Tablet PCs
    • Applications in Set Top Boxes Boosts Demand for SiP Technology
    • Computing Devices
    • IoT Opens New Growth Avenues for SiP
    • TSVs for Die-to-Die/Die-to-Package Substrate Communication
    • Advanced Nodes Demand Innovative Package Technologies
    • PCB Considerations Vital for Using SiP in IoT Systems
    • WLCSP for Compact Form Factors
    • Trend Towards Smart Homes Offers Growth Opportunities
    • Miniaturization of Electronics
    • A Major Growth Driver for SiP
    • Need for Compact and High Speed Performance Products Spurs Market Growth
    • Shift in Direction towards More Than Moore's Law Benefits the SiP Market
    • SMBs Spur the Adoption of SiP

    3. TECHNOLOGY OVERVIEW

    • System in Package (SiP): A Definition
    • SiP Configurations, Features and Target Applications
    • Development of SiP
    • SiP Packaging
    • Package-on-Package SiP
    • Power Quad Flat No-Lead SiP
    • Stacked Die SiP
    • System-in-Package Land Grid Array
    • SiP Benefits

    4. RECENT INDUSTRY ACTIVITY

    • Amkor Announces Product Qualification for SWIFT Packaging
    • 3D Glass Solutions Collaborates with TE Connectivity
    • Silicon Labs Introduces New Bluetooth SiP Module
    • MediaTek Unveils SoCs for Fitness and Healthcare Devices
    • Intel Launches Intel® Curie Module SiP
    • Octavo Systems Launches OSD3358 SiP Device
    • UTAC Collaborates with AT & S
    • MediaTek Unveils New SiP Chipsets
    • JCET Receives Order to Assemble SiP Modules for Apple

    5. FOCUS ON SELECT GLOBAL PLAYERS

    6. GLOBAL MARKET PERSPECTIVE

    Total Companies Profiled: 51 (including Divisions/Subsidiaries 53)

    • The United States (16)
    • Japan (3)
    • Europe (8)
    • - France (4)
    • - Rest of Europe (4)
    • Asia-Pacific (Excluding Japan) (25)
    • Middle East (1)

    For more information about this report visit http://www.researchandmarkets.com/research/hcfb8c/systeminpackage

    Media Contact:

    Research and Markets
    Laura Wood, Senior Manager
    press@researchandmarkets.com

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    System-in-Package (SiP) Technology Market 2015-2022 - Global Strategic Business Report 2017 - 2.5D IC Packaging Technology Dominates SiP Market - Research and Markets - Seite 2 DUBLIN, May 26, 2017 /PRNewswire/ - Research and Markets has announced the addition of the "System-in-Package (SiP) Technology - Global Strategic Business Report" report to their offering. The report provides separate comprehensive analytics for …

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