131 0 Kommentare ACM Research Ships Its First 300mm, High-Temp Single-Wafer SPM Tool for Advanced Logic, DRAM and 3D-NAND Semiconductor Manufacturing - Seite 2

“ACM’s Tahoe platform sets the bar for mainstream regular temperature SPM performance with best-in-class environmental performance that uses a fraction of the chemical consumption of other approaches,” continued Dr. Wang. “More advanced production nodes increasingly require higher dose ion implantation. These higher doses harden the photoresist and demand higher temperature SPM for effective defect removal. ACM’s new Single-Wafer SPM tool addresses this need, combining high temperature support with an optimized process chamber. This allows ACM to overcome the hardened photoresist and organically remove, more quickly and effectively, defects after key process steps.”

The Single-Wafer SPM tool uses a unique multilevel gradient heating system to preheat sulfuric acid, which is then mixed with hydrogen peroxide to achieve super high temperatures. ACM’s chamber configuration supports additional chemicals and features a chemical in-line mix (CIM) system for dynamically setting the chemical mixing ratio and temperature in the process. The tool also brings to bear additional advanced options that can be incorporated into the process chamber, including ACM’s patented SAPS and TEBO megasonic cleaning technologies.

ACM has shipped two systems to China-based customers in 2021, one for 40nm-and-below logic process research and development and the other for memory process research and development. It has received new orders for the new Single-Wafer SPM tool from customers in China, with shipments currently expected to be made in early 2022. These tools will feature ACM’s megasonic cleaning method to expand the tool’s capabilities in 3D structure cleaning, such as through-silicon vias.

About ACM Research, Inc.

ACM develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing and thermal processes that are critical to advanced semiconductor device manufacturing as well as wafer-level packaging. The company is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield.

The ACM Research logo, SAPS and TEBO are trademarks of ACM Research, Inc. For convenience, these trademarks appear in this press release without a symbol, but that practice does not mean ACM will not assert, to the fullest extent under applicable law, its rights to the trademarks.