Aehr Receives $4.3 Million Order for Initial FOX-XP Test Cell for Production Test of Mobile Sensor Devices - Seite 2

Features in the FOX-XP and DiePak that are critical to this application and the selection of this test solution include:

• Individually programmable voltage and current sources per device to meet critical electrical test requirements and accuracy 
• Continuous per DUT monitoring and data logging of voltage, current, and sensors internal to the device throughout the test and burn-in duration 
• 100% validation and confirmation of test results and burn-in conditions without any hostage failures (where a device fails and impacts another device under test) 
• 100% traceability of devices from industry-standard JEDEC trays through DiePak loading to testing through DiePak unloading and sorting 
• Production proven test and burn-in system via Aehr’s FOX-XP multi-wafer and singulated die/module system and DiePak carriers that are capable of testing up to 1024 devices per DiePak
• Fully automated loading and unloading via a FOX DiePak loader/unloader provided by Aehr in a turnkey solution

The FOX-XP system, available with multiple WaferPak^TM Contactors (full wafer test) or multiple DiePak Carriers (singulated die/module test) configurations, is capable of functional test and burn-in/cycling of integrated devices such as 2D and 3D sensors, flash memories, Gallium Nitride (GaN), magnetic sensors, microcontrollers, optical modules, Silicon Carbide (SiC) and other leading-edge ICs in either wafer formfactor, before they are assembled into single or multi-die stacked packages, or in singulated die or module formfactor.

Aehr’s FOX-XP test and burn-in systems utilize Aehr proprietary DiePak Carriers to enable burn-in of singulated die and multi-die modules to screen for defects in both the die and the module assembly processes. The resulting known-good die, multi-die or stacked-die packaged parts can then be used for high reliability and quality applications such as 5G communications, enterprise solid-state drives, automotive devices, highly valuable mobile applications, and other mission-critical integrated circuits and sensors.

About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has installed over 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test. Aehr Test has developed and introduced several innovative products, including the ABTS^TM and FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX-XP WaferPak Contactor, FOX DiePak Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The FOX-CP system is a new low-cost single-wafer compact test and reliability verification solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules. For more information, please visit Aehr Test Systems’ website at www.aehr.com.